Patents by Inventor Michael Anthony DENIO

Michael Anthony DENIO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11907145
    Abstract: An integrated circuit (IC) includes first and second memory devices and a bridge. The IC also includes a first interconnect segment coupled between the first memory device and the bridge. The IC further includes a second interconnect segment coupled between the first and second memory devices, and a third interconnect segment coupled between the bridge and the second memory device. The IC includes a first DMA circuit coupled to the first interconnect segment, and a second DMA circuit coupled to the second interconnect segment. A fourth interconnect segment is coupled between the first and second DMA circuits.
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: February 20, 2024
    Assignee: Texas Instruments Incorporated
    Inventors: Brian Jason Karguth, Charles Lance Fuoco, Samuel Paul Visalli, Michael Anthony Denio
  • Publication number: 20230042413
    Abstract: An integrated circuit (IC) includes first and second memory devices and a bridge. The IC also includes a first interconnect segment coupled between the first memory device and the bridge. The IC further includes a second interconnect segment coupled between the first and second memory devices, and a third interconnect segment coupled between the bridge and the second memory device. The IC includes a first DMA circuit coupled to the first interconnect segment, and a second DMA circuit coupled to the second interconnect segment. A fourth interconnect segment is coupled between the first and second DMA circuits.
    Type: Application
    Filed: October 24, 2022
    Publication date: February 9, 2023
    Inventors: Brian Jason KARGUTH, Charles Lance FUOCO, Samuel Paul VISALLI, Michael Anthony DENIO
  • Patent number: 11481345
    Abstract: An integrated circuit (IC) includes first and second memory devices and a bridge. The IC also includes a first interconnect segment coupled between the first memory device and the bridge. The IC further includes a second interconnect segment coupled between the first and second memory devices, and a third interconnect segment coupled between the bridge and the second memory device. The IC includes a first DMA circuit coupled to the first interconnect segment, and a second DMA circuit coupled to the second interconnect segment. A fourth interconnect segment is coupled between the first and second DMA circuits.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: October 25, 2022
    Assignee: Texas Instruments Incorporated
    Inventors: Brian Jason Karguth, Charles Lance Fuoco, Samuel Paul Visalli, Michael Anthony Denio
  • Publication number: 20210073150
    Abstract: An integrated circuit (IC) includes first and second memory devices and a bridge. The IC also includes a first interconnect segment coupled between the first memory device and the bridge. The IC further includes a second interconnect segment coupled between the first and second memory devices, and a third interconnect segment coupled between the bridge and the second memory device. The IC includes a first DMA circuit coupled to the first interconnect segment, and a second DMA circuit coupled to the second interconnect segment. A fourth interconnect segment is coupled between the first and second DMA circuits.
    Type: Application
    Filed: November 17, 2020
    Publication date: March 11, 2021
    Inventors: Brian Jason KARGUTH, Charles Lance FUOCO, Samuel Paul VISALLI, Michael Anthony DENIO
  • Patent number: 10838896
    Abstract: An integrated circuit (IC) includes first and second memory devices and a bridge. The IC also includes a first interconnect segment coupled between the first memory device and the bridge. The IC further includes a second interconnect segment coupled between the first and second memory devices, and a third interconnect segment coupled between the bridge and the second memory device. The IC includes a first DMA circuit coupled to the first interconnect segment, and a second DMA circuit coupled to the second interconnect segment. A fourth interconnect segment is coupled between the first and second DMA circuits.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: November 17, 2020
    Assignee: Texas Instruments Incorporated
    Inventors: Brian Jason Karguth, Charles Lance Fuoco, Samuel Paul Visalli, Michael Anthony Denio
  • Publication number: 20200117626
    Abstract: An integrated circuit (IC) includes first and second memory devices and a bridge. The IC also includes a first interconnect segment coupled between the first memory device and the bridge. The IC further includes a second interconnect segment coupled between the first and second memory devices, and a third interconnect segment coupled between the bridge and the second memory device. The IC includes a first DMA circuit coupled to the first interconnect segment, and a second DMA circuit coupled to the second interconnect segment. A fourth interconnect segment is coupled between the first and second DMA circuits.
    Type: Application
    Filed: October 14, 2019
    Publication date: April 16, 2020
    Inventors: Brian Jason KARGUTH, Charles Lance FUOCO, Samuel Paul VISALLI, Michael Anthony DENIO