Abstract: Various embodiments of the present technology may provide methods and apparatus for reordering signals that are generated by a sensor. The apparatus may receive the generated signals in the form of a plurality of X-bit input signals and generate a plurality of output signals according to an exemplary reordering scheme. The apparatus may perform the exemplary reordering scheme based on one or more states of a state machine.

Abstract: Various embodiments of the present technology may provide methods and apparatus for reordering signals that are generated by a sensor. The apparatus may receive the generated signals in the form of a plurality of X-bit input signals and generate a plurality of output signals according to an exemplary reordering scheme. The apparatus may perform the exemplary reordering scheme based on one or more states of a state machine.

Abstract: A printer has voice recognition capabilities to transcribe a recorded voice message into printed text. The printer has a communication interface that is connected to a communication line for receiving a voice message. The printer also has an extended memory that stores the voice message, and a speech bank that stores speech patterns and vocabulary words. After the voice message is stored in the extended memory, a speech recognizer compares the voice message to the speech patterns and vocabulary words in the speech bank and translates the voice message into text data. The text data is stored into a print buffer, where the text data may be accessed by a central processing unit (CPU). The CPU controls a print mechanism that actually prints the text data.

Abstract: A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at least one of the modules of the driver is electrically connected. The modules of some of the drivers are positioned outside of the associated bonding pad toward a periphery of the die. The bonding pads may be arranged, for example, in a double- or triple-staggered pattern around the periphery of the die.

Abstract: A system and method of testing IP cores contained in a system-on-chip integrated circuit is disclosed. An operation command is received on an input/output port of the circuit. The operation command includes an operation code component, data component(s), and expected time component. The received operation command is processed to supply test data to each of the IP cores being tested. Result data is received in response to the supplied test data from each of the IP cores being tested. The result data is processed and from the processed result data is generated a status data packet. The status data packet includes the operation code component and a status flag component and is provided on the input/output port.

Abstract: A method for implementing package-level intellectual property (PLIP) preverification for system on chip (SOC) devices includes providing at least one externally connected intellectual property (IP) core with an SOC. A package generic unit is provided with the IP core and is configured for providing external interface functions with respect to the SOC, wherein said package generic unit is pre-verified in silicon and independent of the specific packaging of the SOC. A package adaptation unit is provided with the IP core and is configured for providing external interface functions with respect to the SOC, wherein the package adaptation unit is pre-verified in silicon and dependent upon the specific packaging of the SOC.

Abstract: A printer has voice recognition capabilities to transcribe a recorded voice message into printed text. The printer has a communication interface that is connected to a communication line for receiving a voice message. The printer also has an extended memory that stores the voice message, and a speech bank that stores speech patterns and vocabulary words. After the voice message is stored in the extended memory, a speech recognizer compares the voice message to the speech patterns and vocabulary words in the speech bank and translates the voice message into text data. The text data is stored into a print buffer, where the text data may be accessed by a central processing unit (CPU). The CPU controls a print mechanism that actually prints the text data.

Abstract: A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at least one of the modules of the driver is electrically connected. The modules of some of the drivers are positioned outside of the associated bonding pad toward a periphery of the die. The bonding pads may be arranged, for example, in a double- or triple-staggered pattern around the periphery of the die.