Abstract: A system couples isotope markers to molecules in mixtures to identify and quantitate the molecular components in the mixtures and detects them using nuclear magnetic resonance (NMR) spectroscopy.

Abstract: Method for constructing concrete shear core buildings wherein a steel erection structure is built having steel columns and beams. The steel erection structure is made from pre-assembled segments that include the steel reinforcing bar for the concrete shear core. A peripheral steel structure is also constructed and the steel floors are built, cooperatively supported by the steel erection structure and the peripheral structure. Forms are positioned generally about the steel reinforcing bars and at least a portion of the steel erection structure. Concrete is poured in the volume defined by the forms, to build a portion of the concrete shear core. In a preferred embodiment, the steel erection structure and peripheral steel structure proceed approximately seven to nine floors ahead of the concrete shear core, and the concrete shear core is sized to support the completed building without accounting for the additional structural support provided by the steel erection structure.

Abstract: A semiconductor package is provided that has a rigid metal substrate and a dielectric layer covering a first portion of the rigid metal substrate, with a second portion of the rigid metal substrate being substantially free of the dielectric layer. A semiconductor device is electrically bonded to the second portion of the rigid metal substrate and metal circuit traces defining electrical paths are formed on the dielectric layer, at least one of which contacts the rigid metal substrate through at least one via in the dielectric layer. Additionally, a method is provided for grounding a semiconductor device and at least one circuit trace on a rigid metal substrate substantially covered by a dielectric layer, which includes creating at least one via in the dielectric layer using a laser and creating circuit traces on the dielectric layer, at least one of which contacts the rigid metal substrate through at least one of the vias.