Patents by Inventor Michael A. Schrameyer

Michael A. Schrameyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230184636
    Abstract: A method for preparing an aliquot of solution comprising a plurality of particles is disclosed. The method includes agitating the solution with a baffle at a predetermined mixing speed to suspend the plurality of particles in the solution, wherein the baffle positioned at least partially within a vessel containing the solution, and wherein the vessel is engaged with a vessel receptacle configured to hold the vessel. The method also includes withdrawing, during the agitating, the aliquot of solution from the vessel with a pipette, such that an end of a pipette tip is positioned within the vessel.
    Type: Application
    Filed: December 9, 2022
    Publication date: June 15, 2023
    Inventors: Arvind Dev, Julie Rollins, Richard Holt, Michael A. Schrameyer, Richard Lemieux, Nicholas Gustafson, Andrey Asanov
  • Patent number: 10826218
    Abstract: A thermally insulating electrical contact probe including a mounting plate having a tubular pin guide defining a pin pass-through, a cover coupled to the mounting plate and having a neck portion enclosing the pin guide, and an insulating pin having a shank portion disposed within the pin pass-through and defining a conductor pass-through, a flange portion extending radially outwardly from the shank portion above a top of the pin guide, and a pocket portion extending from the flange portion and defining a pocket. The electrical contact probe may further include a spring disposed intermediate the flange portion and the mounting plate, the spring biasing the flange portion away from the mounting plate, an electrical contact pad disposed within the pocket, and an electrical conductor coupled to the electrical contact pad and extending through the conductor pass-through.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: November 3, 2020
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Michael A. Schrameyer, Steven M. Anella
  • Patent number: 10109510
    Abstract: An apparatus and method for improving the temperature uniformity of a workpiece during processing is disclosed. The apparatus includes a ring heater assembly disposed along the outer circumference of the platen. The ring heater assembly includes heating elements disposed therein or thereon, where these heating elements create heat, which serves to warm the outer edge of the workpiece. In some embodiments, the ring heater assembly extends beyond the edge of the workpiece and may be exposed to the ion beam.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: October 23, 2018
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Steven M. Anella, Michael A. Schrameyer
  • Publication number: 20180131115
    Abstract: A thermally insulating electrical contact probe including a mounting plate having a tubular pin guide defining a pin pass-through, a cover coupled to the mounting plate and having a neck portion enclosing the pin guide, and an insulating pin having a shank portion disposed within the pin pass-through and defining a conductor pass-through, a flange portion extending radially outwardly from the shank portion above a top of the pin guide, and a pocket portion extending from the flange portion and defining a pocket. The electrical contact probe may further include a spring disposed intermediate the flange portion and the mounting plate, the spring biasing the flange portion away from the mounting plate, an electrical contact pad disposed within the pocket, and an electrical conductor coupled to the electrical contact pad and extending through the conductor pass-through.
    Type: Application
    Filed: January 5, 2018
    Publication date: May 10, 2018
    Applicant: Varian Semiconductor Equipment Associates, Inc.
    Inventor: Michael A. Schrameyer
  • Patent number: 9887478
    Abstract: A thermally insulating electrical contact probe including a mounting plate having a tubular pin guide defining a pin pass-through, a cover coupled to the mounting plate and having a neck portion enclosing the pin guide, and an insulating pin having a shank portion disposed within the pin pass-through and defining a conductor pass-through, a flange portion extending radially outwardly from the shank portion above a top of the pin guide, and a pocket portion extending from the flange portion and defining a pocket. The electrical contact probe may further include a spring disposed intermediate the flange portion and the mounting plate, the spring biasing the flange portion away from the mounting plate, an electrical contact pad disposed within the pocket, and an electrical conductor coupled to the electrical contact pad and extending through the conductor pass-through.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: February 6, 2018
    Assignee: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
    Inventor: Michael A. Schrameyer
  • Publication number: 20160315407
    Abstract: A thermally insulating electrical contact probe including a mounting plate having a tubular pin guide defining a pin pass-through, a cover coupled to the mounting plate and having a neck portion enclosing the pin guide, and an insulating pin having a shank portion disposed within the pin pass-through and defining a conductor pass-through, a flange portion extending radially outwardly from the shank portion above a top of the pin guide, and a pocket portion extending from the flange portion and defining a pocket. The electrical contact probe may further include a spring disposed intermediate the flange portion and the mounting plate, the spring biasing the flange portion away from the mounting plate, an electrical contact pad disposed within the pocket, and an electrical conductor coupled to the electrical contact pad and extending through the conductor pass-through.
    Type: Application
    Filed: April 21, 2015
    Publication date: October 27, 2016
    Inventor: Michael A. Schrameyer
  • Publication number: 20160181132
    Abstract: An apparatus and method for improving the temperature uniformity of a workpiece during processing is disclosed. The apparatus includes a ring heater assembly disposed along the outer circumference of the platen. The ring heater assembly includes heating elements disposed therein or thereon, where these heating elements create heat, which serves to warm the outer edge of the workpiece. In some embodiments, the ring heater assembly extends beyond the edge of the workpiece and may be exposed to the ion beam.
    Type: Application
    Filed: December 18, 2014
    Publication date: June 23, 2016
    Inventors: Steven M. Anella, Michael A. Schrameyer
  • Patent number: 9175710
    Abstract: A ceramic fastener includes a ceramic body portion, and a containment layer disposed around the ceramic body portion. The containment layer retains pieces of the ceramic body portion when the ceramic body portion is subjected to a torque sufficient to fracture the ceramic body portion. The fastener can be a nut, and the containment layer can be disposed around one or more of the top, bottom and side surfaces of the nut. The containment layer can be a metal shroud having a thickness from 0.01 to 0.125 inches. The ceramic body portion can be alumina or zirconia. A thread insert may be disposed within a fastener bore of the ceramic body portion.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: November 3, 2015
    Assignee: Varian Semiconductor Equipment Associates, Inc
    Inventors: Michael A. Schrameyer, Jeffrey E. Krampert
  • Publication number: 20150176625
    Abstract: A ceramic fastener includes a ceramic body portion, and a containment layer disposed around the ceramic body portion. The containment layer retains pieces of the ceramic body portion when the ceramic body portion is subjected to a torque sufficient to fracture the ceramic body portion. The fastener can be a nut, and the containment layer can be disposed around one or more of the top, bottom and side surfaces of the nut. The containment layer can be a metal shroud having a thickness from 0.01 to 0.125 inches. The ceramic body portion can be alumina or zirconia. A thread insert may be disposed within a fastener bore of the ceramic body portion.
    Type: Application
    Filed: December 19, 2013
    Publication date: June 25, 2015
    Applicant: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Michael A. Schrameyer, Jeffrey E. Krampert
  • Publication number: 20140318455
    Abstract: An electrostatic chuck includes a heater and an electrode disposed on the heater. The electrostatic chuck also includes an insulator layer and coating disposed on the insulator, where the coating is configured to support an electrostatic field generated by the electrode system to attract a substrate thereto.
    Type: Application
    Filed: April 26, 2013
    Publication date: October 30, 2014
    Applicant: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Julian G. Blake, Dale K. Stone, Lyudmila Stone, Michael Schrameyer
  • Patent number: 8864202
    Abstract: An end effector is disclosed for use in substrate processing. The end effector includes a effector body portion, a contact pad pocket formed in the end effector body, a spring retaining pocket formed in the end effector body adjacent the contact pad pocket and extending to an edge of the end effector body, and a pair of through-holes extending from the spring retaining pocket to the contact pad pocket. The end effector can include a contact pad seated within the contact pad pocket, the contact pad having at least one retaining channel formed therein, and a retaining spring having a pair of retaining arms extending from the retaining spring pocket through the through-holes and into the contact pad pocket. The retaining arms may extend at least partially into the at least one retaining channel of the contact pad and may thereby restrict movement of the contact pad.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: October 21, 2014
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventor: Michael A. Schrameyer