Abstract: A memory includes a wafer having at least a first and second edge, at least one memory bank array, a data path, and a plurality of data pads. The data path is coupled to the memory bank array. The plurality of data pads are coupled to the data path and configured with the data path to bus data to and from the memory bank array. The data pads are further configured such that each of the data pads are located adjacent the first and second edges of the wafer. The memory component is configurable for alternative applications such that in a first application all of the data pads used to bus data are located only on the first edge of the wafer and such that in a second application at least one of the data pads used to bus data is located on the first edge of the wafer and at least one of the data pads used to bus data is located on the second edge of the wafer.

Abstract: A semiconductor integrated circuit memory device, and test method for a memory device are provided in which an external wordline voltage is applied to a wordline of the memory device. A current on the wordline is measured as a result of application of the externally supplied wordline voltage. The measured current is compared to a reference value to determine whether the wordline has a defect, in particular a short-circuit defect. A tester device is connected to the memory device and supplies the external wordline voltage. The current measurement and comparison may be made internally by circuitry on the memory device or externally by circuitry in a tester device.

Abstract: Information concerning a condition of a fuse is stored in a latch circuit and may be corrected. A first signal is supplied to the latch circuit which sets the latch circuit in a first state when the fuse is in a first condition and keeps the latch circuit unchanged when the fuse is in a second condition. While the first signal is being supplied, a second signal is supplied to the latch circuit that keeps the latch circuit in the first state when the fuse is in the first condition and sets the latch circuit in a second state when the fuse is in the second condition.

Abstract: A pre-charge circuit for a memory device having a sense amplifier shared between right and left banks of memory cells and a method of pre-charging the shared sense amplifier. The circuit is operated according to the method of the invention such that the sense amplifier is always pre-charged from the side that was previously active. The circuit includes right and left bank isolation transistor pairs connected between the shared sense amplifiers and the right and left banks. The isolation transistor pairs are controlled by a flip flop having a left bank state and a right bank state and complementary left and right outputs that turn off the left isolation transistor pair and turn on the right pair during row operations to the right and vice-versa.

Abstract: A pre-charge circuit for a memory device having a sense amplifier shared between right and left banks of memory cells and a method of pre-charging the shared sense amplifier. The circuit is operated according to the method of the invention such that the sense amplifier is always pre-charged from the side that was previously active. The circuit includes right and left bank isolation transistor pairs connected between the shared sense amplifiers and the right and left banks. The isolation transistor pairs are controlled by a flip flop having a left bank state and a right bank state and complementary left and right outputs that turn off the left isolation transistor pair and turn on the right pair during row operations to the right and vice-versa.

Abstract: The present invention relates generally to protection of integrated circuits from electrostatic discharges and more specifically to the use of devices formed in isolated well regions for electrostatic discharge protection. One aspect of the present invention is an ESD protection circuit that includes a first FET and a second FET. The drain of the first FET is coupled to an ESD susceptible node and the source of the first FET is coupled to a first voltage terminal. The gate and a well of the first FET are coupled together and to the drain of the second FET. The source of the second FET is coupled to the first voltage terminal. The gate of the second FET is coupled to a second voltage terminal. The second voltage terminal is connected to a voltage source that is at the first voltage when the circuit is not powered, and at a voltage above the threshold voltage of the second FET when the circuit is powered. The well in which the first FET is formed is electrically isolated from other wells in the substrate.