Abstract: A method for electrically contacting components in a semiconductor wafer includes providing a flexible board comprising a first main surface on which a plurality of conductor tracks are arranged, positioning the board with respect to a semiconductor wafer such that the first main surface of the board faces the semiconductor wafer, the board is bent and pressed onto the semiconductor wafer in such a way that contact elements of a plurality of components arranged in a row in the semiconductor wafer come into contact with the conductor tracks, and electrical signals are applied to the components through the conductor tracks.

Abstract: A device for processing a multiplicity of semiconductor chips in a wafer assemblage includes an electrically conductive carrier for contacting rear contacts of the semiconductor chips, an electrically conductive film for contacting front contacts of the semiconductor chips that are situated opposite the rear contacts, and a squeegee, which is displaceable relative to the film and is configured to press a region of the film in the direction toward the carrier.

Abstract: A method for electrically contacting components in a semiconductor wafer includes providing a flexible board comprising a first main surface on which a plurality of conductor tracks are arranged, positioning the board with respect to a semiconductor wafer such that the first main surface of the board faces the semiconductor wafer, the board is bent and pressed onto the semiconductor wafer in such a way that contact elements of a plurality of components arranged in a row in the semiconductor wafer come into contact with the conductor tracks, and electrical signals are applied to the components through the conductor tracks.

Abstract: A device for processing a multiplicity of semiconductor chips in a wafer assemblage includes an electrically conductive carrier for contacting rear contacts of the semiconductor chips, an electrically conductive film for contacting front contacts of the semiconductor chips that are situated opposite the rear contacts, and a squeegee, which is displaceable relative to the film and is configured to press a region of the film in the direction toward the carrier.

Abstract: The method is used to produce a set of dentures for an untoothed or partially toothed jaw for dental care of patients, especially a set of dentures which are to be placed on implants that are to be newly fixed. Initially positioning screws provided with a capping element are inserted in the lingual-oral or palatinal region and/or on the crest of the jaw. A cast (6) is made, expressing the real situation of the jaw of the patient including the positioning screws (8). Corresponding positioning screws (8) are then inserted into the cast (6). Other technical work is carried out on the cast (6), i.e. a drilling jig (7) is manufactured for the implants to be positioned and/or a transfer jig is manufactured, in additional to dental work carried out in the mouth of the patient, i.e. the drilling jig (7) is used to position the implants and/or to block the supports for the implants with the transfer jig by respectively fixing them on the positioning screws (8) in the cast (6) or jaw.