Abstract: An electronic component comprising a body and at least one terminal for soldering the body to a carrier is provided, with the terminal comprising: an electrode arranged on a surface of the body; an outgassing layer formed on and/or surrounded by the electrode, wherein the outgassing layer is configured to outgas when being heated; and an electrically conductive cover layer formed on the outgassing layer, wherein the cover layer is electrically connected to the electrode and seals the outgassing layer in a gastight manner between the cover layer and the electrode.

Abstract: An electronic component comprising a body and at least one terminal for soldering the body to a carrier is provided, with the terminal comprising: an electrode arranged on a surface of the body; an outgassing layer formed on and/or surrounded by the electrode, wherein the outgassing layer is configured to outgas when being heated; and an electrically conductive cover layer formed on the outgassing layer, wherein the cover layer is electrically connected to the electrode and seals the outgassing layer in a gastight manner between the cover layer and the electrode.

Abstract: A chip resistor includes an insulating substrate, top terminal electrodes formed on top surface of the substrate using silver-based cermet, bottom electrodes, resistive element that is situated between the top terminal electrodes and overlaps them partially, an optional internal protective coating that covers resistive element completely or partially, an external protective coating that covers completely the internal protection coating and partially covers top terminal electrodes, a plated layer of nickel that covers face sides of the substrate, top and bottom electrodes, and overlaps partially external protective coating, finishing plated layer that covers nickel layer. The overlap of nickel layer and external protective layer possesses a sealing property because of metallization of the edges of external protective layer prior to the nickel plating process.

Abstract: A chip resistor includes an insulating substrate, top terminal electrodes formed on top surface of the substrate using silver-based cermet, bottom electrodes, resistive element that is situated between the top terminal electrodes and overlaps them partially, an optional internal protective coating that covers resistive element completely or partially, an external protective coating that covers completely the internal protection coating and partially covers top terminal electrodes, a plated layer of nickel that covers face sides of the substrate, top and bottom electrodes, and overlaps partially external protective coating, finishing plated layer that covers nickel layer. The overlap of nickel layer and external protective layer possesses a sealing property because of metallization of the edges of external protective layer prior to the nickel plating process.

Abstract: Thermally stable four-terminal resistor (current sensor) is characterized by having the capacity to adjust both resistance and temperature coefficient of resistance (TCR), during manufacturing process. The four-terminal resistor includes 3 or 4 elementary resistors R1-R3 forming a closed loop. Resistor R1 is the principal low-ohmic value resistor. The terminals of resistor R1 serve as “Force” terminals of the four-terminal resistor. Resistors R2, R3 form a voltage divider intended to minimize the TCR of the four-terminal resistor and connected in parallel to resistor R1. The terminals of resistor R3 serve as “Sense” terminals of the four-terminal resistor. Resistor R2 may be split into two resistors: R2a, R2b to simplify the implementation of four-terminal resistor. Elementary resistors R1, R2 must have the same sign of TCR. Target resistance and TCR minimization in four-terminal resistor are reached by adjustment of resistance of the elementary resistors.

Abstract: A chip resistor includes an insulating substrate 11, top terminal electrodes 12 formed on top surface of the substrate using silver-based cermet, bottom electrodes 13, resistive element 14 that is situated between the top terminal electrodes 12 and overlaps them partially, an optional internal protective coating 15 that covers resistive element 14 completely or partially, an external protective coating 16 that covers completely the internal protection coating 15 and partially covers top terminal electrodes 12, a plated layer of nickel 17 that covers face sides of the substrate, top 12 and bottom 13 electrodes, and overlaps partially external protective coating 16, finishing plated layer 18 that covers nickel layer 17. The overlap of nickel layer 17 and external protective layer 16 possesses a sealing property because of metallization of the edges of external protective layer 16 prior to the nickel plating process.

Abstract: A chip resistor includes an insulating substrate 11, top terminal electrodes 12 formed on top surface of the substrate using silver-based cermet, bottom electrodes 13, resistive element 14 that is situated between the top terminal electrodes 12 and overlaps them partially, an optional internal protective coating 15 that covers resistive element 14 completely or partially, an external protective coating 16 that covers completely the internal protection coating 15 and partially covers top terminal electrodes 12, a plated layer of nickel 17 that covers face sides of the substrate, top 12 and bottom 13 electrodes, and overlaps partially external protective coating 16, finishing plated layer 18 that covers nickel layer 17. The overlap of nickel layer 17 and external protective layer 16 possesses a sealing property because of metallization of the edges of external protective layer 16 prior to the nickel plating process.

Abstract: Thermally stable four-terminal resistor (current sensor) is characterized by having the capacity to adjust both resistance and temperature coefficient of resistance (TCR), during manufacturing process. The four-terminal resistor includes 3 or 4 elementary resistors R1-R3 forming a closed loop. Resistor R1 is the principal low-ohmic value resistor. The terminals of resistor R1 serve as “Force” terminals of the four-terminal resistor. Resistors R2, R3 form a voltage divider intended to minimize the TCR of the four-terminal resistor and connected in parallel to resistor R1. The terminals of resistor R3 serve as “Sense” terminals of the four-terminal resistor. Resistor R2 may be split into two resistors: R2a, R2b to simplify the implementation of four-terminal resistor. Elementary resistors R1, R2 must have the same sign of TCR. Target resistance and TCR minimization in four-terminal resistor are reached by adjustment of resistance of the elementary resistors.

Abstract: A chip resistor includes an insulating substrate 11, top terminal electrodes 12 formed on top surface of the substrate using silver-based cermet, bottom electrodes 13, resistive element 14 that is situated between the top terminal electrodes 12 and overlaps them partially, an optional internal protective coating 15 that covers resistive element 14 completely or partially, an external protective coating 16 that covers completely the internal protection coating 15 and partially covers top terminal electrodes 12, a plated layer of nickel 17 that covers face sides of the substrate, top 12 and bottom 13 electrodes, and overlaps partially external protective coating 16, finishing plated layer 18 that covers nickel layer 17. The overlap of nickel layer 17 and external protective layer 16 possesses a sealing property because of metallization of the edges of external protective layer 16 prior to the nickel plating process.

Abstract: A chip resistor includes an insulating substrate 11, top terminal electrodes 12 formed on top surface of the substrate using silver-based cermet, bottom electrodes 13, resistive element 14 that is situated between the top terminal electrodes 12 and overlaps them partially, an optional internal protective coating 15 that covers resistive element 14 completely or partially, an external protective coating 16 that covers completely the internal protection coating 15 and partially covers top terminal electrodes 12, a plated layer of nickel 17 that covers face sides of the substrate, top 12 and bottom 13 electrodes, and overlaps partially external protective coating 16, finishing plated layer 18 that covers nickel layer 17. The overlap of nickel layer 17 and external protective layer 16 possesses a sealing property because of metallization of the edges of external protective layer 16 prior to the nickel plating process.

Abstract: A chip resistor comprising a substrate having opposite parallel symmetrical first and second surfaces, a central longitudinal plane of symmetry, separate and spaced first and second resistive layers on the first and second surfaces. The resistive layers are electrically connected in parallel to each other and the first and second surfaces of the substrate are symmetrically located with respect to and equidistant from a central longitudinal plane. Thus, when electrical current passes through the resistive layers, a temperature distribution within the substrate will be substantially symmetrical about the central longitudinal plane of the substrate for eliminating thermal bending thereof. The splitting of the surge current between two resistive layers results in the lower temperature in each resistive layer when compared with the temperature in the single resistive layer of the prior art chip resistor loaded by the same current.

Abstract: A chip resistor comprising a substrate having opposite parallel symmetrical first and second surfaces, a central longitudinal plane of symmetry, separate and spaced first and second resistive layers on the first and second surfaces. The resistive layers are electrically connected in parallel to each other and the first and second surfaces of the substrate are symmetrically located with respect to and equidistant from a central longitudinal plane. Thus, when electrical current passes through the resistive layers, a temperature distribution within the substrate will be substantially symmetrical about the central longitudinal plane of the substrate for eliminating thermal bending thereof. The splitting of the surge current between two resistive layers results in the lower temperature in each resistive layer when compared with the temperature in the single resistive layer of the prior art chip resistor loaded by the same current.