Abstract: An automatic laser trimming apparatus (30) for semiconductor integrated chip packages removes dambars (16) and performs deflashing and degating operations. The apparatus combines a laser machining subsystem (32, 36) with a machine vision subsystem (38, 40) to accurately locate and treat the dambars on an integrated circuit package. A defocusing lens (54) is used to attenuate the intensity of the laser beam (34) to permit a single laser to perform both the dambar removal and deflashing operations. In addition, an improved fixture (46) is provided to enhance the removal of smoke and debris from the processing station and to provide improved backlighting thereby enhancing resolution.

Abstract: An integrated circuit package includes a plurality of TAB assemblies, each including a portion for inner lead bonding an integrated circuit. A portion of the tape is formed to allow the tape to be outer lead bonded to the substrate so that the integrated circuit is mounted at any desired non zero angle with respect to a horizontal substrate. A plurality of formed tape units are outer lead bonded to a horizontal substrate. In one embodiment, the die is inner lead bonded to the tape in an area which is not devoid of tape, allowing electrical traces on the tape which are routed above and not in contact with the surface of the die, thereby providing excellent routing density. The dielectric tape may include a single electrical interconnect layer, or a plurality of electrical interconnect layers which may themselves be electrically interconnected via suitable vias formed within the tape structure.

Abstract: An automatic laser trimming apparatus (30) for semiconductor integrated chip packages removes dambars (16) and performs deflashing and degating operations. The apparatus combines a laser machining subsystem (32, 36) with a machine vision subsystem (38, 40) to accurately locate the treat and dambars on an integrated circuit package. A defocusing lens (54) is used to attenuate the intensity of the laser beam (34) to permit a single laser to perform both the dambar removal and deflashing operations. In addition, an improved fixture (46) is provided to enhance the removal of smoke and debris from the processing station and to provide improved backlighting thereby enhancing resolution.