Patents by Inventor Michael Allen Godwin

Michael Allen Godwin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8444255
    Abstract: A thermal inkjet printhead may include a substrate and a resistive layer. A thermal resistor may be formed in the resistive layer. A first metal layer may be between the substrate and a resistive layer having a thickness to form a power bus. A dielectric layer may be between the first metal layer and the resistive layer.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: May 21, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chris Bakker, Lawrence H. White, Bjorn Warloe, Reynaldo V. Villavelez, Paul I. Mikulan, Kenneth Stewart, Michael Allen Godwin, Teck-Khim Neo, Joseph M. Torgerson, Lonnie Byers
  • Publication number: 20120293587
    Abstract: A thermal inkjet printhead may include a substrate and a resistive layer. A thermal resistor may be formed in the resistive layer. A first metal layer may be between the substrate and a resistive layer having a thickness to form a power bus. A dielectric layer may be between the first metal layer and the resistive layer.
    Type: Application
    Filed: May 18, 2011
    Publication date: November 22, 2012
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chris Bakker, Lawrence H. White, Bjorn Warloe, Reynaldo V. Villavelez, Paul I. Mikulan, Kenneth Stewart, Michael Allen Godwin, Teck-Khim Neo, Joe Torgerson, Lonnie Byers