Abstract: Vaccine compositions comprising at least one modified immunogen via in vitro glycosylation methods that provide a rational approach for generating glycosylated versions of immunogens via the reducing end of a linear carbohydrate, the reducing end containing an N-acyl-2-amino moiety. Vaccine compositions comprising a plurality of heterologous immunogens associated with a multivalent carrier, wherein at least one immnunogen is glycosylated. Vaccine compositions comprising multivalent carriers and related methods using the vaccine compositions in various therapeutic and prophylactic applications for inducing an immune response against, treating, or preventing a bacterial, viral, fungal, or protozoan infection.

Abstract: A circuit board for an electrical connector includes a plurality of pairs of first contacts disposed at a first end of the circuit board and a plurality of pairs of second contacts disposed at a second end. Each first contact is connected to a second contact by first conductors disposed at least on a first side of the circuit board. Second conductors are disposed on the circuit board and connected to a first contact or a second contact. A second conductor is associated with a first contact of each pair of first contacts and a second contact of each pair of second contacts. Adjacent second conductors of the first contacts include segments at least partially parallel to each other, forming first coupling regions. Adjacent second conductors of the second contacts include segments at least partially parallel to each other, forming second coupling regions.

Abstract: The invention relates to a circuit board (100) for an electrical connector (400), comprising a plurality of pairs of first contacts (110) disposed at a first end (112) of the circuit board (100) and a plurality of pairs of second contacts (120) disposed at a second end (122), wherein each first contact (110) is connected to a second contact (120) by way of first conductors (115.1-115.8), wherein the first conductors (115.1-115.8) are disposed at least on a first side (104) of the circuit board (110), wherein second conductors (125.2, 125.4, 125.6, 125.8; 135.1, 135.3, 135.5, 135.7) are disposed on a further side (106) of the circuit board (100) and connected to a first contact (110) or a second contact (120), wherein a second conductor (135.1, 135.3, 135.5, 135.7) is associated with a first contact (110.1, 110.3, 110.5, 110.7) of each pair of first contacts (110), wherein the adjacent second conductors (135.1, 135.3, 135.5, 135.