Patents by Inventor Michael Blumenauer

Michael Blumenauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe for semiconductor chips and semiconductor module having the lead frame
    Patent number: 6144088
    Abstract: A leadframe for connection to a semiconductor chip, in particular a metal leadframe, includes a plurality of lead prongs and at least two raised lead surfaces. When a semiconductor module that includes the leadframe and a semiconductor chip is sheathed with plastic, the raised lead surfaces assure a uniform flow of a plastic composition in a mold cavity and thus prevent air from becoming trapped in a plastic package. The lead surfaces are preferably created by folding over tabs in the leadframe. The invention also relates to preliminary stages of the leadframe and to semiconductor components that contain the leadframe of the invention.
    Type: Grant
    Filed: July 23, 1997
    Date of Patent: November 7, 2000
    Assignee: Infineon Technologies AG
    Inventors: Jens Pohl, Michael Blumenauer, Ulrich Vidal