Abstract: A high-density pass-through filter apparatus slips over the terminal blade of a standard pass-through electrical connector within an opening in the bulkhead of an electronic module to which the connector is fastened. The filter apparatus retains a large number of axially oriented and axially terminated capacitive filter components which are electrically coupled at one end to the connector terminal and at the other end to a peripheral ring that resiliently engages the periphery of the bulkhead opening.

Abstract: An electronics assembly is provided having a substrate and at least one electronics package supported on the substrate. The electronics package also has electrical circuitry and first and second side surfaces. The assembly further includes a first heat sink device positioned in thermal communication with the first side surface of the electronics package, and a second heat sink device positioned in thermal communication with the second side surface of the electronics package.

Abstract: A power electronics module includes a heat sink and an electronic package having a first layer in direct thermal communication with the heat sink. At least one electronic component is disposed between the first layer and a second layer. A thermally conductive element is in direct thermal communication with the second layer and carries heat from a first portion of the second layer to a second portion of the second layer such that the heat is transferred from the second portion of the second layer to the heat sink through the first layer.

Abstract: An electronics assembly 10 is provided, including a housing 12 and at least one electronic power device 18 positioned within. A heat sink device 34 is positioned within the housing 12 and is in thermal communication with the electronic power device 18. The heat sink device 34 includes a fluid vessel 44, a fluid input port 50, a fluid output port 52, and at least one fin insert 60 brazed into the fluid vessel 44. The heat sink device 34 is in fluid communication with an automotive radiator 46 such that coolant 48 flows from the automotive radiator 46 through the fluid vessel 44 thereby cooling the electronic power device 18.

Abstract: An electrical interconnection lead pattern for connecting an integrated circuit to an electrical circuit comprises a plurality of electrical conductors and a plurality of non-continuous dielectric regions. Each conductor has a contact region wherein the conductor is subsequently electrically connected to a predetermined region on the integrated circuit. In addition, each of the contact regions are substantially parallel with respect to each and every other contact region. The dielectric regions comprise a material not amenable to soldering and are substantially parallel with respect to each and every other dielectric region so that the non-continuous regions between the dielectric regions are also substantially parallel. Lastly, the contact regions are substantially perpendicular with respect to each and every dielectric region, and disposed such that a portion of each of the contact regions contacts a portion of the non-continuous region between the dielectric regions and a portion of the dielectric region.