Patents by Inventor Michael A. Lindemann

Michael A. Lindemann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC DEVICES COMPRISING A STACK STRUCTURE, A SOURCE CONTACT, AND A DIELECTRIC MATERIAL
    Publication number: 20240162325
    Abstract: Electronic devices comprising a doped dielectric material adjacent to a source contact, tiers of alternating conductive materials and dielectric materials adjacent to the doped dielectric material, and pillars extending through the tiers, the doped dielectric material, and the source contact and into the source stack. Related methods and electronic systems are also disclosed.
    Type: Application
    Filed: January 24, 2024
    Publication date: May 16, 2024
    Inventors: Michael A. Lindemann, Collin Howder, Yoshiaki Fukuzumi, Richard J. Hill
  • Electronic devices comprising a dielectric material, and related systems and methods
    Patent number: 11948992
    Abstract: Electronic devices comprising a doped dielectric material adjacent to a source contact, tiers of alternating conductive materials and dielectric materials adjacent to the doped dielectric material, and pillars extending through the tiers, the doped dielectric material, and the source contact and into the source stack. Related methods and electronic systems are also disclosed.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: April 2, 2024
    Assignee: Micron Technology, Inc .
    Inventors: Michael A. Lindemann, Collin Howder, Yoshiaki Fukuzumi, Richard J. Hill
  • ELECTRONIC DEVICES COMPRISING A DIELECTRIC MATERIAL, AND RELATED SYSTEMS AND METHODS
    Publication number: 20220238684
    Abstract: Electronic devices comprising a doped dielectric material adjacent to a source contact, tiers of alternating conductive materials and dielectric materials adjacent to the doped dielectric material, and pillars extending through the tiers, the doped dielectric material, and the source contact and into the source stack. Related methods and electronic systems are also disclosed.
    Type: Application
    Filed: January 26, 2021
    Publication date: July 28, 2022
    Inventors: Michael A. Lindemann, Collin Howder, Yoshiaki Fukuzumi, Richard J. Hill