Abstract: The present invention relates to a moulding compound which contains at least 50 wt. % of a semicrystalline poly amide component and the moulding compound contains a filler which imparts conductivity to the moulding compound, wherein the moulding compound does not have a crystallite melting point (Tm) below 50° C. and the polyamide component contains components A and B, A) PA homopolymer of the type PA X.Y or PAZ, where X is a diamine radical (DA), Y is a dicarboxyl radical (DC), and Z is an alpha-omega amino acid radical; B) PA copolymer of the type PA X?.Y?, where X is a diamine radical (DA?) and Y? is a dicarboxyl radical (DC?); wherein a portion of the diamine radical (DA?) is replaced by a polyether having at least two amino termini or at least two hydroxy termini; wherein the proportion of polyether in the sum of components A and Bis between 0.5 and 15 wt. % and wherein the proportion of filler is 2.5 to 6 wt. % based on the total mass of the poly amide component and the filler.

Abstract: Multilayer composites are obtained from a molding composition which contains the following components: a) 100 parts by weight of polyamide and b) from 0.005 to 10 parts by weight of a compound having at least two carbonate units by coextruding with a molding composition based on a high-melting-point polymer whose crystallite melting point Tm is at least 255° C. and/or whose glass transition temperature Tg is at least 180° C.

Abstract: A thermoplastic multilayer composite, and articles made therefrom, which has at least one layer I of a thermoplastic molding composition, at least one layer II of a further thermoplastic molding composition, bonded together with at least one layer of an adhesion promoter disposed between at least one layer I and at least one layer II. The adhesion promoter is at least 5% by weight of a graft copolymer prepared from 0.5 to 25% by weight, based on the total amount of graft copolymer, of a polyamine having at least 4 nitrogen atoms and having a number average molecular weight Mn of at least 146 g/mol, and polyamide-forming monomers selected from lactams, &ohgr;-aminocarboxylic acids, equimolar mixtures of diamines and dicarboxylic acids, and their mixtures.