Abstract: A method of recanalizing a lumen of a vessel includes positioning an ultrasonic device having a distal end in a first position within the lumen of the vessel; transmitting pulsed ultrasonic vibrations though the ultrasonic device to the distal end; and advancing the distal end through the lumen to recanalize the vessel.

Abstract: A method of recanalizing a lumen of a vessel includes positioning an ultrasonic device having a distal end in a first position within the lumen of the vessel; transmitting pulsed ultrasonic vibrations though the ultrasonic device to the distal end; and advancing the distal end through the lumen to recanalize the vessel.

Abstract: An ultrasonic system operable at high drive frequencies and/or in pulsed operation is disclosed. The system may be used in a procedure to treat an occluded blood vessel. The system can be used to transmit ultrasonic energy from an ultrasonic transducer to a distal end of an ultrasonic transmission device. The ultrasonic device may operate at a resonant frequency. The resonant frequency can be determined prior to using the device and/or during use. The ultrasonic device may operate in a range of frequencies at or near resonance. Operational parameters including, for example, reflected vibrations, temperature, and/or user input can be used by the system to adjust the driving waveform.

Abstract: An ultrasonic system operable at high drive frequencies and/or in pulsed operation is disclosed. The system may be used in a procedure to treat an occluded blood vessel. The system can be used to transmit ultrasonic energy from an ultrasonic transducer to a distal end of an ultrasonic transmission device. The ultrasonic device may operate at a resonant frequency. The resonant frequency can be determined prior to using the device and/or during use. The ultrasonic device may operate in a range of frequencies at or near resonance. Operational parameters including, for example, reflected vibrations, temperature, and/or user input can be used by the system to adjust the driving waveform.

Abstract: A method for the co-processing of bare die removal from a semiconductor wafer for the improved throughput of the extraction of die from a wafer for subsequent placement onto a substrate. The apparatus includes a pick head containing a nozzle having a suction port within that secures the bare die as it is removed from the wafer. The intermediate holding station has a plurality of nozzles, each having a vacuum port to secure and buffer a multitude of flipped die that are transferred from the pick nozzle. Vacuum flow valves enable the release and transfer of the bare die. Having a multiple of nozzles provides a buffer for the die as they are subsequently transitioned from the pick nozzle, queued within the intermediate transfer station and loaded in tandem onto a die shuttle.

Abstract: The present invention is a method and apparatus for automatically storing and replenishing expandable wafers used in component feeders used in automated printed circuit board assembly systems, for example the Hover-Davis Direct Die Feeder (DDF). In the mass production of printed circuit boards automated pick-and-place equipment accepts die from “chip feeders” and then mounts them at a predetermined location on the circuit board. The present invention includes a wafer or tape reel storage bay and a gripping assembly that is moved by a gantry robot to retrieve a wafer or reel from the storage bay and automatically deposit it into a component feeder.