Patents by Inventor Michael Arnett Smith

Michael Arnett Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating electromagnetic bandgap (EBG) structures for microwave/millimeterwave applications using laser processing of unfired low temperature co-fired ceramic (LTCC) tape
    Patent number: 9579748
    Abstract: Substrates and methods to fabricate and use millimeter wave Sievenpiper EBG structures such that the conductive portions are internal to an LTCC package.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: February 28, 2017
    Assignees: E I DU PONT NEMOURS AND COMPANY, WEMTEC Inc.
    Inventors: Deepukumar M Nair, Michael Arnett Smith, James M Parisi, Elizabeth D Hughes, William E. Mckinzie, III
  • Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applications
    Patent number: 9153863
    Abstract: Disclosed are methods and devices of microwave/millimeter wave package application.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: October 6, 2015
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Deepukumar M Nair, Michael Arnett Smith, Bradley Thrasher, James M Parisi, Joao Carlos Malerbi, Elizabeth D Hughes
  • METHOD OF MAKING MICROWAVE AND MILLIMETERWAVE ELECTRONIC CIRCUITS BY LASER PATTERNING OF UNFIRED LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) SUBSTRATES
    Publication number: 20140353005
    Abstract: Disclosed are methods of using a laser to pattern unfired, screen printed metallization on unfired (green) LTCC tape material by a subtractive process especially on the internal layers of an LTCC circuit.
    Type: Application
    Filed: June 4, 2014
    Publication date: December 4, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: DEEPUKUMAR M. NAIR, MICHAEL ARNETT SMITH, BRADLEY THRASHER, JAMES M. PARISI, ELIZABETH D. HUGHES
  • METHOD OF FABRICATING ELECTROMAGNETIC BANDGAP (EBG) STRUCTURES FOR MICROWAVE/MILLIMETERWAVE APPLICATIONS USING LASER PROCESSING OF UNFIRED LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) TAPE
    Publication number: 20140354513
    Abstract: Substrates and methods to fabricate and use millimeter wave Sievenpiper EBG structures such that the conductive portions are internal to an LTCC package.
    Type: Application
    Filed: June 4, 2014
    Publication date: December 4, 2014
    Inventors: DEEPUKUMAR M. NAIR, Michael Arnett Smith, James M Parisi, Elizabeth D. Hughes, William E. Mckinzie, III
  • Low temperature co-fired ceramic structure for high frequency applications and process for making same
    Patent number: 8742262
    Abstract: Disclosed herein is a multilayer low temperature co-fired ceramic (LTCC) structure comprising a multilayer low temperature co-fired ceramic comprising glass-ceramic dielectric layers with screen printed thick film inner conductors on portions of the layers and with thin film outer conductors deposited on the upper and lower outer surfaces of the LTCC. At least a portion of the thin film outer conductors is patterned in the form of lines and the spacings between the lines are less then 50 ?m. Also disclosed is a process for making the LTCC structure.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: June 3, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventors: Scott E. Gordon, Elizabeth D. Hughes, Joao Carlos Malerbi, Deepukumar M. Nair, Kumaran Manikantan Nair, James M. Parisi, Michael Arnett Smith, Ken E. Souders
  • LOW TEMPERATURE CO-FIRED CERAMIC STRUCTURE FOR HIGH FREQUENCY APPLICATIONS AND PROCESS FOR MAKING SAME
    Publication number: 20120305296
    Abstract: Disclosed herein is a multilayer low temperature co-fired ceramic (LTCC) structure comprising a multilayer low temperature co-fired ceramic comprising glass-ceramic dielectric layers with screen printed thick film inner conductors on portions of the layers and with thin film outer conductors deposited on the upper and lower outer surfaces of the LTCC. At least a portion of the thin film outer conductors is patterned in the form of lines and the spacings between the lines are less then 50 ?m. Also disclosed is a process for making the LTCC structure.
    Type: Application
    Filed: May 30, 2012
    Publication date: December 6, 2012
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: SCOTT E. GORDON, ELIZABETH D. HUGHES, JOAO CARLOS MALERBI, DEEPUKUMAR M. NAIR, KUMARAN MANIKANTAN NAIR, JAMES M. PARISI, MICHAEL ARNETT SMITH, KEN E. SOUDERS
  • IMPROVED PROCESS FOR PRESSURELESS CONSTRAINED SINTERING OF LOW TEMPERATURE CO-FIRED CERAMIC WITH SURFACE CIRCUIT PATTERNS
    Publication number: 20110027539
    Abstract: This invention relates to a process which produces crack-free, non-camber, distortion-free, zero-shrink, LTCC bodies, composites, modules or packages from precursor green (unfired) laminates of multilayer structure with one or more different dielectric tape chemistries that are patterned with co-fireable thick film circuitry materials such as conductor, via fill, capacitor, inductor, or resistor for each tape layer including both top and bottom surface tape layers in direct contact with the sacrificial release tape.
    Type: Application
    Filed: June 13, 2007
    Publication date: February 3, 2011
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Carl B Wang, Michael Arnett Smith