Abstract: A switch probe, generally for use in testing cable harnesses, is for placement within a standard probe receptacle and can be removed and replaced as necessary. The switch probe includes a conductive barrel with a front open end and a rear closed end. A conductive first switch portion is received within the barrel at the rear closed end and includes a first shaft projecting forwardly. A conductive second switch portion is received within the barrel and has an engagement tip positioned forwardly of the barrel open end for electrical contact with a test site. A second shaft extends rearwardly and into axially spaced relation to the first shaft. An elongate hollow insulator extends fully between and provides a guideway for reciprocatory contact between the first and second shafts and fully shields the second shaft from electrical leakage prior to conductive contact of the second shaft with the first shaft.

Abstract: A module attachment for testing a linear high density array of test sites on a printed circuit board having such circuit test sites where an integrated circuit chip (IC) is to be mounted. Present IC's may have wire lead spacings as close as 0.010 inch with integrated chip development utilizing even more compact and close center pad spacing, such as 0.004 inch. This spacing is too close to use even the thinnest of spring contact probes. The module carries an array of densely packed thin wires embedded in a small matrix block mounted on spaced supports, which may be conventional, large diameter spring contact probes. Electrical connection to the array of wires in the module is done by each wire being connected to a separate wire lead with the wires bundled and routed to a test computer. In its closest wire spacings, the module permits testing of the densest IC's and in wider spacings, provides a low cost alternative to spring contact probes.

Abstract: A method of selective plating a component, which method comprises contacting a lower face of the component with a contoured lower mask having a plating aperture so as to expose an area of the component to be plated, positioning the component over a plating tank and selective plating the component with a plating medium, wherein the cross-sectional area of the plating aperture is enlarged at the surface of the component so as to define one or more cavities in which the plating rate is lower than elsewhere in the plating aperture.

Abstract: A method of selective plating a component, which method includes contacting upper and lower faces of the component with upper and lower masks, respectively, so that the lower mask exposes a part of the component to be plated, positioning the component over a plating tank and selective plating the component with a plating medium, the plating pressure and the hardness of the material of the upper mask being such that the upper mask is deformed during plating so as at least partially to mask the edge(s) of the exposed part.