Abstract: A scrap collection assembly for use with a fiber placement machine, including a scrap bin configured to receive scrap pieces of composite tape; a first roller assembly, including a roller configured to engage one side of a scrap piece of composite tape, coupled to the scrap bin; a second roller assembly, including another roller configured to engage an opposite side of the scrap piece of composite tape, coupled to the scrap bin, such that the rollers move to engage opposite sides of the scrap piece, pull the scrap piece from a fiber placement machine, and deposit the scrap piece in the scrap bin.

Abstract: A fiber placement system for producing small sized flat laminates having a length and width that extends in the X and Y axes, and a constant height measured in the Z-axis includes a fixed creel for delivering fiber used by the system, and a fixed bracket attached to the creel. A fiber placement head is supported by the fixed bracket and a movable table for supporting a tool is positioned under the fiber placement head. The fiber placement head is fixed in the X, Y, and Z-axis during the application of fiber to the tool.

Abstract: A fiber placement system for producing small sized flat laminates having a length and width that extends in the X and Y axes, and a constant height measured in the Z-axis includes a fixed creel for delivering fiber used by the system, and a fixed bracket attached to the creel. A fiber placement head is supported by the fixed bracket and a movable table for supporting a tool is positioned under the fiber placement head. The fiber placement head is fixed in the X, Y, and Z-axis during the application of fiber to the tool.

Abstract: A method and system of testing an electronic device can be performed by estimating the die temperature using correlation data previously collected for other electronic devices. In one embodiment, correlation data can include (1) die temperatures measured and (2) currents drawn by the electronic devices, testing voltages for the electronic devices, or powers consumed by the electronic devices during the testing. The correlation data can be used to generate an equation or be stored in a table. A method of testing a subsequent electronic device can include testing the subsequent electronic device. The method can also include estimating a die temperature for the subsequent electronic device during testing, wherein the die temperature can be estimated at least in part using a current drawn by the subsequent electronic device, a testing voltage for the subsequent electronic device, or a power consumed by the subsequent electronic device.