Abstract: A card body for a chip card, includes a module opening for receiving a chip module having a coil, a metal layer having a slot which extends from an outer edge of the metal layer to the module opening, and a plastic layer which is applied to one side of the metal layer. The module opening has a blind hole cut out of the plastic layer and the metal layer and an outer area which surrounds the blind hole which is cut out of only part of the height of the plastic layer. A further slot is provided in the outer region in the metal layer.

Abstract: A method is for determining a value of an electromagnetic field strength by means of a chip card, having the steps of: providing a chip card having a coil and an integrated circuit; calibrating the chip card by means of different values of an electromagnetic field strength, wherein a power of the integrated circuit is determined in each case for a specific value of the electromagnetic field strength; correlating the different values of the electro-magnetic field strengths with a corresponding power of the integrated circuit in each case; applying an electromagnetic field strength of an unknown value to the chip card; determining a power of the integrated circuit; and determining the value of the electromagnetic field strength corresponding to this power by means of the correlation.

Abstract: A card body for a chip card, includes a metal layer made of a steel alloy. The steel alloy of the metal layer contains 0.07 to 4 wt. % of carbon, and/or the steel alloy of the metal layer contains 0.01 to 0.3 wt. % of sulfur.

Abstract: A method for producing a chip card, such that the chip card includes a card body and a chip module arranged thereon. The method has the steps of providing a card body; producing a cavity for receiving the chip module; producing at least one component opening for each of one or more electronic components in an overlap region, which is covered by the chip module arranged later; applying soldering material onto the electronic component(s), into the at least one component opening, and/or onto a lower face of the chip module; placing the electronic component(s) in the at least one component opening; introducing the chip module into the cavity; and heating the soldering material.

Abstract: A card body for a chip card, having two metal layers, between which a nonconductive central layer is arranged, wherein a module opening for receive a chip module is already produced in one metal layer and in the aforementioned metal layer or can still be produced in a module opening zone, and two slots, one of which extends from the peripheral surface of the card body to the module opening or to the module opening zone in a metal layer and severs each of the metal layers at a respective height. The entry angle of the two slots into the metal layer does not equal 90° relative to the surface of the metal layer in each case, and the two slots have opposite inclinations relative to a surface normal of the surface of the metal layer.

Abstract: A card-shaped data carrier includes a card body, a chip element, and a stabilization structure. The chip element is received in the card body and has a peripheral chip element edge, which defines a transition area peripherally around the chip element and between the chip element and the card body. The stabilization structure is arranged in the card body and extends at least in some sections in the transition area and provides a structural reinforcement of the transition area.

Abstract: A method for producing a card body for a chip card, includes the steps of: providing a flat card body having a metallic core, wherein the metallic core is covered at least partly with a plastic layer at least on a main area and wherein the metallic core has a slit running from an outer edge of the main area into this main area; and incorporating a cavity having a bottom area for receiving a chip module into the plastic layer in such a way that the cavity covers the slit at least partly and that at least along the slit an excess material remains with respect to the bottom area.

Abstract: A card body for a chip card, includes a module opening for receiving a chip module having a coil, a metal layer having a slot which extends from an outer edge of the metal layer to the module opening, and a plastic layer which is applied to one side of the metal layer. The module opening has a blind hole cut out of the plastic layer and the metal layer and an outer area which surrounds the blind hole which is cut out of only part of the height of the plastic layer. A further slot is provided in the outer region in the metal layer.

Abstract: A method for manufacturing a card body for a chip card, includes the steps of: supplying a metallic base body with two opposite main faces and a circumferential peripheral face connecting the two main faces, wherein in the base body a module opening for receiving a chip module has already been produced or will still be produced in a module opening zone, and producing a slot on the peripheral face between the two main faces. The slot is formed from the peripheral face up to the module opening or up to the module opening zone. An entry angle (?) of the slot into at least one of the two main faces is not equal to ninety degrees with respect to the main face.

Abstract: A method is provided for producing a chip card body having a metallic core layer for a contactless or dual-interface chip card. A slot in the metallic core layer for reducing eddy currents is generated not in the metallic multiple-copy sheet itself but instead only in the metallic core layer extracted from the metallic multiple-copy sheet. In this way, there are no short-circuit-forming metal chips left in the slot, since the slot is generated only after the extraction of the metallic core layer from the multiple-copy sheet.

Abstract: A method is provided for testing a card body with a metallic core layer for a contactless or dual-interface chip card, and a method is provided for manufacturing a contactless or dual-interface chip card. The method involves testing the functionality of the card body before the chip module employed for testing, or a corresponding chip module, is fixed into the cavity of the card body. A card body having impurities, a partial closure or full closure in the slot of its metallic core layer fails the test and is not used at all for fixing the chip module and for the subsequent manufacturing steps.

Abstract: A method for producing a chip card, such that the chip card includes a card body and a chip module arranged thereon. The method has the steps of providing a card body; producing a cavity for receiving the chip module; producing at least one component opening for each of one or more electronic components in an overlap region, which is covered by the chip module arranged later; applying soldering material onto the electronic component(s), into the at least one component opening, and/or onto a lower face of the chip module; placing the electronic component(s) in the at least one component opening; introducing the chip module into the cavity; and heating the soldering material.

Abstract: A card body for a chip card, having two metal layers, between which a nonconductive central layer is arranged, wherein a module opening for receive a chip module is already produced in one metal layer and in the aforementioned metal layer or can still be produced in a module opening zone, and two slots, one of which extends from the peripheral surface of the card body to the module opening or to the module opening zone in a metal layer and severs each of the metal layers at a respective height. The entry angle of the two slots into the metal layer does not equal 90° relative to the surface of the metal layer in each case, and the two slots have opposite inclinations relative to a surface normal of the surface of the metal layer.

Abstract: A method is for determining a value of an electromagnetic field strength by means of a chip card, having the steps of: providing a chip card having a coil and an integrated circuit; calibrating the chip card by means of different values of an electromagnetic field strength, wherein a power of the integrated circuit is determined in each case for a specific value of the electromagnetic field strength; correlating the different values of the electro-magnetic field strengths with a corresponding power of the integrated circuit in each case; applying an electromagnetic field strength of an unknown value to the chip card; determining a power of the integrated circuit; and determining the value of the electromagnetic field strength corresponding to this power by means of the correlation.

Abstract: A method for manufacturing a card body for a chip card, includes the steps of: supplying a metallic base body with two opposite main faces and a circumferential peripheral face connecting the two main faces, wherein in the base body a module opening for receiving a chip module has already been produced or will still be produced in a module opening zone, and producing a slot on the peripheral face between the two main faces. The slot is formed from the peripheral face up to the module opening or up to the module opening zone. An entry angle (?) of the slot into at least one of the two main faces is not equal to ninety degrees with respect to the main face.

Abstract: A method for producing a card body for a chip card, includes the steps of: providing a flat card body having a metallic core, wherein the metallic core is covered at least partly with a plastic layer at least on a main area and wherein the metallic core has a slit running from an outer edge of the main area into this main area; and incorporating a cavity having a bottom area for receiving a chip module into the plastic layer in such a way that the cavity covers the slit at least partly and that at least along the slit an excess material remains with respect to the bottom area.

Abstract: In a method for manufacturing a multi-layered card body with a metallic core layer and at least one cover layer for a contactless or dual-interface chip card an adhesive is applied to at least one side of the metallic core layer in such a manner that a slot in the metallic core layer is filled with the adhesive. The metallic core layer is subsequently laminated with the cover layer by means of the adhesive. As a result, no short-circuit can occur in the slot, e.g. by metal chips remaining in the slot, because the slot has already been filled with the adhesive.

Abstract: A method is provided for testing a card body with a metallic core layer for a contactless or dual-interface chip card, and a method is provided for manufacturing a contactless or dual-interface chip card. The method involves testing the functionality of the card body before the chip module employed for testing, or a corresponding chip module, is fixed into the cavity of the card body. A card body having impurities, a partial closure or full closure in the slot of its metallic core layer fails the test and is not used at all for fixing the chip module and for the subsequent manufacturing steps.

Abstract: The present invention relates to a security module and to a corresponding method for operating the security module for realizing a secure memory management. The subject matter according to the invention takes into account existing hardware components, for example a smart card, and can thus be integrated into existing smart cards with particularly little technical effort. The secure memory management prevents attacks against memory segments of the data memory.

Abstract: A method for authorizing a transaction reading out a first code and a second code by means of a first mobile device. The second code contains information items for decrypting the first code. From the read-out codes a first signature confirming the transaction vis-à-vis the system is generated, which is transmitted to the system. Subsequently, an authorization of the transaction is effected.