Abstract: A circuit board assembly has a circuit board and an electrical component embedded in a cured plastic layer, as well as a heat sink for cooling the component. The component is placed with a first side on a surface of the circuit board facing the heat sink and in electrical contact with the circuit board, and is located in a window in the cured plastic layer. Moreover, the component is materially bonded to a surface of the heat sink facing the circuit board at a second side lying opposite the first side, in particular through soldering or sintering. The plastic layer is injected and cured between the surface of the circuit board and the surface of the heat sink. In the production process, the material is melted by the heat at the same time as the injection, such that the component is materially bonded to the heat sink.

Abstract: The invention relates to a circuit board assembly and a production method therefor, as well as an inverter with such a circuit board assembly. The circuit board assembly has a circuit board (1) and an electrical component (3) embedded in a cured plastic layer (2), as well as a heat sink (4) for cooling the component (3). The component (3) is placed with a first side (3A) on a surface of the circuit board (1) facing the heat sink (4) and in electrical contact with the circuit board (1), and is located in a window (2A) in the cured plastic layer (2). Moreover, the component (3) is materially bonded to a surface of the heat sink (4) facing the circuit board (1) at a second side (3B) lying opposite the first side (3A), in particular through soldering or sintering. The plastic layer (2) is injected and cured between the surface of the circuit board (1) and the surface of the heat sink (4).