Abstract: A pad for processing substrates such as a pad for CMP and methods of using the pad: the pad is capable of allowing the substrate to be optically monitored during the process. In one embodiment, at least a portion of the pad includes an optical filter for attenuating optical noise so that optical signals used for monitoring the substrate provide a more accurate representation of the process status. The optical filter is capable of transmitting the optical signal while reducing the amount of optical noise. In another embodiment, the surface of the filter is recessed from the polishing surface of the pad so that the filter surface is subjected to less abrasion during polishing processes and during pad conditioning.

Abstract: A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be passively rotated by contact with the polishing pad, or actively reciprocated, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.

Abstract: A technique for integrating a film thickness monitoring sensor within a load and unload unit of a cluster tool for performing chemical-mechanical polishing (CMP). In order to determine CMP performance, a sensor (or sensors) for determining film thickness is/are integrated within the load and unload unit of the cluster tool. Accordingly, film thickness measurements can then be taken at discrete times during the processing cycle without removing the wafer from the cluster tool.

Abstract: A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be passively rotated by contact with the polishing pad, or actively reciprocated, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.