Abstract: A drive train for a wind-up injection device is described. The drive train includes a torsional energy storage adapted to be loaded or unloaded by a rotatable element, a rotatable user handle, a rotationally driveable expelling mechanism adapted to expel the liquid drug, and a clutch element coupled with the torsional energy storage via the rotatable element and including a ratchet for maintaining the rotatable element at one of a number of discrete angular positions against the torque of the torsional energy storage. The clutch element is adapted to transmit the torque from the user handle to the torsional energy storage, or alternatively from the torsional energy storage to the expelling mechanism. The ratchet is switchable from one position to an adjacent position by a torque transmitted from the user handle to the torsional energy storage. The drive train is adapted to dampen torque peaks visco-elastically and/or visco-frictionally.

Abstract: A button for a drug delivery device with a reduced operating loudness includes a plate-like button body forming a touch surface, wherein the plate-like button body is coupled by an axial supporting member to a noise-generating interface of the drug delivery device and movable into a longitudinal direction of the drug delivery device, wherein the plate-like button body includes a material composite with at least one first component consisting of a first material and at least one second component consisting of a second material different from the first material, wherein the at least one first component and the at least one second component are coupled via at least one coupling plane that is at least sectionwise slanted or perpendicular to the longitudinal direction. Further, the disclosure describes a button assembly for a drug delivery device which is shock resistant.

Abstract: An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive backside. Conductive pathways extend between the front and back sides of the integrated circuit. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive pathways and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side.

Abstract: An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive backside. Conductive pathways extend between the front and back sides of the integrated circuit. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive pathways and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side.

Abstract: An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive back side. Conductive vias extend through the integrated circuit between the front and back sides. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive vias and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side.

Abstract: An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive back side. Conductive vias extend through the integrated circuit between the front and back sides. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive vias and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side.