Abstract: A method of producing at least one connection carrier includes: A) providing a carrier plate with a planar top face; B) applying at least one electrically insulating insulation strip to the top face and cohesively connecting the carrier plate and the insulation strip; and C) applying at least one electrically conductive conductor strip to an adhesive surface of the insulation strip and cohesively connecting the insulation strip and the conductor strip, wherein the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip.

Abstract: A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the earlier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.

Abstract: A method of producing at least one connection carrier includes: A) providing a carrier plate with a planar top face; B) applying at least one electrically insulating insulation strip to the top face and cohesively connecting the carrier plate and the insulation strip; and C) applying at least one electrically conductive conductor strip to an adhesive surface of the insulation strip and cohesively connecting the insulation strip and the conductor strip, wherein the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip.

Abstract: A strip-shaped substrate made from a film includes a plurality of units for producing chip carriers. Each unit has a chip island for fixing a semiconductor chip, electrodes for electrical connection of the semiconductor chip, and through-openings for structuring the unit. At least one through-opening forms an anchoring edge for a casting compound for encapsulating the semiconductor chip. A surface section of the film abutting the through-opening is chamfered to form the anchoring edge. The anchoring edge protrudes past the side of the film on which the chip island is arranged.

Abstract: A strip-shaped substrate made from a film includes a plurality of units for producing chip carriers. Each unit has a chip island for fixing a semiconductor chip, electrodes for electrical connection of the semiconductor chip, and through-openings for structuring the unit. At least one through-opening forms an anchoring edge for a casting compound for encapsulating the semiconductor chip. A surface section of the film abutting the through-opening is chamfered to form the anchoring edge. The anchoring edge protrudes past the side of the film on which the chip island is arranged.

Abstract: A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the carrier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.

Abstract: An XML update facility is disclosed for an XQuery processor A modular system for updating an XML document comprises a query generator for converting one or more updates to the XML documents into one or more queries; an existing XML query engine for processing the one or more queries to generate one or more point updates that each update a node in the XML document; an update converter that converts the one or more point updates to one or more abstract interface representations of the one or more point updates, wherein the one or more abstract interface representations are executable units that can be individually executed using a point update facility; and an update evaluator that applies the one or more abstract interface representations to the XML document to update the XML document

Abstract: Method for performing information-preserving DTD schema embeddings between a source schema when matching a source schema and a target schema. The preservation is realized by a matching process between the two schemas that finds a first string marking of the target schema, evaluates a legality of the first string marking, determines an estimated mimimal cost of the first string marking and subsequently adjusts the estimated minimal cost based upon one to one mapping of source schema and target schema subcomponents.

Abstract: A framework is provided for integrating data from multiple relational sources into an XML document that both conforms to a given DTD and satisfies predefined XML constraints. The framework is based on a specification language, designated Attribute Integration Grammar (AIG), that extends a DTD by (1) associating element types with semantic attributes, (2) computing these attributes via parameterized SQL queries over multiple data sources, and (3) incorporating XML keys and inclusion constraints. The AIG uniquely operates on semantic attributes and their dependency relations for controlling context-dependent, DTD-directed construction of XML documents, and, as well as checks XML constraints in parallel with document-generation.