Patents by Inventor Michael B. Field

Michael B. Field has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ENCLOSURE ASSEMBLIES, AND RELATED DEVICES AND METHODS
    Publication number: 20240107654
    Abstract: A cooling plate assembly for dual-sided cooling, the cooling plate assembly can include a first cooling plate and a second cooling plate. The first cooling plate that has a first cooling plate connector side and a first cooling plate cooling side that is opposite the first cooling plate connector side. The second cooling plate that has a second cooling plate connector side and a second cooling plate cooling side that is opposite the second cooling plate connector side. The second cooling plate is configured to attach to the first cooling plate such that formed between the first cooling plate connector side and the second cooling plate connector side is at least one cooling passage through which a cooling fluid is flowed to transfer heat from both the first cooling plate cooling side and the second cooling plate cooling side to the cooling fluid.
    Type: Application
    Filed: December 3, 2021
    Publication date: March 28, 2024
    Inventors: Vineet K. Pandey, William B. Fields, Isreal I. Llaguno, Bharadwaj Ramakrishnan, Bradford K.O. Palmer, Jaydeep V. Patel, Michael Hays, Dakshina S. Murthy-Bellur, Amir Tajuddin Tamboli, Rohit Saha
  • Large area bulk superconductors
    Patent number: 6410487
    Abstract: A bulk superconductor having a thickness of not less than about 100 microns is carried by a polycrystalline textured substrate having misorientation angles at the surface thereof not greater than about 15°; the bulk superconductor may have a thickness of not less than about 100 microns and a surface area of not less than about 50 cm2. The textured substrate may have a thickness not less than about 10 microns and misorientation angles at the surface thereof not greater than about 15°. Also disclosed is a process of manufacturing the bulk superconductor and the polycrystalline biaxially textured substrate material.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: June 25, 2002
    Assignee: The University of Chicago
    Inventors: Dean J. Miller, Michael B. Field