Abstract: A power distribution monitoring system is provided that can include a number of features. The system can include a plurality of power line sensing devices configured to attach to individual conductors on a power grid distribution network. In some embodiments, the power line sensors can include a split-core transformer. In some embodiments, a power line sensing device is disposed on each conductor of a three-phase network. The sensing devices can be configured to measure and monitor, among other things, current and electric-field on the conductors. Methods of installing, sealing, and protecting the split-core transformers of the power line sensors are also discussed.

Abstract: A power distribution monitoring system is provided that can include a number of features. The system can include a plurality of power line sensing devices configured to attach to individual conductors on a power grid distribution network. In some embodiments, the power line sensors can include a split-core transformer. In some embodiments, a power line sensing device is disposed on each conductor of a three-phase network. The sensing devices can be configured to measure and monitor, among other things, current and electric-field on the conductors. Methods of installing, sealing, and protecting the split-core transformers of the power line sensors are also discussed.

Abstract: A power distribution monitoring system is provided that can include a number of features. The system can include a plurality of power line sensing devices configured to attach to individual conductors on a power grid distribution network. In some embodiments, the power line sensors can include a split-core transformer. In some embodiments, a power line sensing device is disposed on each conductor of a three-phase network. The sensing devices can be configured to measure and monitor, among other things, current and electric-field on the conductors. Methods of installing, sealing, and protecting the split-core transformers of the power line sensors are also discussed.

Abstract: An apparatus, system, and method for applying a graphic or decal to a car window or other three-dimensional surface using a stretchable film and associated mounting frame is described. In some embodiments, a frame is mounted to the edge of a car window (or other target surface). The frame, which can be flexible or bendable, includes attachment points at various locations to facilitate attachment of a stretchable and/or shrinkable film to the frame. The film can include corresponding holes or other attachment openings, which generally align with the attachment points of the frame when the film is stretched (and/or shrunk) to conform to the shape of the frame (and, thus, the window).

Abstract: This invention relates to a die tool, a device and a method for producing, in particular embossing, a monolithic lens wafer that has a large number of microlenses.

Abstract: A method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method.

Abstract: A method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method.

Abstract: A device for producing a lens wafer with a plurality of microlenses with an upper die and a lower die for embossing of the lens wafer from a fluid embossing mass which has been delivered between the dies, curing means for curing of the embossed lens wafer, characterized in that at least one release element for detachment of the cured lens wafer prior to curing can be located between the lower die and the upper die.

Abstract: Device and method for producing a plurality of microlenses from a lens material. The method includes: applying lens material intended for the embossing of the microlenses to a plurality of first lens molds distributed on a first embossing side of a first die for embossing of the microlenses, moving the first die and a second die located essentially parallel, in an X-Y plane, and opposite the first die, on top of one another in a Z-direction running essentially perpendicular to the X-Y plane, embossing the microlenses by shaping and curing the lens material, the shaping taking place by moving the first and second embossing sides on top of one another, up to a thickness D1 of the lens material in the Z-direction, wherein the lens material of each microlens at least during curing is separate from the lens material of each microlens which is adjacent in the X-Y plane.

Abstract: This invention relates to a die tool, a device and a method for producing, in particular embossing, a monolithic lens wafer that has a large number of microlenses.

Abstract: This invention relates to a die tool, a device and a method for producing, in particular embossing, a monolithic lens wafer that has a large number of microlenses.

Abstract: A method and a device for producing a lens wafer which has a plurality of microlenses, as well as microlenses produced from the lens wafer.

Abstract: A method and a device for producing a lens wafer which has a plurality of microlenses, as well as microlenses produced from the lens wafer.

Abstract: A power distribution monitoring system is provided that can include a number of features. The system can include a plurality of power line sensing devices configured to attach to individual conductors on a power grid distribution network. In some embodiments, the power line sensors can include a split-core transformer. In some embodiments, a power line sensing device is disposed on each conductor of a three-phase network. The sensing devices can be configured to measure and monitor, among other things, current and electric-field on the conductors. Methods of installing, sealing, and protecting the split-core transformers of the power line sensors are also discussed.

Abstract: A power distribution monitoring system is provided that can include a number of features. The system can include a plurality of power line sensing devices configured to attach to individual conductors on a power grid distribution network. In some embodiments, the power line sensors can include a split-core transformer. In some embodiments, a power line sensing device is disposed on each conductor of a three-phase network. The sensing devices can be configured to measure and monitor, among other things, current and electric-field on the conductors. Methods of installing, sealing, and protecting the split-core transformers of the power line sensors are also discussed.

Abstract: A device for aligning a first surface of a first substrate with a second surface of a second substrate as the first and the second surfaces move toward each other across a gap. The device is comprised of: a first retaining system for retaining the first substrate on a first retaining surface; a second retaining system for retaining the second substrate on a second retaining surface; approach means for causing the first surface to approach the second surface in one direction of translation (T) toward an end position; and means for reducing a wedge error between the first and second surfaces during the approach of the first surface to the second surface including an in situ measurement during the approach of the substrates.

Abstract: A device for hot embossing of a magnetic nanoparticle (N)-containing polymer layer. The device includes an embossing die, a pressure application means and a magnetic field generating means. The embossing die and the pressure application means are made from materials that do not respond thermally to a magnetic field.

Abstract: A device for producing a lens wafer with a plurality of microlenses with an upper die and a lower die for embossing of the lens wafer from a fluid embossing mass which has been delivered between the dies, curing means for curing of the embossed lens wafer, characterized in that at least one release element for detachment of the cured lens wafer prior to curing can be located between the lower die and the upper die.

Abstract: A method and a device for producing a lens wafer which has a plurality of microlenses, as well as microlenses produced from the lens wafer.

Abstract: A method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method.