Abstract: A mote includes an optical receiver that wirelessly receives a power and data signal in form of NIR light energy within a patient and converts the NIR light energy to an electrical signal having a supply voltage. A control module supplies the supply voltage to power devices of the mote. A clock generation circuit locks onto a target clock frequency based on the power and data signal and generates clock signals. A data recovery circuit sets parameters of one of the devices based on the power and data signal and a first clock signal. An amplifier amplifies a neuron signal detected via an electrode inserted in tissue of the patient. A chip identifier module, based on a second clock signal, generates a recorded data signal based on a mote chip identifier and the neuron signal. A driver transmits the recorded data signal via a LED or a RF transmitter.

Abstract: A mote includes an optical receiver that wirelessly receives a power and data signal in form of NIR light energy within a patient and converts the NIR light energy to an electrical signal having a supply voltage. A control module supplies the supply voltage to power devices of the mote. A clock generation circuit locks onto a target clock frequency based on the power and data signal and generates clock signals. A data recovery circuit sets parameters of one of the devices based on the power and data signal and a first clock signal. An amplifier amplifies a neuron signal detected via an electrode inserted in tissue of the patient. A chip identifier module, based on a second clock signal, generates a recorded data signal based on a mote chip identifier and the neuron signal. A driver transmits the recorded data signal via a LED or a RF transmitter.

Abstract: Circuits and methods for driving an LED from a secondary side of a transformer are disclosed herein. An embodiment of the method includes monitoring an input voltage to determine the power level intended to drive the LED. The current flow through the primary side of the transformer is adjusted to make the power actually driving the LED equal to the power intended to drive the LED.

Abstract: A lighting system includes a switch configured so that when the switch is in a first state, current from a supply flows to a light emitter, and when the switch is in a second state, current from the supply flows through the switch bypassing the light emitter. A capacitor in parallel with the light emitter provides current to the light emitter sufficient to cause the light emitter to emit light when the switch is in the second state.

Abstract: A lighting system includes a switch configured so that when the switch is in a first state, current from a supply flows to a light emitter, and when the switch is in a second state, current from the supply flows through the switch bypassing the light emitter. A capacitor in parallel with the light emitter provides current to the light emitter sufficient to cause the light emitter to emit light when the switch is in the second state.

Abstract: An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surface, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.

Abstract: Circuits and methods for driving an LED from a secondary side of a transformer are disclosed herein. An embodiment of the method includes monitoring an input voltage to determine the power level intended to drive the LED. The current flow through the primary side of the transformer is adjusted to make the power actually driving the LED equal to the power intended to drive the LED.

Abstract: An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a apace between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surfaces, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.

Abstract: An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surface, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.

Abstract: An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surface, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.

Abstract: An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surface, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.

Abstract: Methods and related computer program products, systems, and devices for providing intelligent feedback to a user based on audio input associated with a user reading a passage are disclosed. The method can include assessing a level of fluency of a user's reading of the sequence of words using speech recognition technology to compare the audio input with an expected sequence of words and providing feedback to the user related to the level of fluency for a word.

Abstract: An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surface, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.

Abstract: A ball grid array (BGA) integrated circuit package which has an outer two-dimensional array of solder balls and a center two-dimensional array of solder balls located on a bottom surface of a package substrate. The solder balls are typically reflowed to mount the package to a printed circuit board. Mounted to an opposite surface of the substrate is an integrated circuit that is electrically coupled to the solder balls by internal routing within the package. The outer array of solder balls are located the dimensional profile of the integrated circuit to reduce solder stresses induced by the differential thermal expansion between the integrated circuit and the substrate. The center solder balls are typically routed directly to ground and power pads of the package to provide a direct thermal and electrical path from the integrated circuit to the printed circuit board.

Abstract: A ball grid array (BGA) integrated circuit package which has an outer two-dimensional array of solder balls and a center two-dimensional array of solder balls located on a bottom surface of a package substrate. The solder balls are typically reflowed to mount the package to a printed circuit board. Mounted to an opposite surface of the substrate is an integrated circuit that is electrically coupled to the solder balls by internal routing within the package. The outer array of solder balls are located the dimensional profile of the integrated circuit to reduce solder stresses induced by the differential thermal expansion between the integrated circuit and the substrate. The center solder balls are typically routed directly to ground and power pads of the package to provide a direct thermal and electrical path from the integrated circuit to the printed circuit board.

Abstract: A ball grid array (BGA) integrated circuit package which has an outer two-dimensional array of solder balls and a center two-dimensional array of solder balls located on a bottom surface of a package substrate. The solder balls are typically reflowed to mount the package to a printed circuit board. Mounted to an opposite surface of the substrate is an integrated circuit that is electrically coupled to the solder balls by internal routing within the package. The outer array of solder balls are located the dimensional profile of the integrated circuit to reduce solder stresses induced by the differential thermal expansion between the integrated circuit and the substrate. The center solder balls are typically routed directly to ground and power pads of the package to provide a direct thermal and electrical path from the integrated circuit to the printed circuit board.

Abstract: Methods and related computer program products, systems, and devices for providing intelligent feedback to a user based on audio input associated with a user reading a passage are disclosed. The method can include assessing a level of fluency of a user's reading of the sequence of words using speech recognition technology to compare the audio input with an expected sequence of words and providing feedback to the user related to the level of fluency for a word.

Abstract: A ball grid array (BGA) integrated circuit package which has an outer two-dimensional array of solder balls and a center two-dimensional array of solder balls located on a bottom surface of a package substrate. The solder balls are typically reflowed to mount the package to a printed circuit board. Mounted to an opposite surface of the substrate is an integrated circuit that is electrically coupled to the solder balls by internal routing within the package. The outer array of solder balls are located the dimensional profile of the integrated circuit to reduce solder stresses induced by the differential thermal expansion between the integrated circuit and the substrate. The center solder balls are typically routed directly to ground and power pads of the package to provide a direct thermal and electrical path from the integrated circuit to the printed circuit board.

Abstract: Two comparators are arranged to generate a pulse-width modulator (PWM) control pulse. The first comparator is arranged to start the PWM control pulse, while the second comparator is arranged to stop the PWM control pulse. The first comparator can be a high speed CMOS comparator that includes a built-in offset. The first and second comparators can be arranged such that the built-in offset of the first comparator dominates the overall operation at the start of the control pulse. The start of the PWM control pulse is initiated by a ramp voltage and a predetermined reference level instead of a clock edge. The PWM control pulse can be linearly varied down to a zero pulse width. The PWM control pulse may be used to control the on-time of the switching element in a switching-type converter.

Abstract: The on-time of a pulse signal is controlled by comparing a ramp signal to an input signal that is dynamically selected from two signals. A first operating mode is active when a clock signal is in a first logic state, where the pulse signal is reset. A second operating mode is initiated when the clock signal changes from the first logic state to a second logic state. During the second operating mode, the ramp signal is compared to the first signal. A third operating mode is initiated when the ramp signal exceeds the first signal during the second operating mode. During the third operating mode, the pulse signal is set and the ramp signal is compared to the second signal. The pulse signal is reset when the when the ramp signal exceeds the second signal in the third operating mode such that the on-time of the pulse signal is controlled.