Abstract: The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting resin, curing catalyst, and surface-treated nanoparticles that are substantially spherical, non-agglomerated, amorphous, and solid.

Abstract: The invention provides an adhesive composition which is useful for electronic assembly comprising a photopolymerizable acrylic resin containing polymerizable acrylate, a moisture-curable resin including an alkoxy or acyloxy silane terminated polymer, a photoinitiator for initiating polymerization of the acrylate, and a photoacid generator for catalyzing a moisture curing reaction of the alkoxy or acyloxy silane terminated polymer. Also provided are assemblies including such adhesives, such as electronic assemblies and radio frequency identification tags.

Abstract: The invention provides anisotropically conductive adhesive compositions, which comprise a mixture of a multifunctional glycidyl ether epoxy resin, a phenoxy resin, a core-shell polymer, optionally a thermoplastic resin, a thermally activated curing agent, and electrically conductive particles.

Abstract: A cationically curable composition comprises (a) at least one cationically curable species; (b) at least one cationic photoinitiator; and (c) at least one encapsulated, polymer-bound base.

Abstract: The invention relates to a plug-in coupling for pipes which comprises a base (2) relative to which a pipe end (60) can be fixed and which can be partially inserted into the pipe end (60). The coupling comprises a sealing element (8), a sleeve (4) linked with the base (2) and a retaining element (6) comprising retaining claws (12) for fixing the pipe end (60) which is disposed in the interior of the sleeve (4). An annular gap (10) is configured between the base (2) and the sleeve (4) and receives the pipe end (60). The aim of the invention is to provide, while reducing production and assembly costs, a plug-in coupling of the aforementioned type which ensures a durable and reliable connection and prevents the pipe end from being damaged and the retaining claws (12) from penetrating the pipe end (60) too deeply. For this purpose, the retaining element (6) comprises a closed annular part (44) and is integrated into the sleeve (4) and fixed therein with said part.

Abstract: The invention provides anisotropically conductive adhesive compositions which comprise a mixture of: a cycloaliphatic epoxide resin; an omega hydroxyl ester-modified phenoxy resin; optionally, a multifunctional glycidyl ether epoxide resin; optionally, a thermoplastic resin; thermally activated catalyst; and electrically conductive particles.

Abstract: A cationically curable composition comprises (a) at least one cationically curable species; (b) at least one cationic photoinitiator; and (c) at least one encapsulated, polymer-bound base.

Abstract: A method of laminating a structure comprises at least two layers and a photopolymerizable adhesive composition between the layers, at least one of the layers being opaque, colored, or reflective. One or both of the layers is transmissive to actinic radiation in wavelengths in the range of greater than 400 nm and up to 1200 nm. The photopolymerizable adhesive composition absorbs radiation in the identified spectral region of the radiation transmissive layer. Curing is effected by directing radiation in the identified spectral region through the radiation transmissive layer and produces a laminated structure.

Abstract: An annular disk for flexible shaft couplings is described, whose two coupling halves each exhibiting a connection flange are connected to each other via a packet of such annular disks in a torsionally rigid manner, but in such a way as to enable their axial and angular movement. The annular disk has four attachment holes uniformly distributed on a shared hole circle, wherein the section is tapered between two adjacent attachment holes. The annular disk according to the invention satisfies the following size ratios: Dt/D1=10 to 12, D2/Dt=1.1 to 1.2, Dt/B1=9 to 16, and B2/Dt=0.88 to 0.93, wherein Dt is the diameter of the hole circle, D1 is the diameter of the respective attachment hole, D2 is the largest outside diameter of the annular disk, B1 is the width of the narrowest part of the annular disk section between two consecutive attachment holes, and B2 is the width of the annular disk outer contour.

Abstract: A method of laminating a structure comprises at least two layers and a photopolymerizable adhesive composition between the layers, at least one of the layers being opaque, colored, or reflective. One or both of the layers is transmissive to actinic radiation in wavelengths in the range of greater than 400 nm and up to 1200 nm. The photopolymerizable adhesive composition absorbs radiation in the identified spectral region of the radiation transmissive layer. Curing is effected by directing radiation in the identified spectral region through the radiation transmissive layer and produces a laminated structure. An underfilled flip chip assembly on an integrated circuit board substrate can be prepared by the method described above.

Abstract: Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin oligomer, a reactive diluent, and a curative. The form-in-place gasket, after curing, has a level of total outgassing components of about 10 &mgr;g/g to about 45 &mgr;g/g. The curative responds to actinic radiation and heat, and may contain a photoinitiator. Optionally a photocurable, form-in-place gasket according to the present invention further comprises a thixotropic filler in an amount from about 8.0 wt. % to about 12.0 wt. %, and preferably comprises a fumed silica.

Abstract: A thermomechanical-shock-resistant cured composition for solventless, hydrophobic resin encapsulation of electronic components having a glass transition temperature below 0° C. and containing a non-silicone oligomer including a flexible hydrocarbon backbone with reactive functionality, up to about 40% by weight of an adhesion promoter, and a optional viscosity-modifying component.

Abstract: An adhesive transfer tape including an embossed carrier web having recesses embossed therein and a curable adhesive precursor coated into the recesses is disclosed.

Abstract: The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting resin, curing catalyst, and surface-treated nanoparticles that are substantially spherical, non-agglomerated, amorphous, and solid.

Abstract: An annular disk for flexible shaft couplings is described, whose two coupling halves each exhibiting a connection flange are connected to each other via a packet of such annular disks in a torsionally rigid manner, but in such a way as to enable their axial and angular movement. The annular disk has four attachment holes uniformly distributed on a shared hole circle, wherein the section is tapered between two adjacent attachment holes.

Abstract: The present invention provides for a chelate fluxing agent, its use in fluxing compositions, and its use in soldering methods. The fluxing agents as described herein, when combined with a resin such as thermosetting resins, thermoplastic resins or a combination thereof, afford compositions suitable for use as underfill adhesives. The present invention also provides for an electrical component assembly and methods for producing an electrical component assembly including such underfill adhesive compositions.

Abstract: An annular disk for flexible shaft couplings is described, whose two coupling halves each exhibiting a connection flange are connected to each other via a packet of such annular disks in a torsionally rigid manner, but in such a way as to enable their axial and angular movement. The annular disk has four attachment holes uniformly distributed on a shared hole circle, wherein the section is tapered between two adjacent attachment holes. The annular disk according to the invention satisfies the following size ratios: Dt/D1=10 to 12, D2/Dt=1.1 to 1.2, Dt/B1=9 to 16, and B2/Dt=0.88 to 0.93, wherein Dt is the diameter of the hole circle, D1 is the diameter of the respective attachment hole, D2 is the largest outside diameter of the annular disk, B1 is the width of the narrowest part of the annular disk section between two consecutive attachment holes, and B2 is the width of the annular disk outer contour.

Abstract: The invention provides adhesives and adhesive compositions that comprise epoxy resin and non-volatile anhydride. One embodiment further comprises a hydroxyl containing compound that is insoluble in the epoxy resin/anhydride blend at mixing temperatures which reacts with the anhydride at solder reflow temperatures to form a fluxing agent in-situ. Another embodiment further comprises catalyst.

Abstract: Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin oligomer, a reactive diluent, and a curative. The form-in-place gasket, after curing, has a level of total outgassing components of about 10 &mgr;g/g to about 45 &mgr;g/g. The curative responds to actinic radiation and heat, and may contain a photoinitiator. Optionally a photocurable, form-in-place gasket according to the present invention further comprises a thixotropic filler in an amount from about 8.0 wt. % to about 12.0 wt. %, and preferably comprises a fumed silica.

Abstract: A method of laminating a structure comprises at least two layers and a photopolymerizable adhesive composition between the layers, at least one of the layers being opaque, colored, or reflective. One or both of the layers is transmissive to actinic radiation in wavelengths in the range of greater than 400 nm and up to 1200 nm. The photopolymerizable adhesive composition absorbs radiation in the identified spectral region of the radiation transmissive layer. Curing is effected by directing radiation in the identified spectral region through the radiation transmissive layer and produces a laminated structure.