Abstract: The present disclosure is directed to an authentication system, tools, and methods for authentication including a first inspection tool that generates first images for a first inspection of a device, and a first processor for processing the first images using a hashing algorithm, for which the first inspection tool and the first processor are sited at a first location, and a second inspection tool that generates second images for a second inspection of the device, and a second processor for processing the second images using the hashing algorithm, for which the second inspection tool and the second processor are sited at a second location. The second processor compares the first and second sets of hash values to authenticate the device as being authentic and untampered.

Abstract: Embodiments include apparatuses, systems and methods for a computer device with a casing and a substance in the casing substantially surrounding a computer component in the casing. In embodiments, the computer device may be a command and control computer, such as for example, an autonomous or semi-autonomous vehicle. In embodiments, the substance may be an electrically isolative and shear-thickening fluid to provide thermo-mechanical protection to a computer component. In the described embodiments, the substance may dampen mechanical shock or vibrational impact on the processor and the memory. The shear-thickening gel may further be thermally conductive in embodiments. In the embodiments, the casing may be substantially filled with the substance and the substance is to conduct heat away from the processor and the memory toward an outer edge of the casing. Other embodiments may also be described and claimed.

Abstract: Embodiments include apparatuses, systems and methods for a computer device with a casing and a substance in the casing substantially surrounding a computer component in the casing. In embodiments, the computer device may be a command and control computer, such as for example, an autonomous or semi-autonomous vehicle. In embodiments, the substance may be an electrically isolative and shear-thickening fluid to provide thermo-mechanical protection to a computer component. In the described embodiments, the substance may dampen mechanical shock or vibrational impact on the processor and the memory. The shear-thickening gel may further be thermally conductive in embodiments. In the embodiments, the casing may be substantially filled with the substance and the substance is to conduct heat away from the processor and the memory toward an outer edge of the casing. Other embodiments may also be described and claimed.

Abstract: Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.

Abstract: Embodiments herein relate to systems, apparatuses, processing, and techniques related to may generally relate to a printed circuit board (PCB) with one or more strain gauges integrated into the PCB, where the strain gauges are to facilitate an evaluation of PCB integrity during operation of the PCB. The strain gauge may include discrete strain gauges integrated into the PCB at potentially critical stress points within the PCB. The strain gauge may include an electrically conductive daisy chain formation of solder bumps where a change in electrical resistance along the daisy chain formation indicates a strain on the PCB. The strain gauge may include one or more traces included in the PCB, where a change in electrical resistance along the one or more traces is to indicate a strain on the PCB.

Abstract: A belting connection for attaching a first end and a second end of belting. The belting has a thickness. The belting connection mechanism includes a first stepped region, a second stepped region and a first fastener. The first stepped region is proximate the first end. The first stepped region has a first aperture formed therein. The first stepped region has a first thickness. The second stepped region is proximate the second end. The second stepped region has a second aperture formed therein. The second stepped region has a second thickness. The first fastener extends through the first aperture and the second aperture to attach the first end to the second end. The first stepped region at least partially overlaps the second stepped region when the first end is attached to the second end. When the first end is attached to the second end, the first stepped region and the second stepped region have a combined thickness that is no greater than the thickness of the belting.

Abstract: A belting connection for attaching a first end and a second end of belting. The belting has a thickness. The belting connection mechanism includes a first stepped region, a second stepped region and a first fastener. The first stepped region is proximate the first end. The first stepped region has a first aperture formed therein. The first stepped region has a first thickness. The second stepped region is proximate the second end. The second stepped region has a second aperture formed therein. The second stepped region has a second thickness. The first fastener extends through the first aperture and the second aperture to attach the first end to the second end. The first stepped region at least partially overlaps the second stepped region when the first end is attached to the second end. When the first end is attached to the second end, the first stepped region and the second stepped region have a combined thickness that is no greater than the thickness of the belting.

Abstract: Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.

Abstract: Embodiments of the present disclosure describe thermal interface techniques and configurations. In some embodiments, a thermal interface apparatus may include a flexible container, a plurality of thermally conductive objects disposed within the flexible container, and an attachment member coupled to the flexible container for attaching the thermal interface apparatus to a heat sink. The thermally conductive objects may be movable to rearrange their packing within the flexible container in response to deformation of the flexible container. Other embodiments may be described and/or claimed.

Abstract: A computing device having partitions, and a method of communicating between partitions, are disclosed wherein at least one partition comprises: at least one register substantially always accessible to other partitions and capable of defining an address area; at least one address area that may be accessible to other partitions and is capable of being defined by the at least one register; and address areas other than the at least one accessible address area that are not accessible to other partitions. A method of processing interrupts comprising receiving an interrupt, assessing the origin of the interrupt, accepting, rejecting, or further assessing the interrupt, depending on its origin, when further assessing the interrupt, accepting or rejecting the interrupt depending on its contents, and forwarding accepted interrupts but not rejected interrupts to a target processor, and a device carrying out that method are also disclosed.

Abstract: Systems and methods for mitigating latency associated with error detection and correction of a data structure are disclosed. One embodiment of a system may comprise a packet generator that builds a response packet associated with a request for a data structure based on a tag portion of the data structure. The system may also comprise an error detection and correction (EDC) component that detects and corrects errors in the data structure concurrently with the building of the response packet by the packet generator.

Abstract: Distributing communications between paths, comprises providing a plurality of destinations, providing a plurality of communications paths such that each of the plurality of destinations can be accessed over each of the plurality of communications paths, defining destination addresses interleaved over the plurality of destinations, sending communications from a source to a plurality of the interleaved addresses, and selecting different ones of the plurality of paths for successive communications that are sent to addresses on different destinations, wherein the path for a communication is selected using at least a part of the address of the communication.

Abstract: The interior surfaces of gun barrels are protected from wear and corrosion y applying a laminar additive of an organic compound to a gun propellant in such a manner that the heat generated by firing of the gun causes the compound to decompose thereby evolving gaseous products which buffer said interior surfaces from the corrosive and wearing effects of the combustion products of the propellant.