Patents by Inventor Michael Bestele
Michael Bestele has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210214864Abstract: An optoelectronic fiber, an apparatus for manufacturing an optoelectronic fiber and a method for manufacturing an optoelectronic fiber are disclosed. In an embodiment an optoelectronic fiber includes at least one carrier extending in a longitudinal direction, optoelectronic components arranged on the at least one carrier and a sheath extending in the longitudinal direction and surrounding the at least one carrier and the optoelectronic components, wherein the sheath includes at least one thread guided around the at least one carrier and the optoelectronic components and/or at least one tape helically wound around the at least one carrier and the optoelectronic components, wherein at least one metal wire is integrated into the sheath and twisted, braided or interwoven with the at least one thread, and wherein the at least one metal wire is electrically coupled to at least one of the optoelectronic components.Type: ApplicationFiled: May 24, 2019Publication date: July 15, 2021Inventors: Michael Bestele, Siegfried Herrmann
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Patent number: 10837606Abstract: A filament includes a radiation-transmissive substrate, a plurality of LEDs, and a converter layer, wherein the substrate has an upper side and a lower side facing away from the upper side, the LEDs being arranged on the upper side of the substrate, the converter layer covers the LEDs, the upper side and the lower side of the substrate, and the converter layer has a first sublayer on the upper side and a second sublayer on the lower side, the converter layer is configured to obtain an improved radiation profile of the filament, along a lateral direction, the converter layer has a continuously varying vertical layer thickness, the lateral direction is a lateral longitudinal direction parallel to a main extension surface of the substrate, and the substrate has a length expanding along the lateral longitudinal direction that is greater than a width of the substrate along a lateral transverse direction.Type: GrantFiled: February 7, 2020Date of Patent: November 17, 2020Assignee: OSRAM OLED GmbHInventors: Markus Hofmann, Thomas Schlereth, Michael Bestele
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Patent number: 10731797Abstract: A filament includes a multiplicity of light-emitting semiconductor chips, wherein the semiconductor chips are arranged on a carrier, the semiconductor chips being electrically contacted, a scattering structure is configured to scatter light of the light-emitting semiconductor chips, the scattering structure is formed by structuring a surface, a converter covers the light-emitting semiconductor chips, and the structuring of the surface is formed on a surface of the converter.Type: GrantFiled: March 23, 2017Date of Patent: August 4, 2020Assignee: OSRAM Opto Semiconductors GmbHInventors: Thomas Schlereth, Elena Rachkova, Michael Bestele, Ivar Tangring
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Publication number: 20200173611Abstract: A filament includes a radiation-transmissive substrate, a plurality of LEDs, and a converter layer, wherein the substrate has an upper side and a lower side facing away from the upper side, the LEDs being arranged on the upper side of the substrate, the converter layer covers the LEDs, the upper side and the lower side of the substrate, and the converter layer has a first sublayer on the upper side and a second sublayer on the lower side, the converter layer is configured to obtain an improved radiation profile of the filament, along a lateral direction, the converter layer has a continuously varying vertical layer thickness, the lateral direction is a lateral longitudinal direction parallel to a main extension surface of the substrate, and the substrate has a length expanding along the lateral longitudinal direction that is greater than a width of the substrate along a lateral transverse direction.Type: ApplicationFiled: February 7, 2020Publication date: June 4, 2020Inventors: Markus Hofmann, Thomas Schlereth, Michael Bestele
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Patent number: 10598316Abstract: A filament includes a radiation-transmissive substrate, a plurality of light emitting diodes and a converter layer, wherein the substrate has an upper side and a lower side facing away from the upper side, and the LEDs are arranged on the upper side of the substrate, the converter layer covers the LEDs, the upper side and the lower side of the substrate, and the converter layer has a first sublayer on the upper side and a second sublayer on the lower side, and the converter layer is configured to obtain an improved radiation profile of the filament such that the converter layer has a varying vertical layer thickness along a lateral direction, and/or the first sublayer and the second sublayer differ from one another in their geometry and/or material composition.Type: GrantFiled: March 17, 2017Date of Patent: March 24, 2020Assignee: OSRAM OLED GmbHInventors: Markus Hofmann, Thomas Schlereth, Michael Bestele
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Publication number: 20190113181Abstract: A filament includes a multiplicity of light-emitting semiconductor chips, wherein the semiconductor chips are arranged on a carrier, the semiconductor chips being electrically contacted, a scattering structure is configured to scatter light of the light-emitting semiconductor chips, the scattering structure is formed by structuring a surface, a converter covers the light-emitting semiconductor chips, and the structuring of the surface is formed on a surface of the converter.Type: ApplicationFiled: March 23, 2017Publication date: April 18, 2019Inventors: Thomas Schlereth, Elena Rachkova, Michael Bestele, Ivar Tangring
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Publication number: 20190086036Abstract: A filament includes a radiation-transmissive substrate, a plurality of light emitting diodes and a converter layer, wherein the substrate has an upper side and a lower side facing away from the upper side, and the LEDs are arranged on the upper side of the substrate, the converter layer covers the LEDs, the upper side and the lower side of the substrate, and the converter layer has a first sublayer on the upper side and a second sublayer on the lower side, and the converter layer is configured to obtain an improved radiation profile of the filament such that the converter layer has a varying vertical layer thickness along a lateral direction, and/or the first sublayer and the second sublayer differ from one another in their geometry and/or material composition.Type: ApplicationFiled: March 17, 2017Publication date: March 21, 2019Inventors: Markus Hofmann, Thomas Schlereth, Michael Bestele
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Patent number: 9741616Abstract: In one embodiment, the method is configured for producing optoelectronic semiconductor components (1) and includes the steps of: providing a leadframe assembly (20) with a multiplicity of leadframes (2), each having at least two leadframe parts (21, 22); forming at least a part of the leadframe assembly (20) with a housing material for housing bodies (4); dividing the leadframe assembly (20) between at least one part of the columns (C) and/or the rows (R), wherein the leadframes (2) remain arranged in a matrix-like manner; equipping the leadframes (2) with at least one optoelectronic semiconductor chip (3); testing at least one part of the leadframes (2) equipped with the semiconductor chips (3) and formed with the housing material after the step of dividing; and separating to form the semiconductor components (1) after the step of forming and after the step of testing.Type: GrantFiled: May 3, 2013Date of Patent: August 22, 2017Assignee: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Thomas Schlereth, Michael Bestele, Christian Gaertner, Tobias Gebuhr, Hans-Christoph Gallmeier, Peter Holzer, Karlheinz Arndt, Albert Schneider
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Patent number: 9664342Abstract: An optoelectronic component device includes a plurality of optoelectronic components that provide and/or absorb electromagnetic radiation; a reflector arranged in a beam path of the electromagnetic radiation of the plurality of optoelectronic components and which has a surface that is at least partly reflective with respect to the provided electromagnetic radiation; wherein the plurality of optoelectronic components at least partly surround the reflector or are at least partly surrounded by the reflector; and the reflector reflects a provided electromagnetic radiation such that a predefined field distribution of the reflected electromagnetic radiation is formed in the image plane of the optoelectronic component device.Type: GrantFiled: September 24, 2013Date of Patent: May 30, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Stephan Kaiser, Tony Albrecht, Michael Bestele, Jan Marfeld, Albert Schneider, Markus Kirsch
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Patent number: 9494295Abstract: A ring light module having a plurality of optoelectronic semiconductor components for producing electromagnetic radiation, a reflector of the ring light module comprising a reflective surface, and a support. The semiconductor components are mounted on the support. In a plan view of a main radiation side of the ring light module, the reflector comprises at most two planes of symmetry. The reflector tapers in the direction towards the main radiation side. At least some of the main emission directions of adjacent optoelectronic semiconductor components are oriented differently from each other, and the main emission directions point towards the reflective surface.Type: GrantFiled: September 17, 2013Date of Patent: November 15, 2016Assignee: OSRAM OPTO SEMICONDUCTOR GMBHInventors: Tony Albrecht, Thomas Schlereth, Roland Schulz, Christian Gaertner, Albert Schneider, Markus Kirsch, Michael Bestele, Stefan Handl
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Patent number: 9368700Abstract: An optoelectronic component includes a substrate, on which a semiconductor chip and a wettable attractor element are arranged. A medium including pigments at least regionally covers the exposed region of the substrate that is not covered by the semiconductor chip and the attractor element. The medium at least partly wets the semiconductor chip and the attractor element.Type: GrantFiled: June 27, 2012Date of Patent: June 14, 2016Assignee: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Simon Jerebic, Erik Heinemann, Markus Pindl, Michael Bestele, Jan Marfeld
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Publication number: 20150247616Abstract: In at least one embodiment, the ring light module (1) comprises a plurality of optoelectronic semiconductor components (2) for producing electromagnetic radiation (R). A reflector (3) of the ring light module (1) comprises a reflective surface (30). The semiconductor components (2) are mounted on a support (4). Viewed in plan view of a main radiation side (45) of the ring light module (1), the reflector (3) comprises at most two planes of symmetry. The reflector (3) tapers in the direction towards the main radiation side (45). At least some of the main emission directions (20) of adjacent semiconductor components (2) are oriented differently from each other. The main emission directions (20) point towards the reflective surface (30).Type: ApplicationFiled: September 17, 2013Publication date: September 3, 2015Inventors: Tony Albrecht, Thomas Schlereth, Roland Schulz, Christian Gaertner, Albert Schneider, Markus Kirsch, Michael Bestele, Stefan Handl
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Publication number: 20150233534Abstract: An optoelectronic component device includes a plurality of optoelectronic components that provide and/or absorb electromagnetic radiation; a reflector arranged in a beam path of the electromagnetic radiation of the plurality of optoelectronic components and which has a surface that is at least partly reflective with respect to the provided electromagnetic radiation; wherein the plurality of optoelectronic components at least partly surround the reflector or are at least partly surrounded by the reflector; and the reflector reflects a provided electromagnetic radiation such that a predefined field distribution of the reflected electromagnetic radiation is formed in the image plane of the optoelectronic component device.Type: ApplicationFiled: September 24, 2013Publication date: August 20, 2015Inventors: Stephan Kaiser, Tony Albrecht, Michael Bestele, Jan Marfeld, Albert Schneider, Markus Kirsch
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Publication number: 20150200138Abstract: In one embodiment, the method is configured for producing optoelectronic semiconductor components (1) and includes the steps of: providing a leadframe assembly (20) with a multiplicity of leadframes (2), each having at least two leadframe parts (21, 22); forming at least a part of the leadframe assembly (20) with a housing material for housing bodies (4); dividing the leadframe assembly (20) between at least one part of the columns (C) and/or the rows (R), wherein the leadframes (2) remain arranged in a matrix-like manner; equipping the leadframes (2) with at least one optoelectronic semiconductor chip (3); testing at least one part of the leadframes (2) equipped with the semiconductor chips (3) and formed with the housing material after the step of dividing; and separating to form the semiconductor components (1) after the step of forming and after the step of testing.Type: ApplicationFiled: May 3, 2013Publication date: July 16, 2015Inventors: Thomas Schlereth, Michael Bestele, Christian Gaertner, Tobias Gebuhr, Hans-Christoph Gallmeier, Peter Holzer, Karlheinz Arndt, Albert Schneider
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Publication number: 20140191272Abstract: An optoelectronic component includes a substrate, on which a semiconductor chip and a wettable attractor element are arranged. A medium including pigments at least regionally covers the exposed region of the substrate that is not covered by the semiconductor chip and the attractor element. The medium at least partly wets the semiconductor chip and the attractor element.Type: ApplicationFiled: June 27, 2012Publication date: July 10, 2014Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Simon Jerebic, Erik Heinemann, Markus Pindl, Michael Bestele, Jan Marfeld
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Patent number: 7681108Abstract: A semiconductor memory module comprises a control chip for driving ECC memory chips and further memory chips. The memory chips are arranged in two rows on a top side and a bottom side of the module circuit board. The ECC memory chips are arranged centrally on the module circuit board alongside the rows of the memory chips. A control bus connects the ECC memory chips and also the memory chips to the control chip. In a region remote from the control chip, the control bus branches in a contact-making hole into a first partial bus, to which a first group of memory chips are connected, and a second partial bus, to which a second group of memory chips are connected. The ECC memory chips are likewise connected to the control bus via the contact-making hole. Since the ECC memory chips are not arranged directly under the control chip, a bus branch directed backward is not required. As a result, space considerations on the module circuit board are eased and signal integrity on the control buses is improved.Type: GrantFiled: July 19, 2006Date of Patent: March 16, 2010Assignee: Qimonda AGInventors: Karl-Heinz Moosrainer, Srdjan Djordjevic, Michael Bestele
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Publication number: 20070033490Abstract: A semiconductor memory module comprises a control chip for driving ECC memory chips and further memory chips. The memory chips are arranged in two rows on a top side and a bottom side of the module circuit board. The ECC memory chips are arranged centrally on the module circuit board alongside the rows of the memory chips. A control bus connects the ECC memory chips and also the memory chips to the control chip. In a region remote from the control chip, the control bus branches in a contact-making hole into a first partial bus, to which a first group of memory chips are connected, and a second partial bus, to which a second group of memory chips are connected. The ECC memory chips are likewise connected to the control bus via the contact-making hole. Since the ECC memory chips are not arranged directly under the control chip, a bus branch directed backward is not required. As a result, space considerations on the module circuit board are eased and signal integrity on the control buses is improved.Type: ApplicationFiled: July 19, 2006Publication date: February 8, 2007Inventors: Karl-Heinz Moosrainer, Srdjan Djordjevic, Michael Bestele