Abstract: A process for forming particles. The process includes a step of entraining gas into a precursor material, wherein the gas includes from about 50 vol % to about 75 vol % carbon dioxide and from about 25 vol % to about 50 vol % other constituents. The precursor material is deposited onto a moving conveyor. The precursor material is cooled to form a plurality of particles.

Abstract: An autotransformer for use in low frequency, high power applications that uses a stack of printed wire boards constructed of a top, inner, and bottom layer including electrical trace windings circumventing the transformer core and formed in the inner layer for direct thermal contact with a heat sink interface providing a uniform and consistent heat path down to the heat sink plate. The autotransformer further includes a board to board connection employing solder cups to electrically connect between predetermined printed wire board traces. The printed wire board autotransformer also may use a non-planar interface for thermal interface with a non-planar heat sink plate surface.

Abstract: The present invention provides a cooling device including a heat generating device having a device surface with a device surface contour on at least a portion of the device surface and a base having a base surface with a base surface contour on at least a portion of the base surface. The device surface contour and the base surface contour are substantially similar such that at least a portion of the device surface and the base surface fit in close proximity to each other.

Abstract: An autotransformer for use in low frequency, high power applications that uses a stack of printed wire boards constructed of a top, inner, and bottom layer including electrical trace windings circumventing the transformer core and formed in the inner layer for direct thermal contact with a heat sink interface providing a uniform and consistent heat path down to the heat sink plate. The autotransformer further includes a board to board connection employing solder cups to electrically connect between predetermined printed wire board traces. The printed wire board autotransformer also may use a non-planar interface for thermal interface with a non-planar heat sink plate surface.

Abstract: The present invention provides a cooling device including a heat generating device having a device surface with a device surface contour on at least a portion of the device surface and a base having a base surface with a base surface contour on at least a portion of the base surface. The device surface contour and the base surface contour are substantially similar such that at least a portion of the device surface and the base surface fit in close proximity to each other.

Abstract: A controlled start up technique may eliminate the excessive peak junction temperature by controlling the speed of the electric device. Lower speed may result in reduced power to the load. Reduced power may result in reduced losses to maintain reliable operating junction temperatures. Once the junction reaches the predetermined temperature limit, speed may be controlled to hold the junction temperature constant. As time elapses, the coolant temperature may reduce, thereby allowing a higher power level without an increase in IGBT temperature. Unlike conventional methods which may allow for full power continuously upon start up, thereby either potentially causing a high temperature shut-down condition or requiring additional thermal inertia to handle a high heat load due to a continuous full-power start up, the controlled start up eliminates the design penalties for extensive thermal enhancements to accommodate the occasional extreme hot start up.

Abstract: An integral cold plate/chassis (ICPC) housing may be formed from two blocks of material, having a cold plate sandwiched therebetween, brazed together. The blocks may then be machined to fit power electronics therein, thereby providing a cold plate as an integral part of the power electronic's housing. Unlike conventional heat exchangers that may be used to dissipate heat from power-dissipating components that are housed typically in sheet metal housings, the ICPC described herein provides a cold plate integral to the housing of power electronics, thereby allowing the rapid and efficient removal of heat from the components into the cold plate carrier fluid and out of the system.

Abstract: An integral cold plate/chassis (ICPC) housing may be formed from two blocks of material, having a cold plate sandwiched therebetween, brazed together. The blocks may then be machined to fit power electronics therein, thereby providing a cold plate as an integral part of the power electronic's housing. Unlike conventional heat exchangers that may be used to dissipate heat from power-dissipating components that are housed typically in sheet metal housings, the ICPC described herein provides a cold plate integral to the housing of power electronics, thereby allowing the rapid and efficient removal of heat from the components into the cold plate carrier fluid and out of the system.

Abstract: A controlled start up technique may eliminate the excessive peak junction temperature by controlling the speed of the electric device. Lower speed may result in reduced power to the load. Reduced power may result in reduced losses to maintain reliable operating junction temperatures. Once the junction reaches the predetermined temperature limit, speed may be controlled to hold the junction temperature constant. As time elapses, the coolant temperature may reduce, thereby allowing a higher power level without an increase in IGBT temperature. Unlike conventional methods which may allow for full power continuously upon start up, thereby either potentially causing a high temperature shut-down condition or requiring additional thermal inertia to handle a high heat load due to a continuous full-power start up, the controlled start up eliminates the design penalties for extensive thermal enhancements to accommodate the occasional extreme hot start up.

Abstract: A heat exchanger includes a silicon nitride substrate. Electronic components may be surface mounted to the substrate. A fluid passageway in the heat exchanger allows a coolant to flow therethrough and carry away heat from the electronic components.

Abstract: An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.

Abstract: An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.

Abstract: An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.

Abstract: A process for extracting metal values, especially zinc values, from aqueous solutions of metal salts, which comprises contacting the aqueous solution with an organic phase comprising a compound of the formula, ##STR1## wherein each of R.sup.1, R.sup.2, R.sup.3 and R.sup.4, independently, represents an optionally substituted hydrocarbyl or hydrocarbyloxy group or R.sup.1 and R.sup.2 together with the attached phosphorus atom and/or R.sup.3 and R.sup.4 together with the attached phosphorus atom from a 5- to 8-membered heterocyclic ring.

Abstract: A process for the reduction of organic nitro compounds containing groups which confer solubility in water comprising treatment of said compounds with an aqueous solution of a formate in presence of a hydrogenation catalyst.

Abstract: Dehalogenation of water-immiscible or sparingly soluble aromatic compounds containing chlorine or bromine by contacting with an aqueous solution of a formic acid salt in presence of a hydrogenation catalyst and a surface active agent.