Abstract: An embodiment of an apparatus includes first and second core regions, first and second conductors, and an isolation region. The first core region has a first permeability, and the first conductor is disposed in the first core region. The second core region has a second permeability, and the second conductor is disposed in the second core region. And the isolation region is disposed between the first and second core regions, and has a third permeability that is significantly different than the first and second permeabilities. For example, the first and second conductors may be windings of respective first and second inductors, and the isolation region, which may be attached to, or integral with, the first and second core regions, may reduce the amount of magnetic coupling between the inductors to a level that is negligible, such that the inductors may be used in applications that call for magnetically uncoupled inductors.

Abstract: Embodiments disclosed herein provide for a circuit including first die having an active side and a backside, wherein the first die is flip-chip mounted to a carrier. The circuit also includes a second die stacked on the backside of the first die, wherein the second die is stacked on the first die such that a backside of the second die is facing the backside of the first die and an active side of the second die faces away from the first die.

Abstract: Embodiments disclosed herein provide for a circuit including first die having an active side and a backside, wherein the first die is flip-chip mounted to a carrier. The circuit also includes a second die stacked on the backside of the first die, wherein the second die is stacked on the first die such that a backside of the second die is facing the backside of the first die and an active side of the second die faces away from the first die.

Abstract: An embodiment of a power-supply module includes a package having sides, a first power-supply component disposed in the package, and an electromagnetic-interference (EMI) shield disposed adjacent to two sides of the package. For example, such a module may include component-mounting platforms (e.g., a lead frame or printed circuit board) on the top and bottom sides of the module, and these platforms may provide a level of EMI shielding specified for a particular application. Consequently, such a module may provide better EMI shielding than modules with shielding along only one side (e.g., the bottom) of the module. Moreover, if the module components are mounted to, or otherwise thermally coupled to, the shielding platforms, then the module may provide multi-side cooling of the components.

Abstract: Embodiments disclosed herein provide for a circuit including first die having an active side and a backside, wherein the first die is flip-chip mounted to a carrier. The circuit also includes a second die stacked on the backside of the first die, wherein the second die is stacked on the first die such that a backside of the second die is facing the backside of the first die and an active side of the second die faces away from the first die.

Abstract: Embodiments disclosed herein provide for a circuit including first die having an active side and a backside, wherein the first die is flip-chip mounted to a carrier. The circuit also includes a second die stacked on the backside of the first die, wherein the second die is stacked on the first die such that a backside of the second die is facing the backside of the first die and an active side of the second die faces away from the first die.

Abstract: An embodiment of an apparatus includes first and second core regions, first and second conductors, and an isolation region. The first core region has a first permeability, and the first conductor is disposed in the first core region. The second core region has a second permeability, and the second conductor is disposed in the second core region. And the isolation region is disposed between the first and second core regions, and has a third permeability that is significantly different than the first and second permeabilities. For example, the first and second conductors may be windings of respective first and second inductors, and the isolation region, which may be attached to, or integral with, the first and second core regions, may reduce the amount of magnetic coupling between the inductors to a level that is negligible, such that the inductors may be used in applications that call for magnetically uncoupled inductors.

Abstract: Embodiments disclosed herein provide for a circuit including first die having an active side and a backside, wherein the first die is flip-chip mounted to a carrier. The circuit also includes a second die stacked on the backside of the first die, wherein the second die is stacked on the first die such that a backside of the second die is facing the backside of the first die and an active side of the second die faces away from the first die.

Abstract: An embodiment of a power-supply module includes a package having sides, a first power-supply component disposed in the package, and an electromagnetic-interference (EMI) shield disposed adjacent to two sides of the package. For example, such a module may include component-mounting platforms (e.g., a lead frame or printed circuit board) on the top and bottom sides of the module, and these platforms may provide a level of EMI shielding specified for a particular application. Consequently, such a module may provide better EMI shielding than modules with shielding along only one side (e.g., the bottom) of the module. Moreover, if the module components are mounted to, or otherwise thermally coupled to, the shielding platforms, then the module may provide multi-side cooling of the components.