Patents by Inventor Michael Benjamin Brown

Michael Benjamin Brown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic module for motherboard
    Patent number: 11195779
    Abstract: A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: December 7, 2021
    Assignee: Raytheon Company
    Inventors: Michael Benjamin Brown, Alberto F. Viscarra, Michael M. Fitzgibbon, John A. Crockett, Jr., Chad E. Patterson, Kevin C. Rolston, Duke Quach, Kevin P. Agustin
  • ELECTRONIC MODULE FOR MOTHERBOARD
    Publication number: 20210043542
    Abstract: A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.
    Type: Application
    Filed: March 24, 2020
    Publication date: February 11, 2021
    Inventors: Michael Benjamin Brown, Alberto F. Viscarra, Michael M. Fitzgibbon, John A. Crockett, JR., Chad E. Patterson, Kevin C. Rolston, Duke Quach, Kevin P. Agustin