Patents by Inventor Michael A. Marrs

Michael A. Marrs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of providing a flexible semiconductor device and flexible semiconductor device thereof
    Patent number: 9721825
    Abstract: Some embodiments include a method. The method can include providing a carrier substrate having an edge. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate having an edge. Further still, the method can include coupling the flexible substrate to the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive. Other embodiments of related methods and devices are also disclosed.
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: August 1, 2017
    Assignee: ARIZONA BOARD OF REGENTS, A BODY CORPORATE OF THE STATE OF ARIZONA, ACTING FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY
    Inventors: Michael A. Marrs, Emmett M. Howard, Douglas E. Loy, Nicholas Munizza
  • METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF
    Publication number: 20160225653
    Abstract: Some embodiments include a method. The method can include providing a carrier substrate having an edge. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate having an edge. Further still, the method can include coupling the flexible substrate to the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive. Other embodiments of related methods and devices are also disclosed.
    Type: Application
    Filed: April 12, 2016
    Publication date: August 4, 2016
    Applicant: Arizona Board of Regents, a Body Corp. of the State of AZ Acting for and on Behalf of AZ State U
    Inventors: Michael A. Marrs, Emmett M. Howard, Douglas E. Loy, Nicholas Munizza
  • DUAL ACTIVE LAYERS FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20140008651
    Abstract: Some embodiments include dual active layers for semiconductor devices. Other embodiments of related devices and methods are also disclosed.
    Type: Application
    Filed: September 17, 2013
    Publication date: January 9, 2014
    Applicant: Arizona Board of Regents, a body corporate of the State of Arizona Acting for and on behalf of Arizo
    Inventor: Michael A. Marrs