Abstract: A vapor delivery needle is provided that may include any of a number of features. One feature of the energy delivery probe is that it can apply condensable vapor energy to tissue, such as a prostrate, to shrink, damage, denaturate the prostate. In some embodiments, the vapor delivery needle can be advanced a predetermined distance into the prostate with a solenoid actuation mechanism. Methods associated with use of the energy delivery probe are also covered.

Abstract: A vapor delivery system and method is provided that includes a number of features. In one embodiment, a method comprises inserting a vapor delivery needle into tissue of a patient, activating a flow of vapor from a vapor generator through vapor delivery ports of the vapor delivery needle to cause condensed liquid to exit vapor delivery ports of the vapor delivery needle, generating vapor in the vapor generator, delivering a dose of vapor through the vapor delivery ports of the vapor delivery needle into the tissue, and after the dose of vapor is delivered, re-activating the flow of vapor from the vapor generator through the vapor delivery ports of the vapor delivery needle to prevent a vacuum from forming in the vapor delivery needle.

Abstract: A stroller system includes a stroller frame, a plurality of wheels connected to the stroller frame, a stroller seat attached to the stroller frame, a motor mounted on the stroller frame and configured to drive at least one of the plurality of wheels, a power source configured to supply power to the motor, and a controller configured to control the and thereby the movement of the stroller system.

Abstract: A vapor delivery needle is provided that may include any of a number of features. One feature of the energy delivery probe is that it can apply condensable vapor energy to tissue, such as a prostrate, to shrink, damage, or denature tissues of the prostate. Methods associated with use of the energy delivery probe are also covered.

Abstract: A fiber placement head for applying a plurality of composite tape segments on a mold, including a pre-start lane assembly having a pre-start power roller that moves a composite tape segment from a composite tape source; a restart lane assembly having a restart power roller that also moves the composite tape segment from the composite tape source; and a cutting lane assembly having a reciprocating cutting blade, wherein the pre-start power roller draws composite tape from the composite tape source and the restart power roller positions a composite tape segment on a mold.

Abstract: The disclosed technology generally relates to forming metallization structures for integrated circuit devices by plating, and more particularly to plating metallization structures that are thicker than masking layers used to define the metallization structures. In one aspect, a method of metallizing an integrated circuit device includes plating a first metal on a substrate in a first opening formed through a first masking layer, where the first opening defines a first region of the substrate, and plating a second metal on the substrate in a second opening formed through a second masking layer, where the second opening defines a second region of the substrate. The second opening is wider than the first opening and the second region encompasses the first region of the substrate.

Abstract: A fiber placement head for applying a plurality of composite tape segments on a mold, including a pre-start lane assembly having a pre-start power roller that moves a composite tape segment from a composite tape source; a restart lane assembly having a restart power roller that also moves the composite tape segment from the composite tape source; and a cutting lane assembly having a reciprocating cutting blade, wherein the pre-start power roller draws composite tape from the composite tape source and the restart power roller positions a composite tape segment on a mold.

Abstract: A survival backpack system includes a main bag, and a pair of shoulder straps for mounting the main bag on a user's shoulders. The system includes a plurality of gear packs, all the same size, and each containing a different type of survival gear. The main bag forms a plurality of gear compartments, each slightly larger than each of the plurality of gear packs, each of the plurality of gear compartments being accessible through an opening in the top panel. A hydration compartment is accessible through an opening in the bottom panel, the hydration compartment being sized and shaped to receive a hydration pack therein.

Abstract: The disclosed technology generally relates to forming metallization structures for integrated circuit devices by plating, and more particularly to plating metallization structures that are thicker than masking layers used to define the metallization structures. In one aspect, a method of metallizing an integrated circuit device includes plating a first metal on a substrate in a first opening formed through a first masking layer, where the first opening defines a first region of the substrate, and plating a second metal on the substrate in a second opening formed through a second masking layer, where the second opening defines a second region of the substrate. The second opening is wider than the first opening and the second region encompasses the first region of the substrate.

Abstract: The disclosed technology generally relates to forming metallization structures for integrated circuit devices by plating, and more particularly to plating metallization structures that are thicker than masking layers used to define the metallization structures. In one aspect, a method of metallizing an integrated circuit device includes plating a first metal on a substrate in a first opening formed through a first masking layer, where the first opening defines a first region of the substrate, and plating a second metal on the substrate in a second opening formed through a second masking layer, where the second opening defines a second region of the substrate. The second opening is wider than the first opening and the second region encompasses the first region of the substrate.

Abstract: A composting facility includes: a floor for receiving compostable material thereon, wherein the floor is constructed above-grade; a dovetail extending from the floor to allow ingress of a vehicle from a grade level to the floor; one or more channels defined within the floor and extending through the dovetail; a covering extending over the one or more channels to maintain the compostable material away from the channel, the covering defining at least one aperture extending from above the covering into the one or more channels for allowing flowthrough of gases; and an air source for providing air through the channels to provide cooling characteristics to the compostable material or oxygen to aid an aerobic process associated with composting. In operation, liquids draining from the composting material pass through the at least one aperture into the channel and out through a portion of the channel extending through the dovetail.

Abstract: The disclosed technology generally relates to forming metallization structures for integrated circuit devices by plating, and more particularly to plating metallization structures that are thicker than masking layers used to define the metallization structures. In one aspect, a method of metallizing an integrated circuit device includes plating a first metal on a substrate in a first opening formed through a first masking layer, where the first opening defines a first region of the substrate, and plating a second metal on the substrate in a second opening formed through a second masking layer, where the second opening defines a second region of the substrate. The second opening is wider than the first opening and the second region encompasses the first region of the substrate.

Abstract: An insulated electrical conductor (MI cable) may include an inner electrical conductor, an electrical insulator at least partially surrounding the electrical conductor, and an outer electrical conductor at least partially surrounding the electrical insulator. The insulated electrical conductor may have a substantially continuous length of at least about 100 m. The insulated electrical conductor may have an initial breakdown voltage, over a substantially continuous length of at least about 100 m, of at least about 60 volts per mil of the electrical insulator thickness (about 2400 volts per mm of the electrical insulator thickness) at about 1300° F. (about 700° C.) and about 60 Hz. The insulated electrical conductor may be capable of being coiled around a radius of about 100 times a diameter of the insulated electrical conductor. The outer electrical conductor may have a yield strength based on a 0.2% offset of about 100 kpsi.

Abstract: A composting facility includes: a floor for receiving compostable material thereon, wherein the floor is constructed above-grade; a dovetail extending from the floor to allow ingress of a vehicle from a grade level to the floor; one or more channels defined within the floor and extending through the dovetail; a covering extending over the one or more channels to maintain the compostable material away from the channel, the covering defining at least one aperture extending from above the covering into the one or more channels for allowing flowthrough of gases; and an air source for providing air through the channels to provide cooling characteristics to the compostable material or oxygen to aid an aerobic process associated with composting. In operation, liquids draining from the composting material pass through the at least one aperture into the channel and out through a portion of the channel extending through the dovetail.

Abstract: Methods of forming a thin film are disclosed. One such method can include sputtering a target material to form a first thin film resistor and adjusting a parameter of deposition to modulate a property of a subsequently formed second thin film resistor. For instance, a substrate bias and/or a substrate temperature can be adjusted to modulate a property of the second thin film resistor. A temperature coefficient of resistance (TCR) and/or another property of the second thin film resistor can be modulated by adjusting the parameter of deposition. The target material sputtered onto the substrate can include, for example, a Cr alloy, a Ni alloy, SiCr, NiCr, or the like. A relationship can be established between the substrate bias and/or substrate temperature and the thin film resistor property, and the relationship can be used in selecting deposition conditions for a desired property value.

Abstract: The disclosure relates to the manufacture of inductive components, in particular transformers, using a combination of microfabrication techniques and discrete component placement. By using a prefabricated core, the core may be made much thicker than one that is deposited using microfabrication techniques. As such, saturation occurs later and the efficiency of the transformer is improved. This is done at a much lower cost than the cost of producing a thicker core by depositing multiple layers using microfabrication techniques.

Abstract: A method of trimming a component is provided in which the component is protected from oxidation or changes in stress after trimming. As part of the method, a protective glass cover is bonded to the surface of a semiconductor substrate prior to trimming (e.g., laser trimming) of a component. This can protect the component from oxidation after trimming, which may change its value or a parameter of the component. It can also protect the component from changes in stress acting on it or on the die adjacent it during packaging, which may also change a value or parameter of the component.

Abstract: A composting facility includes: a floor for receiving compostable material thereon, wherein the floor is constructed above-grade; a dovetail extending from the floor to allow ingress of a vehicle from a grade level to the floor; one or more channels defined within the floor and extending through the dovetail; a covering extending over the one or more channels to maintain the compostable material away from the channel, the covering defining at least one aperture extending from above the covering into the one or more channels for allowing flowthrough of gases; and an air source for providing air through the channels to provide cooling characteristics to the compostable material or oxygen to aid an aerobic process associated with composting. In operation, liquids draining from the composting material pass through the at least one aperture into the channel and out through a portion of the channel extending through the dovetail.

Abstract: A method for forming an insulated conductor heater with a final cross-sectional area includes reducing a cross-sectional area of an insulated conductor assembly to form an insulated conductor heater with a final cross-sectional area. The insulated conductor assembly may have been previously treated with at least one combination of a cold working step and a heat treating step. Reducing the cross-sectional area of the insulated conductor assembly to form the insulated conductor heater with the final cross-sectional area may include cold working the insulated conductor assembly to further reduce the cross-sectional area of the insulated conductor assembly by at most about 20% of the cross-sectional area of the insulated conductor assembly after the at least one combination of the cold working step and the heat treating step has been completed.