Patents by Inventor Michael Anthony STOLFI

Michael Anthony STOLFI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Film stack for lithography applications
    Patent number: 11495461
    Abstract: Methods for forming a film stack comprising a hardmask layer and etching such hardmask layer to form features in the film stack are provided. The methods described herein facilitate profile and dimension control of features through a proper profile management scheme formed in the film stack. In one or more embodiments, a method for etching a hardmask layer includes forming a hardmask layer on a substrate, where the hardmask layer contains a metal-containing material containing a metal element having an atomic number greater than 28, supplying an etching gas mixture to the substrate, and etching the hardmask layer exposed by a photoresist layer.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: November 8, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Tejinder Singh, Suketu Arun Parikh, Daniel Lee Diehl, Michael Anthony Stolfi, Jothilingam Ramalingam, Yong Cao, Lifan Yan, Chi-I Lang, Hoyung David Hwang
  • FILM STACK FOR LITHOGRAPHY APPLICATIONS
    Publication number: 20200273705
    Abstract: Methods for forming a film stack comprising a hardmask layer and etching such hardmask layer to form features in the film stack are provided. The methods described herein facilitate profile and dimension control of features through a proper profile management scheme formed in the film stack. In one or more embodiments, a method for etching a hardmask layer includes forming a hardmask layer on a substrate, where the hardmask layer contains a metal-containing material containing a metal element having an atomic number greater than 28, supplying an etching gas mixture to the substrate, and etching the hardmask layer exposed by a photoresist layer.
    Type: Application
    Filed: February 25, 2020
    Publication date: August 27, 2020
    Inventors: Tejinder SINGH, Suketu Arun PARIKH, Daniel Lee DIEHL, Michael Anthony STOLFI, Jothilingam RAMALINGAM, Yong CAO, Lifan YAN, Chi-I LANG, Hoyung David HWANG