Patents by Inventor Michael Amiel Shore
Michael Amiel Shore has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11094697Abstract: Some embodiments include a memory cell having first and second transistors, and a capacitor vertically displaced relative to the first and second transistors. The capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a source/drain region of the second transistor, and capacitor dielectric material between the first and second nodes. Some embodiments include a memory cell having first and second transistors vertically displaced relative to one another, and a capacitor between the first and second transistors. The capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a source/drain region of the second transistor, and capacitor dielectric material between the first and second nodes.Type: GrantFiled: November 7, 2018Date of Patent: August 17, 2021Assignee: Micron Technology, Inc.Inventors: Gloria Yang, Suraj J. Mathew, Raghunath Singanamalla, Vinay Nair, Scott J. Derner, Michael Amiel Shore, Brent Keeth, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
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Patent number: 10930653Abstract: Some embodiments include an apparatus having memory cells which include capacitors. Bitline pairs couple with each of the memory cells. One of the bitlines within each bitline pair corresponds to a first comparative bitline and the other of the bitlines within each bitline pair corresponds to a second comparative bitline. The bitline pairs extend to sense amplifiers which compare electrical properties of the first and second comparative bitlines to one another. The memory cells are subdivided amongst a first memory cell set using a first set of bitline pairs and a first set of sense amplifiers, and a second memory cell set using a second set of bitline pairs and a second set of sense amplifiers. The second set of bitline pairs has the same bitlines as the first set of bitline pairs, but in a different pairing arrangement as compared to the first set of bitline pairs.Type: GrantFiled: May 21, 2019Date of Patent: February 23, 2021Assignee: Micron Technology, Inc.Inventors: Scott J. Derner, Michael Amiel Shore, Charles L. Ingalls, Steve V. Cole
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Patent number: 10607994Abstract: Some embodiments include a memory cell having first and second transistors and first and second capacitors. The first capacitor is vertically displaced relative to the first transistor. The first capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a common plate structure, and a first capacitor dielectric material between the first and second nodes. The second capacitor is vertically displaced relative to the second transistor. The second capacitor has a third node electrically coupled with a source/drain region of the second transistor, a fourth node electrically coupled with the common plate structure, and a second capacitor dielectric material between the first and second nodes. Some embodiments include memory arrays having 2T-2C memory cells.Type: GrantFiled: November 7, 2018Date of Patent: March 31, 2020Assignee: Micron Technology, Inc.Inventors: Scott J. Derner, Michael Amiel Shore
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Publication number: 20190279984Abstract: Some embodiments include an apparatus having memory cells which include capacitors. Bitline pairs couple with each of the memory cells. One of the bitlines within each bitline pair corresponds to a first comparative bitline and the other of the bitlines within each bitline pair corresponds to a second comparative bitline. The bitline pairs extend to sense amplifiers which compare electrical properties of the first and second comparative bitlines to one another. The memory cells are subdivided amongst a first memory cell set using a first set of bitline pairs and a first set of sense amplifiers, and a second memory cell set using a second set of bitline pairs and a second set of sense amplifiers. The second set of bitline pairs has the same bitlines as the first set of bitline pairs, but in a different pairing arrangement as compared to the first set of bitline pairs.Type: ApplicationFiled: May 21, 2019Publication date: September 12, 2019Inventors: Scott J. Derner, Michael Amiel Shore, Charles L. Ingalls, Steve V. Cole
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Patent number: 10347635Abstract: Some embodiments include an apparatus having memory cells which include capacitors. Bitline pairs couple with each of the memory cells. One of the bitlines within each bitline pair corresponds to a first comparative bitline and the other of the bitlines within each bitline pair corresponds to a second comparative bitline. The bitline pairs extend to sense amplifiers which compare electrical properties of the first and second comparative bitlines to one another. The memory cells are subdivided amongst a first memory cell set using a first set of bitline pairs and a first set of sense amplifiers, and a second memory cell set using a second set of bitline pairs and a second set of sense amplifiers. The second set of bitline pairs has the same bitlines as the first set of bitline pairs, but in a different pairing arrangement as compared to the first set of bitline pairs.Type: GrantFiled: May 22, 2018Date of Patent: July 9, 2019Assignee: Micron Technology, Inc.Inventors: Scott J. Derner, Michael Amiel Shore, Charles L. Ingalls, Steve V. Cole
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Publication number: 20190088652Abstract: Some embodiments include a memory cell having first and second transistors, and a capacitor vertically displaced relative to the first and second transistors. The capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a source/drain region of the second transistor, and capacitor dielectric material between the first and second nodes. Some embodiments include a memory cell having first and second transistors vertically displaced relative to one another, and a capacitor between the first and second transistors. The capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a source/drain region of the second transistor, and capacitor dielectric material between the first and second nodes.Type: ApplicationFiled: November 7, 2018Publication date: March 21, 2019Applicant: Micron Technology, Inc.Inventors: Gloria Yang, Suraj J. Mathew, Raghunath Singanamalla, Vinay Nair, Scott J. Derner, Michael Amiel Shore, Brent Keeth, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
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Publication number: 20190088653Abstract: Some embodiments include a memory cell having first and second transistors and first and second capacitors. The first capacitor is vertically displaced relative to the first transistor. The first capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a common plate structure, and a first capacitor dielectric material between the first and second nodes. The second capacitor is vertically displaced relative to the second transistor. The second capacitor has a third node electrically coupled with a source/drain region of the second transistor, a fourth node electrically coupled with the common plate structure, and a second capacitor dielectric material between the first and second nodes. Some embodiments include memory arrays having 2T-2C memory cells.Type: ApplicationFiled: November 7, 2018Publication date: March 21, 2019Applicant: Micron Technology, Inc.Inventors: Scott J. Derner, Michael Amiel Shore
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Publication number: 20190006365Abstract: Some embodiments include an apparatus having memory cells which include capacitors. Bitline pairs couple with each of the memory cells. One of the bitlines within each bitline pair corresponds to a first comparative bitline and the other of the bitlines within each bitline pair corresponds to a second comparative bitline. The bitline pairs extend to sense amplifiers which compare electrical properties of the first and second comparative bitlines to one another. The memory cells are subdivided amongst a first memory cell set using a first set of bitline pairs and a first set of sense amplifiers, and a second memory cell set using a second set of bitline pairs and a second set of sense amplifiers. The second set of bitline pairs has the same bitlines as the first set of bitline pairs, but in a different pairing arrangement as compared to the first set of bitline pairs.Type: ApplicationFiled: May 22, 2018Publication date: January 3, 2019Applicant: Micron Technology , Inc.Inventors: Scott J. Derner, Michael Amiel Shore, Charles L. Ingalls, Steve V. Cole
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Patent number: 10157926Abstract: Some embodiments include a memory cell having first and second transistors, and a capacitor vertically displaced relative to the first and second transistors. The capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a source/drain region of the second transistor, and capacitor dielectric material between the first and second nodes. Some embodiments include a memory cell having first and second transistors vertically displaced relative to one another, and a capacitor between the first and second transistors. The capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a source/drain region of the second transistor, and capacitor dielectric material between the first and second nodes.Type: GrantFiled: July 31, 2017Date of Patent: December 18, 2018Assignee: Micron Technology, Inc.Inventors: Gloria Yang, Suraj J. Mathew, Raghunath Singanamalla, Vinay Nair, Scott J. Derner, Michael Amiel Shore, Brent Keeth, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
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Patent number: 10153281Abstract: Some embodiments include a memory cell having first and second transistors and first and second capacitors. The first capacitor is vertically displaced relative to the first transistor. The first capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a common plate structure, and a first capacitor dielectric material between the first and second nodes. The second capacitor is vertically displaced relative to the second transistor. The second capacitor has a third node electrically coupled with a source/drain region of the second transistor, a fourth node electrically coupled with the common plate structure, and a second capacitor dielectric material between the first and second nodes. Some embodiments include memory arrays having 2T-2C memory cells.Type: GrantFiled: July 31, 2017Date of Patent: December 11, 2018Assignee: Micron Technology, Inc.Inventors: Scott J. Derner, Michael Amiel Shore
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Publication number: 20180061835Abstract: Some embodiments include a memory cell having first and second transistors, and a capacitor vertically displaced relative to the first and second transistors. The capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a source/drain region of the second transistor, and capacitor dielectric material between the first and second nodes. Some embodiments include a memory cell having first and second transistors vertically displaced relative to one another, and a capacitor between the first and second transistors. The capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a source/drain region of the second transistor, and capacitor dielectric material between the first and second nodes.Type: ApplicationFiled: July 31, 2017Publication date: March 1, 2018Inventors: Gloria Yang, Suraj J. Mathew, Raghunath Singanamalla, Vinay Nair, Scott J. Derner, Michael Amiel Shore, Brent Keeth, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
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Publication number: 20180061834Abstract: Some embodiments include a memory cell having first and second transistors and first and second capacitors. The first capacitor is vertically displaced relative to the first transistor. The first capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a common plate structure, and a first capacitor dielectric material between the first and second nodes. The second capacitor is vertically displaced relative to the second transistor. The second capacitor has a third node electrically coupled with a source/drain region of the second transistor, a fourth node electrically coupled with the common plate structure, and a second capacitor dielectric material between the first and second nodes. Some embodiments include memory arrays having 2T-2C memory cells.Type: ApplicationFiled: July 31, 2017Publication date: March 1, 2018Inventors: Scott J. Derner, Michael Amiel Shore