Abstract: A liquid desiccant regenerator configured to produce a first output stream with a higher concentration of a liquid desiccant than a first input stream. The regenerator also produces a second output stream with a lower concentration of the liquid desiccant than a second input stream. Regeneration of the liquid desiccant in the liquid desiccant regenerator decreases a temperature of the liquid desiccant regenerator. The system includes an air contactor coupled to the first output stream and exposing an input air stream to the first output stream. The first output stream absorbs water from the input air stream to form at least one diluted output desiccant stream. A heat pump of the system is thermally coupled to move the heat from the first output stream to the liquid desiccant regenerator. The heat moved to the liquid desiccant regenerator increases an efficiency of the liquid desiccant regenerator.

Abstract: A system and method for cloning files to a plurality of client systems simultaneously over a network. Client PCs are booted to a server as “diskless clients”. Each client then executes configuration scripts that prepare mass storage devices to which the clients are connected for downloading a file or files from the server. Any type of file, including an operating system file or applications code, can be downloaded to the mass storage device. The mass storage device can be rendered bootable, should that be an appropriate action for the files that are downloaded. Configuration and log files are stored on the server for each cloned client.

Abstract: An on-board chip package has a hermetically sealed connector mechanically secured to a printed wiring board and electrically connected to input/output pads on the board. Chip dies are mechanically bonded to the board and then individually encapsulated with a suitable potting material. The entire assembly is coated with an encapsulating polymer, which partially overlaps the inboard side of the hermetic connector housing and which provides a relatively smooth, crevice-free outer surface. The entire assembly is then covered, in the preferred embodiment, with a metal layer, to hermetically seal the entire chip-on-board assembly.

Abstract: A process of manufacturing a flexible metallized polymer film cover which provides environmental protection of electronic assemblies such as circuit card assemblies which are susceptible to external environmental factors which can impede functional performance and reduce reliability. The use of a metallized polymer film in the form of a two layer film, with two intimately bonded layers one being electrically insulative and the other metallic, provides environmental and electrical protection of the enclosed assembly.

Abstract: A flexible metallized polymer film cover provides environmental protection of electronic assemblies such as circuit card assemblies which are susceptible to external environmental factors which can impede functional performance and reduce reliability. The fully integrated cover provides this protection and also allows for circuit repair and rework in such a manner as to make cover removal and reseal economically attractive. The use of a metallized polymer film in the form of a two layer film, with two intimately bonded layers one being electrically insulative and the other metallic, provides environmental and electrical protection of the enclosed assembly. The variables of film materials and thicknesses allow for specific cover designs to be fabricated to meet various requirements for assembly protection. The flexible film nature of the cover allows for strict conformance to underlying devices and less dimension and weight for the assembly.