Abstract: Laminates for printed circuit boards having surface layers of curable resin impregnated woven glass fabric and intermediate layers of curable resin impregnated non-woven glass. The intermediate layers contain 200 percent by weight to 275 percent by weight, based on the resin in the intermediate layers, of a thermally stable aluminum hydroxide of the molecular formula Al2O3.nH2O, wherein n has a value of 2.6<n<2.9. The aluminum hydroxide has a specific surface area, measured by the BET method, of 2 to 10 m2/g and a particle size in the D50% range of 5 to 10 ?m.

Abstract: Method for the preparation of a laminate for printed circuit boards by composing together surface layers of curable resin impregnated woven glass fabric and intermediate layers of curable resin impregnated non-woven glass. The intermediate layers contain 200 percent by weight to 275 percent by weight, based on the resin in the intermediate layers, of a thermally stable aluminum hydroxide of the molecular formula Al2O3.nH2O, wherein n has a value of 2.6<n<2.9. The aluminum hydroxide has a specific surface area, measured by the BET method, of 2 to 10 m2/g and a particle size in the D50% range of 5 to 10 ?m.

Abstract: Printed circuit boards of a laminate having surface layers of curable resin impregnated woven glass fabric and intermediate layers of curable resin impregnated non-woven glass. The intermediate layers contain 200 percent by weight to 275 percent by weight, based on the resin in the intermediate layers, of a thermally stable aluminum hydroxide of the molecular formula Al2O3.nH2O, wherein n has a value of 2.6<n<2.9. The aluminum hydroxide has a specific surface area, measured by the BET method, of 2 to 10 m2/g and a particle size in the D50% range of 5 to 10 ?m.

Abstract: Method for the preparation of a laminate for printed circuit boards by composing together surface layers of curable resin impregnated woven glass fabric and intermediate layers of curable resin impregnated non-woven glass. The intermediate layers contain 200 percent by weight to 275 percent by weight, based on the resin in the intermediate layers, of a thermally stable aluminum hydroxide of the molecular formula Al2O3.nH2O, wherein n has a value of 2.6<n<2.9. The aluminum hydroxide has a specific surface area, measured by the BET method, of 2 to 10 m2/g and a particle size in the D50% range of 5 to 10 &mgr;m.

Abstract: Laminates for printed circuit boards having surface layers of curable resin impregnated woven glass fabric and intermediate layers of curable resin impregnated non-woven glass. The intermediate layers contain 200 percent by weight to 275 percent by weight, based on the resin in the intermediate layers, of a thermally stable aluminum hydroxide of the molecular formula Al2O3.nH2O, wherein n has a value of 2.6<n<2.9. The aluminum hydroxide has a specific surface area, measured by the BET method, of 2 to 10 m2/g and a particle size in the D50% range of 5 to 10 &mgr;m.

Abstract: Printed circuit boards of a laminate having surface layers of curable resin impregnated woven glass fabric and intermediate layers of curable resin impregnated non-woven glass. The intermediate layers contain 200 percent by weight to 275 percent by weight, based on the resin in the intermediate layers, of a thermally stable aluminum hydroxide of the molecular formula Al2O3.nH2O, wherein n has a value of 2.6<n<2.9. The aluminum hydroxide has a specific surface area, measured by the BET method, of 2 to 10 m2/g and a particle size in the D50% range of 5 to 10 &mgr;m.

Abstract: Printed circuit board laminates which have improved thermal stability. The improved properties are attributed to the use of a novel aluminium hydroxide which is described by the molecular representation: Al2O3·nH2O where n>2.6 and <2.9.

Abstract: Printed circuit board laminates which have improved thermal stability. The improved properties are attributed to the use of a novel aluminium hydroxide which is described by the molecular representation: Al2O3.nH2O where n>2.6 and <2.9.

Abstract: A nonhygroscopic thermally stable aluminum hydroxide, which is particularly useful for the preparation of thermally stable and fire retardant laminates for printed circuit boards.