Abstract: A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a uniform force hydrostatic bolster plate. A third embodiment of the invention involves an assembled substrate with a uniform force hydrostatic bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.

Abstract: A connection assembly permits a make first and break last connection for primary power. The assembly includes a first pair of connectors, a second pair of connectors, and a compliance element associated with one of the first pair of connectors. The compliance element enables the first pair of connectors to mate prior to the mating of the second pair of connectors and to enable the first pair of connectors to disengage after the disengagement of the second pair of connectors.

Abstract: An airflow blocker component of an apparatus in one example is coupled with a support component. The airflow blocker component comprises a flexible flap portion that is bendable away from the support component into a position that directs one or more airflow portions to promote an increased cooling of one or more thermal components.

Abstract: A bladed server with a chassis having a front and rear is provided. A plurality of blades is disposed within the chassis so that opposing faces and a faceplate of each of the plurality of blades are substantially perpendicular to the front and rear of the chassis. The plurality of blades includes at least one server blade. One or more fans are located at at least one of the front and rear of the chassis such that a flow-path at at least one of an inlet and exit of the one or more fans is substantially parallel to the opposing faces and faceplate of each of the plurality of blades.

Abstract: A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a uniform force hydrostatic bolster plate. A third embodiment of the invention involves an assembled substrate with a uniform force hydrostatic bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.

Abstract: A bladed server with a chassis having a front and rear is provided. A plurality of blades is disposed within the chassis so that opposing faces and a faceplate of each of the plurality of blades are substantially perpendicular to the front and rear of the chassis. The plurality of blades includes at least one server blade. One or more fans are located at at least one of the front and rear of the chassis such that a flow-path at at least one of an inlet and exit of the one or more fans is substantially parallel to the opposing faces and faceplate of each of the plurality of blades.

Abstract: A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on a substrate.

Abstract: A method and apparatus to achieve an electro-mechanical interlock for a hot-swappable component. This invention prevents the misuse and possible damage to the hot-swappable component or the host data processing system due to incorrect insertion or removal of an energized hot-swappable component. One embodiment of the invention involves a method to assemble a hot-swappable power supply with an electro-mechanical interlock into the frame of a data processing system. A second embodiment of the invention involves a method to fabricate an electro-mechanical interlock with a solenoid. A third embodiment of the invention involves a hot-swappable component interlock.

Abstract: An apparatus in one example comprises a first card guide base portion and a card guide end portion. The first card guide base portion is connected with a second card guide base portion in a side-by-side relationship. The card guide end portion is employable with the first card guide base portion to comprise one or more portions of a card guide path. The card guide end portion comprises a face of a color that is different from a color of the first card guide base portion.

Abstract: An apparatus in one example comprises a first card guide base portion and a card guide end portion. The first card guide base portion is connected with a second card guide base portion in a side-by-side relationship. The card guide end portion is employable with the first card guide base portion to comprise one or more portions of a card guide path. The card guide end portion comprises a face of a color that is different from a color of the first card guide base portion.

Abstract: A method and apparatus to achieve an electro-mechanical interlock for a hot-swappable component. This invention prevents the misuse and possible damage to the hot-swappable component or the host data processing system due to incorrect insertion or removal of an energized hot-swappable component. One embodiment of the invention involves a method to assemble a hot-swappable power supply with an electro-mechanical interlock into the frame of a data processing system. A second embodiment of the invention involves a method to fabricate an electro-mechanical interlock with a solenoid. A third embodiment of the invention involves a hot-swappable component interlock.

Abstract: A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a uniform force hydrostatic bolster plate. A third embodiment of the invention involves an assembled substrate with a uniform force hydrostatic bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.