Abstract: An apparatus is disclosed including an electrical conductor and an electrically conductive, compliant bump formed on the electrical conductor. The compliant bump includes an electrically conductive, solderable capping layer and an electrically conductive, compliant body positioned between the solderable capping layer and the electrical conductor. The compliant body electrically couples the solderable capping layer to the electrical conductor. The electrical conductor may be, for example, an input/output (I/O) pad of the apparatus, and the compliant bump may form an electrical terminal of the apparatus. The compliant body forms a mechanically flexible, electrically conductive path between the solderable capping layer and the electrical conductor. The compliant bump deforms elastically when subjected to a force exerted between the solderable capping layer and the electrical conductor, allowing the compliant bump to form a highly reliable connection between the apparatus and an external element.

Abstract: An apparatus is disclosed including an electrical conductor and an electrically conductive, compliant bump formed on the electrical conductor. The compliant bump includes an electrically conductive, solderable capping layer and an electrically conductive, compliant body positioned between the solderable capping layer and the electrical conductor. The compliant body electrically couples the solderable capping layer to the electrical conductor. The electrical conductor may be, for example, an input/output (I/O) pad of the apparatus, and the compliant bump may form an electrical terminal of the apparatus. The compliant body forms a mechanically flexible, electrically conductive path between the solderable capping layer and the electrical conductor. The compliant bump deforms elastically when subjected to a force exerted between the solderable capping layer and the electrical conductor, allowing the compliant bump to form a highly reliable connection between the apparatus and an external element.

Abstract: A semiconductor device (e.g., a chip scale package or CSP) is described including multiple input/output (I/O) pads arranged on a surface of a semiconductor substrate, a compliant dielectric layer, an outer dielectric layer, and multiple electrically conductive, compliant interconnect bumps (i.e., compliant bumps). The compliant bumps may form electrical terminals of the semiconductor device. The compliant dielectric layer is positioned between the outer dielectric layer and the surface of the semiconductor substrate. The outer dielectric layer and the compliant dielectric both have multiple openings (i.e., holes) extending therethrough. Each of the compliant bumps is formed upon a different one of the I/O pads, and extends through a different one of the openings in the first compliant dielectric layer and the outer dielectric layer. Each of the compliant bumps includes an electrically conductive, compliant body, and an electrically conductive, solderable conductor element.

Abstract: Organopolysiloxane compositions which cure by the addition reaction of silicon-bonded lower alkenyl radicals with silicon-bonded hydrogen atoms and which exhibit improved adhesion to a variety of substrates. The compositions comprise an adhesion promoting mixture comprising an epoxy-functional compound, a compound having at least one hydroxy group and in the same molecule at least one substituent selected from a group consisting of silicon hydride, alkenyl, and acryl, and an aluminum compound or zirconium compound. Compression set of the cured organopolysiloxane compositions is not significantly effected by the adhesion promoting mixture.

Abstract: Adhesion-promoting additives for use in curable organosiloxane compositions comprise 1) at least one organosiloxane comprising a) silicon bonded hydrogen atoms and/or ethylenically unsaturated substituents bonded to silicon through carbon and b) at least one silicon atom containing three hydrolyzable groups, and 2) at least one silane containing four alkoxy or enoloxy groups or three of these groups and a hydrocarbon radical containing an epoxy or ethylenically unsaturated group as a substituent.

Abstract: The present invention relates to a silicone pressure-sensitive adhesive composition which cure upon exposure to ambient moisture. The moisture-curable silicone pressure-sensitive adhesive composition of the instant invention comprise:(A) an organopolysiloxane resin containing curing radicals of the formula --SiY.sub.2 ZNY'ZSiR.sup.1.sub.x Y".sub.3-x wherein R.sup.1 is a monovalent hydrocarbon radical, each Z is a divalent linking group, each Y is independently selected from the group consisting of a monovalent organic radical, an enoloxy radical, an alkoxy radical, and an oximo radical; Y' is selected from the group consisting of a monovalent organic radical, a hydrogen atom, and --ZSiR.sup.1.sub.x Y".sub.

Abstract: The novel organosiloxane compounds of the present invention are characterized by the presence of 1) a silicon atom containing at least two alkoxy or other hydrolyzable groups and the group --OR.sup.1 Si.dbd. wherein R.sup.1 represents a divalent organic group comprising carbon, hydrogen, and, optionally, oxygen, and 2) a silicon bonded hydrogen atom or alkenyl radical. A preferred method for preparing the compounds is by the reaction of 1) a silane containing a silicon-bonded alkenyloxy group and at least two silicon-bonded hydrolyzable groups or a precursor of said hydrolyzable groups and 2) an organohydrogensiloxane. The reaction is conducted in the presence of a hydrosilation catalyst.

Abstract: The present invention relates to organosiloxane compositions that are reaction products of 1) a silane containing at least 3 hydrolyzable groups per molecule, 2) a monohydric or polyhydric alcohol containing at least one organofunctional group and 3) a polyhydric alcohol containing no organofunctional groups or ethylenic unsaturation, wherein said reaction products contain at least two silicon atoms. The organosiloxane compositions are particularly useful as adhesion promoting additives for curable organosiloxane compositions, particularly those that cure by a platinum group metal-catalyzed hydrosilation reaction.

Abstract: The present invention provides organosiloxane copolymers comprising SiO.sub.4/2 units, silicon-bonded hydrolyzable groups, epoxy or acryloxyalkyl groups and silicon-bonded hydrogen atoms. The copolymers are particularly useful as adhesion promoting additives in organosiloxane compositions that cure by a platinum group metal-catalyzed hydrosilation reaction at temperatures up to 100.degree. C.

Abstract: The presence in curable organosiloxane compositions of a specified group of hydrocarbyloxy-substituted organosilicon compounds and condensation products of these compounds imparts cohesive bonding to a variety of substrates during curing of the compositions. At least one hydrocarbyloxy group on each silicon atom is derived from an alcohol containing at least two hydroxyl groups per molecule and the remaining hydrocarbyloxy groups are alkoxy. The adhesion additives are particularly effective for compositions cured at temperatures up to 100.degree. C.

Abstract: Adhesion additives for curable organosiloxane compositions comprise (I) a silane containing at least one alkoxy or enoloxy group, the remaining valences of the silicon atom being satisfied by groups bonded to silicon through oxygen and containing at least one H.sub.2 C.dbd.CR-- radical, where R is hydrogen or monovalent hydrocarbon, and (II) at least one organosilicon compound comprising (a) at least one group capable of participating in a hydrosilation reaction, and (b) at least one silicon-bonded alkoxy, enoloxy or silanol group.

Abstract: The catalyst inhibitors of the present invention react with conventional platinum group metal-containing hydrosilation catalysts to from complexes that delay curing of compositions containing these complexes in the absence of oxygen and SiH-reactive hydroxylated compounds; the compositions comprise (1) curable compounds containing alkenyl radicals and/or silicon-bonded hydroxyl groups, (2) curing agents containing silicon-bonded hydrogen atoms, and (3) a platinum group metal-containing hydrosilation catalyst. Preferred inhibitors provide long term storage stability.

Abstract: The present invention utilizes a class of novel hydrosilation catalysts that are inhibited in the absence of molecular oxygen to prepare storage stable, one part curable compositions containing (1) compounds with alkenyl radicals and (2) compounds with silicon-bonded hydrogen atoms. The compositions are stable until exposed to molecular oxygen, at which time they cure in the same manner as conventional compositions containing these ingredients.

Abstract: Catalyst compositions suitable for use in one-part storage stable organosiloxane compositions that cure by a platinum-catalyzed hydrosilation reaction are prepared by blending a liquid complex of a platinum group metal compound and an ethylenically unsaturated organosiloxane compound with an alkylenediamine, and then combining the resultant mixture with an acetylenic alcohol. The catalyst compositions also contain at least one organohydrogensiloxane that is present prior to or during blending of said alkylene diamine with said acetylenic alcohol.

Abstract: The heat stability of acrylamide functional polydiorganosiloxanes which cure by exposure to ultraviolet radiation can be improved by the addition of nickel carboxylate, stannous naphthenate, cerium carboxylate, manganese carboxylate, aluminum carboxylate, silver carboxylate, copper undecylenate, cobalt carboxylate, mono(methacrylate) tripropoxyzirconate, mono(ethylacetoacetonate) aluminum di-(sec-butoxide), di-(ethylacetoacetonate) aluminum sec-butoxide, zinc acetylacetonate, molybdenum acetylacetonate, and dibutyltin dicarboxylate.

Abstract: The electrical conductivity of organosiloxane compositions containing high loadings of finely divided silver particles coated with an esterified fatty acid is superior relative to the conductivity of compositions containing silver particles that are either uncoated or coated with prior art treating agents, including free fatty acids.

Abstract: An adhesion promoter for use with ultraviolet radiation curable siloxane composition is made by combining an alkoxysilicon compound of the formula(RO).sub.3 Si--X--Si(OR).sub.3and a compound capable of catalyzing the reaction between two alkoxy groups or an alkoxy group and a hydroxyl group. Ultraviolet radiation curable siloxane compositions with the improved adhesion are obtained by mixing the adhesion promoter with a mixture which has at least one ultraviolet radiation activatable siloxane polymer and a photoinitiator. These compositions can be used as optical fiber coatings, conformal coatings, and other coating application where adhesion to a substrate is important.

Abstract: Compositions which cure by UV radiation in less than one second are obtained by mixing an alkenyl containing polydiorganosiloxane, a mercapto functional crosslinker of the mercapto functional polyorganosiloxane or mercapto organic compounds, a photosensitizer, a viscosity stabilizer, and optionally a reinforcing agent. These compositions can be packaged in one container and can be used as the primary coating for optical fibers.

Abstract: Compositions which cure by UV radiation in less than one second are obtained by mixing an alkenyl containing polydiorganosiloxane, a mercapto functional crosslinker of the mercapto functional polyorganosiloxane or mercapto organic compounds, a photosensitizer, a viscosity stabilizer, and optionally a reinforcing agent. These compositions can be packaged in one container and can be used as the primary coating for optical fibers.

Abstract: Compositions which cure by UV radiation in less than one second are obtained by mixing an alkenyl containing polydiorganosiloxane, a mercapto functional crosslinker of the mercapto functional polyorganosiloxane or mercapto organic compounds, a photosensitizer, a viscosity stabilizer, and optionally a reinforcing agent. These compositions can be packaged in one container and can be used as the primary coating for optical fibers.