Abstract: A system is disclosed for allowing quick and easy installation, maintenance and removal of components within a piece of equipment which may be attached to a front end of processing tool or stand alone unit in a semiconductor processing fab. In a first embodiment, the system includes a translation assembly and a pair of tracks fixedly mounted in frame of the equipment. The translation assembly in this embodiment includes a trolley having four wheels which ride on a portion of each of the tracks. When a component is to be assembled into the piece of equipment, the component is first bolted to the trolley. The trolley and attached component may then be inserted into the frame. The wheels riding on the tracks allow the robot to be quickly and easily moved to its proper position within the equipment. Once properly located, jackscrews threaded through the trolley are rotated to raise the trolley wheels off of the tracks, and to level the trolley and component.

Abstract: A method and apparatus for removing a semiconductor wafer cassette from a SMIF pod and for transferring the cassette along a vertical axis to a platform of a wafer processing station. The apparatus is comprised of a transfer device that includes a pair of gripping arms for gripping the wafer cassette from the sides of the cassette. Once gripped, the cassette moves with the transfer device upward along a vertical axis to make room for the platform to be extended from within the processing station to a position under the cassette. Thereafter, the direction of motion of the transfer device is reversed and the cassette is lowered onto the platform. Once seated on the platform, the gripping arms retract from the cassette, and the cassette is carried on the platform into the processing station.

Abstract: A method and apparatus for removing a semiconductor wafer cassette from a SMIF pod and for transferring the cassette along a vertical axis to a platform of a wafer processing station. The apparatus is comprised of a transfer device that includes a pair of gripping arms for gripping the wafer cassette from the sides of the cassette. Once gripped, the cassette moves with the transfer device upward along a vertical axis to make room for the platform to be extended from within the processing station to a position under the cassette. Thereafter, the direction of motion of the transfer device is reversed and the cassette is lowered onto the platform. Once seated on the platform, the gripping arms retract from the cassette, and the cassette is carried on the platform into the processing station.