Abstract: The present invention provides a multi-piece clamp ring, adapted to be used in plasma assisted and other processes in electronic device fabrication and is especially suitable for use in an etching or deposition process. The clamp ring includes an upper shield portion that typically is consumed in the etching process and a lower ring portion protected by the upper shield portion which can be re-used. The upper shield portion protects the lower ring portion from the etching process. The upper shield portion is adapted to be fastened to a chamber member to retain alignment with a substrate during the etching process. The lower ring portion is allowed to move and align itself with the upper shield portion or be removably fastened with the upper shield portion.