Abstract: An assembly of an optical interconnect module adaptable for mating with an optical connector having at least one optical fiber and an alignment pin.

Abstract: Multicell system and method for making a multicell system. Systems include relatively thin (less than about 50 mil) electrochemical cells layered upon one another to minimize volume and weight. Cells systems are formed with cells that are layered such that first charge sides of each cell are coupled to first charge sides of other cells, and such that second charge sides of each cell are coupled to second charge sides of other cells. Cells and/or cell systems is connected to other cells and/or cell systems to form battery systems by layering cells such that a first charge side of a cell are coupled to second charge side of another cell. In this manner the number of electrically insulating separators is reduced, thereby also reducing weight and volume of resulting systems.

Abstract: A process for manufacturing a pin grid array package providing a plurality of electrical input and/or output connections using a plurality of stacked, but spaced apart, separate leadframes which are preformed and include a plurality of electrical leads having first and second ends for providing a plurality of different connections. An insulating layer is positioned between adjacent leadframes and the package is bonded together.

Abstract: A process for making thermosetting or thermoplastic encapsulated integrated circuit having a heat exchanger in which one end of the heat exchanger is encapsulated in the housing adjacent to the integrated circuit and the other end is exposed to the environment beyond the housing portion. The process of making includes molding a heat exchanger into a thermosetting or thermoplastic package utilizing a preformed heat exchanger having a dissolvable or removable material which serves as a seal block during the molding operation. A plurality of thermally conductive heat exchanger elements are provided for providing the desired thermal performance while reducing the thermal stresses in the package.

Abstract: An encapsulated integrated circuit package having an integrated circuit chip with a plurality of electrical leads connected thereto and at least one thermally conductive screen mesh positioned adjacent to the chip. A non-electrically conductive thermosetting or thermoplastic material forms a housing enclosing the chip and bonded to the screen mesh. Preferably one of the layers is exposed to the outside of the housing and the screen mesh is secured to a substrate supporting the chip.

Abstract: An integrated circuit structure and method of making in which the circuit has a plurality of metal heat exchanger elements spaced from each other with their first ends secured to the structure. The first ends may be adhesively secured to an integrated circuit chip or the underlying substrate, and the heat exchanger may be hermetically attached. The method uses a compliant removable support block for attaching the plurality of individual heat exchanger elements to integrated circuit structures having variations in their elevation.

Abstract: A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.

Abstract: A testing and burn in socket compatible with the high density test pads located at small pitches devices on a TAB tape. A TAB tape carrier for supporting the TAB tape and a test circuit board having contact pads for electrical communication with the test pads. An alignment fixture positioned between the tape carrier and circuit board and including an opening in alignment between the test pads and the contact pads. A metal in elastomer matrix is positioned in the opening for providing electrical communication between the test pads and the contact pads. A block may be positoned in the openings and contain a plurality of straight parallel electrically conductive pins aligned with the matrix for high frequency tests.

Abstract: A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.

Abstract: Slide forming tape-automated-bonded leads extending from an integrated circuit chip with a support ring on the leads between the outer periphery of the chip and the outer lead ends. After the leads are formed the support ring remains attached to the vertical portion of the leads opposite the chip. The present invention is well suited for minimizing and footprint on relatively long TAB leads which fan out and require a support ring to maintain proper lead pitch.

Abstract: An encapsulated integrated circuit which includes an integrated circuit die having a plurality of electric leads extending from the die. A thermal heat sink is positioned adjacent the die. The heat sink includes a thermoplastic material having a plurality of thermoconductive particles molded therein. A non-electrically conductive plastic material is sealably connected to the heat sink and encloses the die and seals around the leads. The heat sink plastic material is filled approximately 50 percent with metal particles, preferably in the form of powder. The particles may be from a group consisting of copper, aluminum, iron, carbon, aluminum nitride, silicon carbide, and boron nitride. The heat sink and the non-conductive plastic material have coacting interlocking interfaces.

Abstract: An apparatus for inverting and handling integrated circuit dice employs rotating apparatus for rotating a chip carrier by 180 degrees to invert and transfer dice from one set of receptacles to another; together with an apparatus for precisely aligning dice resting at random positions within a set of oversized receptacles.

Abstract: A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.

Abstract: An apparatus for removing selected integrated circuit dice from a wafer array of dice sequentially moves a striker above a tape to the underside of which the array is mounted and then knocks a die down from the array of dice into a receptacle for transport to further processing stages.

Abstract: A method of forming leadframes for use in manufacturing semiconductor chips starts with fabricating a plurality of leadframes by metal stamping or etching leadframe patterns into a flat ribbon of conductive material. The leadframe patterns include a plurality of outwardly radiating leads, inner radiating leads, and a central perimeter for interconnecting the outwardly and inner radiating leads. The outwardly radiating leads are arranged in groups, each of which are directed along planar perpedicular coordinates. The inner radiating leads have 180 degrees turns in the plane of the leadframe. The inner radiating leads are then successively bent at an acute angle and parallel to the plane of said leadframe so that the inner radiating leads are offset from the plane of the leadframe. The bending is performed in such a manner that each of the leads are formed with a stable spring force for effective bonding to corresponding semiconductor chip pads.

Abstract: A leadframe for an integrated circuit includes a set of individual leads temporarily connected in an array; each lead having an exterior portion shaped in a standard form and an interior portion shaped to form a standard array of contacts and to have the same spring constant for deflections perpendicular to the plane of the leadframe.

Abstract: An integrated circuit chip includes a top layer of dielectric penetrated by conductive vias connecting electrical contacts within the integrated circuit proper to a network of electrical leads disposed on top of the dielectric layer; the network of leads, in turn, being connected to an array of contact pads adapted for simultaneous solder connection to a leadframe.

Abstract: A system for the assembly and packaging of integrated circuits employs circuit dice that have contact pads in a standard array; a leadframe having leads configured to have the same spring constant; a method for removing selected dice from a wafer array under computer control; and a method of simultaneously bonding all leads to the die.

Abstract: A method for removing selected integrated circuit dice from a wafer array of dice sequentially moves a striker above a tape to the underside of which the array is mounted and the knocks a die down from the array of dice into a receptacle for transport to further processing stages.