Abstract: An apparatus and method for increasing integrated circuit density comprising an upper die and a lower die, the latter preferably a flip chip, which are connected to a conductor-carrying substrate or a leadframe. The upper die is attached back-to-back to the lower die with a layer of adhesive applied over the back side of the lower die. Bond wires or TAB leads are attached between bond pads on the upper die and corresponding conductive trace or lead ends on the substrate. The upper die may be smaller than the lower die such that a small discrete component such as a resistor, capacitor, or the like can be attached to the adhesive not covered by the upper die. Bond wires can be attached between the upper die and the component, as well as between the component and the substrate. One or more additional die may be stacked on the upper die and electrically connected to the substrate. Furthermore, multiple lower dice can be arranged on the substrate to support upper dice bridged between the lower dice.

Abstract: An anti-jackknifing device adapted for engagement between a tractor having a fifth wheel engaged with a trailer. The device features a pair of catch arms rotationally engaged to a mount with the tractor. The distal ends of the catch arms move between an engaged position in a horizontal path between two trailer mounted engaging components adapted to engage the distal end and a disengaged position out of the path. The distal ends of the catch arms may be pivotally mounted. The distal ends of the catch arms and the engaging components may also be shaped to cooperatively engage on contact. A control causes the catch arms to rotate thereby engaging the distal ends of the arms between the engaging components either automatically above a threshold speed or manually. This engagement limits the angle of the trailer to the tractor to a predetermined angle when trailer rotates on the fifth wheel causing the engaging components to contact the distal ends of the catch arms.

Abstract: A production capability system for automatically determining production capability quantities. The system includes a candidate generation process for generating possible production capability candidates and a quantity optimization module for calculating an optimal quantity availability for production capability candidate. The system also includes a calculation module for assigning quantities to all of the production capability candidates and means for generating a production report wherein production capability candidates and the optimal quantity are combined to generate a production capability availability which is stored in a specification for use by an external sales system. The candidate generation process and the quantity optimization module accept input data from a master database including priorities associated with different products and weights for different performance measures.

Abstract: An apparatus for supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

Abstract: A method for increasing integrated circuit density is disclosed comprising stacking an upper wafer and a lower wafer, each of which having fabricated circuitry in specific areas on their respective face surfaces. The upper wafer is attached back-to-back with the lower wafer with a layer of adhesive applied over the back side of the lower wafer. The wafers are aligned so as to bring complementary circuitry on each of the wafers into perpendicular alignment. The adhered wafer pair is then itself attached to an adhesive film to immobilize the wafer during, dicing. The adhered wafer pair may be diced into individual die pairs or wafer portions containing more than one die pair.

Abstract: An anti-jackknifing device adapted for engagement between a tractor having a fifth wheel engaged with a trailer. The device features a pair of catch arms rotationally engaged to a mount with the tractor. The distal ends of the catch arms move between an engaged position in a horizontal path between two trailer mounted engaging components adapted to engage the distal end and a disengaged position out of the path. The distal ends of the catch arms may be pivotally mounted. The distal ends of the catch arms and the engaging components may also be shaped to cooperatively engage on contact. A control causes the catch arms to rotate thereby engaging the distal ends of the arms between the engaging components either automatically above a threshold speed or manually. This engagement limits the angle of the trailer to the tractor to a predetermined angle when trailer rotates on the fifth wheel causing the engaging components to contact the distal ends of the catch arms.

Abstract: A method of attaching solder balls to a BGA package using a ball pickup tool is disclosed. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

Abstract: A method of forming conductive structures on the contact pads of a substrate, such as a semiconductor die or a printed circuit board. A solder mask is secured to an active surface of the substrate. Apertures through the solder mask are aligned with contact pads on the substrate. The apertures may be preformed or formed after a layer of the material of which the solder mask is comprised has been disposed on the substrate. Conductive material is disposed in and shaped by the apertures of the solder mask to form conductive structures in communication with the contact pads exposed to the apertures. Sides of the conductive structures are exposed through the solder mask, either by removing the solder mask from the substrate or by reducing the thickness of the solder mask. The present invention also includes semiconductor devices formed during different stages of the method of the present invention.

Abstract: A method and apparatus are disclosed for mounting a wafer on a mount and thinning the wafer. The wafer includes a front surface having bumps with an adhesive tape having a backing attached thereto and a back surface. The front surface of the wafer is mounted facedown on a suction surface with the backing of the adhesive tape abutting the surface. The wafer is then suctioned, after which the back surface of the wafer undergoes a grinding process to thin the wafer. Since the backing attached to the bumps on the wafer is substantially planar and sits substantially flat on the suction surface of the wafer mount, the force exerted on the wafer from the thinning process does not overcome the suction force holding the wafer on the wafer mount. Thus, the bumped wafer may be thinned without damaging the bumps and the active surface of the wafer.

Abstract: A head assembly for a reactor pressure vessel includes a removable closure head, an array of control rod drive mechanisms, a seismic support platform, a missile shield assembly and a cooling system for drawing atmospheric air across electromagnetic coil stack assemblies. The cooling system includes: a lower shroud surrounding the coil stack assemblies with an end open to the atmosphere around the CRDMs; a plurality of extending internal ducts disposed within the array of CRDMs upwardly to an upper plenum disposed above the seismic support platform and a plurality of fan assemblies disposed on the upper plenum. The missile shield is disposed within the upper plenum. The cooling system effectively cools the coil stack assemblies during fuel cycles and does not hinder access to the CRDMs during an outage. The head assembly has lift legs for transporting either the entire head assembly as an integral unit or the structure above the seismic support platform a subassembly.

Abstract: Apparatus and methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

Abstract: Apparatus and methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

Abstract: A system for attaching a plurality of solder balls to an electronic device is disclosed. The system includes, in one embodiment, a heat-resistant tape having a first side comprising a plurality of recesses. The first side of the tape may form an adhesive surface. The recesses are located for registration with a plurality of connection points on the electronic device. The recesses are each adapted to receive and retain a solder ball therein. After placing a solder ball within two or more of the recesses, the first side of the tape may be adhered to the electronic device with the solder balls retained therein. Heating of the solder balls causes them to reflow and adhere to the connection points. After cooling, the tape may be removed, wherein the solder balls remain bonded to the connection points, forming a Ball Grid Array (BGA).

Abstract: A method for increasing integrated circuit density comprising stacking an upper wafer and a lower wafer, each of which have fabricated circuitry in specific areas on their respective face surfaces. The upper wafer is attached back-to-back with the lower wafer with a layer of adhesive applied over the back side of the lower wafer. The wafers are aligned so as to bring complimentary circuitry on each of the wafers into perpendicular alignment. The adhered wafer pair is then itself attached to an adhesive film to immobilize the wafer during dicing. The adhered wafer pair may be diced into individual die pairs or wafer portions containing more than one die pair.

Abstract: A system for attaching a plurality of solder balls to an electronic device is disclosed. The system includes, in one embodiment, a heat-resistant tape having a first side comprising a plurality of recesses. The first side of the tape may form an adhesive surface. The recesses are located for registration with a plurality of connection points on the electronic device. The recesses are each adapted to receive and retain a solder ball therein. After placing a solder ball within two or more of the recesses, the first side of the tape may be adhered to the electronic device with the solder balls retained therein. Heating of the solder balls causes them to reflow and adhere to the connection points. After cooling, the tape may be removed, wherein the solder balls remain bonded to the connection points, forming a Ball Grid Array (BGA).

Abstract: A system for attaching a plurality of solder balls to an electronic device is disclosed. The system includes, in one embodiment, a heat-resistant tape having a first side comprising a plurality of recesses. The first side of the tape may form an adhesive surface. The recesses are located for registration with a plurality of connection points on the electronic device. The recesses are each adapted to receive and retain a solder ball therein. After placing a solder ball within two or more of the recesses, the first side of the tape may be adhered to the electronic device with the solder balls retained therein. Heating of the solder balls causes them to reflow and adhere to the connection points. After cooling, the tape may be removed, wherein the solder balls remain bonded to the connection points, forming a Ball Grid Array (BGA).

Abstract: A method and system for forming contacts on semiconductor components, such as wafers, dice and packages, are provided. The method employs magnets to align and hold ferromagnetic balls on bonding sites of a component substrate. The system includes a holder for holding the component substrate, and magnets on the holder aligned with bonding sites on the component. The system also includes a ball placement mechanism for placing the ferromagnetic balls on the bonding sites, and a bonding mechanism, such as an oven, or a focused energy source, for bonding the ferromagnetic balls to the bonding sites. The ferromagnetic balls can be provided as a ferromagnetic core having an outer solder layer, as a solid ferromagnetic material with a conductive adhesive outer layer, or as ferromagnetic particles embedded in a bondable matrix material. An alternate embodiment system includes a focused magnetic source for dynamically aligning the ferromagnetic balls to the bonding sites.

Abstract: A method and system for forming contacts on semiconductor components, such as wafers, dice and packages, are provided. The method employs magnets to align and hold ferromagnetic balls on bonding sites of a component substrate. The system includes a holder for holding the component substrate, and magnets on the holder aligned with bonding sites on the component. The system also includes a ball placement mechanism for placing the ferromagnetic balls on the bonding sites, and a bonding mechanism, such as an oven, or a focused energy source, for bonding the ferromagnetic balls to the bonding sites. The ferromagnetic balls can be provided as a ferromagnetic core having an outer solder layer, as a solid ferromagnetic material with a conductive adhesive outer layer, or as ferromagnetic particles embedded in a bondable matrix material. An alternate embodiment system includes a focused magnetic source for dynamically aligning the ferromagnetic balls to the bonding sites.

Abstract: Roasted coffee with an increased chlorogenic acid content of more than 2.8% by weight or instant coffee powder with an increased chlorogenic acid content of more than 8.5% by weight have a better compatibility. The increased chlorogenic acid content is achieved either by adding chlorogenic acid or by extracting raw coffee and adding the optionally concentrated extract to the roasted coffee.