Patents by Inventor Michael Beutl

Michael Beutl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing a semiconductor component, and semiconductor component
    Patent number: 8658534
    Abstract: In an insulation layer of an SOI substrate, a connection pad is arranged. A contact hole opening above the connection pad is provided on side walls and on the connection pad with a metallization that is contacted on top side with a top metal.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: February 25, 2014
    Assignee: AMS AG
    Inventors: Franz Schrank, Günther Koppitsch, Michael Beutl, Sara Carniello, Jochen Kraft
  • Method for Producing a Semiconductor Component, and Semiconductor Component
    Publication number: 20110260284
    Abstract: In the insulation layer (2) of an SOI substrate (1), a connection pad (7) is arranged. A contact hole opening (9) above the connection pad is provided on side walls and on the connection pad with a metallization (11) that is contacted on the top side with a top metal (12).
    Type: Application
    Filed: June 25, 2009
    Publication date: October 27, 2011
    Applicant: AUSTRIAMICROSYSTEMS AG
    Inventors: Franz Schrank, Günther Koppitsch, Michael Beutl, Sara Carniello, Jochen Kraft