Patents by Inventor MICHAEL A. TOCKSTEIN

MICHAEL A. TOCKSTEIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8904887
    Abstract: A radio-frequency transparent window having internal conduits for the passage of cooling fluid is configured for simulating a highly uniform thermal environment for testing a device intended for use in space. The device to be tested is placed within a chamber in which a vacuum condition is maintained by a radio-frequency transparent pressure window under a pressure seal. Within the chamber, the thermal window is positioned adjacent, but not in contact with, the pressure window. A radio frequency signal is capable of passing directly through both the thermal window and the pressure window to permit communication with the device being tested within the housing. The thermal window is not in contact with the device so there in no conduction of heat from the device. Radiant heat transfer may occur from the device to the thermal window.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: December 9, 2014
    Assignee: The Aerospace Corporation
    Inventors: Michael A. Tockstein, James P. Nokes, Jon V. Osborn, Dhruv N. Patel, Alan R. Hopkins, John S. Williams, Gary N. Harper
  • Publication number: 20130125676
    Abstract: A radio-frequency transparent window having internal conduits for the passage of cooling fluid is configured for simulating a highly uniform thermal environment for testing a device intended for use in space. The device to be tested is placed within a chamber in which a vacuum condition is maintained by a radio-frequency transparent pressure window under a pressure seal. Within the chamber, the thermal window is positioned adjacent, but not in contact with, the pressure window. A radio frequency signal is capable of passing directly through both the thermal window and the pressure window to permit communication with the device being tested within the housing. The thermal window is not in contact with the device so there in no conduction of heat from the device. Radiant heat transfer may occur from the device to the thermal window.
    Type: Application
    Filed: November 17, 2011
    Publication date: May 23, 2013
    Applicant: THE AEROSPACE CORPORATION
    Inventors: MICHAEL A. TOCKSTEIN, JAMES P. NOKES, JON V. OSBORN, DHRUV N. PATEL, ALAN R. HOPKINS, JOHN S. WILLIAMS