Abstract: Panels are positioned relative to a pattern by moving the pattern onto a registration mechanism having contact elements, engaging contact areas on the pattern with contact elements by moving the contact elements synchronously and equidistantly while allowing the registration mechanism to move as the elements engage the contact areas, locking the position of the registration mechanism, and engaging contact areas on sequential panels by moving the contact elements of the locked registration mechanism synchronously and equidistantly to contact areas on one panel after the other.

Abstract: Panels are positioned relative to a pattern by moving the pattern onto a registration mechanism having contact elements, engaging contact areas on the pattern with contact elements by moving the contact elements synchronously and equidistantly while allowing the registration mechanism to move as the elements engage the contact areas, locking the position of the registration mechanism, and engaging contact areas on sequential panels by moving the contact elements of the locked registration mechanism synchronously and equidistantly to contact areas on one panel after the other.

Abstract: Circuit packs to be tested are loaded into first and second test chambers commonly served by a hot liquid reservoir and by a cold liquid reservoir of which both are coupled to both chambers by a liquid handling system containing valves controlled by program determined signals from a controller unit to direct liquid flows as desired between the chambers and reservoirs. During liquid contact periods for the chambers, liquid from the hot reservoir is intermittently pumped into each of the chambers at times different for the two chambers, and liquid from the cold reservoir is intermittently pumped into each of the chambers at times which are different for the two chambers and intervening at each chamber the times of hot liquid pumping thereto, whereby the packs in each chamber are alternately heated and chilled by such liquid so as to be thermally stressed, and the responses of the packs to such stressing are detected.

Abstract: Disclosed is an apparatus, method, and resulting product involving soldering of components, such as the soldering of flexible circuits to printed circuit boards. Holes are provided in the areas of one component which are to be soldered to pads on the other component. Precise amounts of solder are provided to each pad, preferably by means of a shuttle element which carries solder paste in cavities corresponding to the pads and which deposits the solder on the pads when the solder is melted. The holes in the component are aligned with the pads, and the solder is reflowed so that a visible solder fillet is formed above the holes to permit inspection of the solder joint.

Abstract: Disclosed is an apparatus involving soldering of components, such as the soldering of flexible circuits to printed circuit boards. Holes are provided in the areas of one component which are to be soldered to pads on the other component. Precise amounts of solder are provided to each pad, preferably by a shuttle element which carries solder paste in cavities corresponding to the pads and which deposits the solder on the pads when the solder is melted. The holes in the component are aligned with the pads, and the solder is reflowed so that a visible solder fillet is formed above the holes to permit inspection of the solder joint.

Abstract: Disclosed is a method for selective soldering of components by inductive heating. A ferromagnetic material is provided as part of the components so that an applied electromagnetic field will create sufficient heat to melt the solder. The Curie temperature of the material is chosen to be just above the melting temperature of the solder to regulate the amount of heating.

Abstract: A solder joint assembly technique applies controlled volumes of solder to pads of both package and substrate. The two units are positioned adjacent each other with the pads and solder deposits mechanically maintained in registration with each other. The assembly is reflowed and the final separation between package and substrate at which the resulting solder joint solidifies is mechanically controlled in order to control a geometry of the resultant solidified joint. The solder volume deposits may assume various forms including spherical bumps and solder paste deposits.

Abstract: A process and apparatus are disclosed for controlling losses in volatile working fluid systems. In accordance with the process, the object upon which a work operation is to be effected is sequentially moved from a first sealable chamber to a second such chamber and back to the first chamber. While in the second chamber the object is exposed to a working fluid vapor which elevates the temperature of the object to a level near the boiling point of the working fluid. Thereafter, while still in the second chamber, a substantial portion of the working fluid is drained from the object such that the sensible heat acquired by the object upon its elevation of temperature is sufficient to evaporate working fluid remaining on the object upon its removal to the first chamber. Upon removal of the object to the first chamber the object is thoroughly dried through control of the partial pressure of the working fluid vapor contained within the first chamber atmosphere.

Abstract: A process and machine are disclosed for reflowing solder plated continuous flexible circuit webs. During reflow in a vapor environment, the flexible web is maintained in a planar orientation to produce a relatively uniform distribution of solder. Virtually all of the heat transfer fluid used in producing the vapor is recovered and retained.