Abstract: A semiconductor package substrate with embedded crack cessation structures and methods of forming the same is provided. Crack cessation structures include blind vias structures, through vias structures, and methods of forming the same are provided. Crack cessation structures may be formed by trenching of one or more structures, and deposition of metallic or insulative materials to form a crack cessation structures in the semiconductor package substrate core.

Abstract: A method and apparatus are provided for manufacturing a packaged assembly by attaching a plurality of multi-height integrated circuit components to an carrier or package substrate with embedded active and/or passive circuit elements and then forming an encapsulating molding compound to cover the multi-height integrated circuit components and then etching or grinding the encapsulating molding compound to expose each of the integrated circuit components at a planar heat dissipation surface so that a heat sink lid/cover can be formed with one or more thermal conductive layers to contact each of the exposed integrated circuit components, thereby enabling removal of heat from the integrated circuit components and the embedded active and/or passive circuit elements of the package substrate.

Abstract: A semiconductor package substrate with embedded passive devices and methods of forming the same is provided. Embedded passive devices include inductors and inductor modules and methods of forming the same are provided. Embedded inductors may be formed by deposition of magnetic core material, trenching of one or more channels, and placement of conductive wires to form an module embeddable in the semiconductor package substrate core. Provided are methods and apparatus for formation of embeddable pot-core, toroidal, and helical inductors.

Abstract: In integrated circuit packages, a coaxial pair of signals are routed through a plated through hole between circuitry on one face of the core substrate material with circuitry on an opposing face of the core substrate material. Provided are methods and apparatuses where signals are routed within a concentric reference conductor within traditional package substrates. Methods for forming a hole in the core substrate material through which the coaxial pair of signals is passed on a fine pitch.

Abstract: In one aspect, a capacitor or network of capacitors is/are provided for vertical power delivery in a package where the capacitor(s) is/are embedded in or forms the entirety of the package substrate core. In a second aspect, a plurality of thin-film capacitor structures are provided for implementing vertical power delivery in a package. In a third aspect a method is provided for fabricating hermetically sealed thin-film capacitors.

Abstract: Various interposers and method of manufacturing related thereto are disclosed. In one aspect, a method of manufacturing is provided that includes coupling an identification structure to an interposer. The identification structure is operable to provide identification information about the interposer. The identification structure is programmable to create or alter the identification information.

Abstract: A method of manufacturing is provided that includes fabricating a first plurality of electrically functional interconnects on a front side of a first semiconductor chip and fabricating a first plurality of electrically non-functional interconnects on a back side of the first semiconductor chip. Additional chips may be stacked on the first semiconductor chip.

Abstract: Various interposers and methods of manufacturing related thereto are disclosed. In one aspect, a method of manufacturing is provided that includes fabricating a first test structure onboard an interposer that has a first side and second side opposite the first side. Additional test structures may be fabricated.

Abstract: Various interposers and method of manufacturing related thereto are disclosed. In one aspect, a method of manufacturing is provided that includes coupling an identification structure to an interposer. The identification structure is operable to provide identification information about the interposer. The identification structure is programmable to create or alter the identification information.

Abstract: A method of manufacturing is provided that includes fabricating a first plurality of electrically functional interconnects on a front side of a first semiconductor chip and fabricating a first plurality of electrically non-functional interconnects on a back side of the first semiconductor chip. Additional chips may be stacked on the first semiconductor chip.

Abstract: A method of manufacturing is provided that includes fabricating a first set of interconnect structures on a side of a first semiconductor substrate. The first semiconductor substrate is operable to have at least one of plural semiconductor substrates stacked on the side. The first set of interconnect structures is arranged in a pattern. Each of the plural semiconductor substrates has a second set of interconnect structures arranged in the pattern, one of the plural semiconductor substrates has a smallest footprint of the plural semiconductor substrates. The pattern has a footprint smaller than the smallest footprint of the plural semiconductor substrates.

Abstract: A method of manufacturing is provided that includes forming a first proximity interconnect on a first side of a first semiconductor chip and a first plurality of interconnect structures projecting from the first side. A second proximity interconnect is formed on a second side of a second semiconductor chip and a second plurality of interconnect structures are formed projecting from the second side. The second semiconductor chip is coupled to the first semiconductor chip so that the second side faces the first side and the first interconnect structures are coupled to the second interconnect structures. The first and second proximity interconnects cooperate to provide a proximity interface. The coupling of the first interconnect structures to the second interconnect structures provides desired vertical and lateral alignment of the first and second proximity interconnects.

Abstract: A multimedication syringe for temporary storage and injection of at least two fluid substances comprising a hollow tubular housing having a generally cylindrical wall, an open rear end and a generally tapered partially closed front end defining a discharge passage; a plunger including a portion sized for moving axially within the housing through substantially the entire length thereof, the portion including a plug surrounding the portion for engaging the inner surface of the housing in a fluid-tight manner, the plunger for forcing fluid in the housing out the discharge passage when the plunger is moved axially within the housing from the open end toward the discharge passage; and a resealable tube in the wall of the housing for transmitting fluid into the housing.

Abstract: A dental prophylactic device has a handle section containing a drive member and a driven section at a substantial angle to the handle section containing a driven member also at an angle to the driving member. The handle section includes a longitudinally oscillatable cam follower supported parallel to the handle axis. When the cam follower is translated around the axis by the rotation of the drive shaft, it is caused to oscillate by one end contacting the stationary cam follower track. The other end engages a slot parallel to the axis of a cam at an angle to the cam follower thereby causing the cam to oscillate back and forth over an arc of at least 50.degree. to approximately 150.degree., maintaining the connection between the cam follower and the cam by the use of the slot which permits the cam follower, in effect, to move up and down with respect to the cam as it oscillates.