Abstract: A communication device includes a system board that includes a plurality of chips. Each chip in plurality of chips includes a plurality of antennas. A system board cover coupled to system board includes a plurality of lenses. Each lens is configured to cover an antenna of plurality of antennas as a radome enclosure. Each lens includes a base and a first tubular membrane coupled to base. A second membrane is coupled to the first tubular membrane. A support structure is coupled to the first tubular membrane. The support structure facilitates coupling of plurality of lenses to system board cover. The system board cover includes a feeder array that includes a plurality of antenna elements that are positioned at a proximal distance from base of a lens and the proximal distance of the system board from the base of the lens is less than a focal length of the lens.

Abstract: A wireless communications system includes a first transceiver with a first phased array antenna panel having horizontal-polarization receive antennas and vertical-polarization transmit antennas, where the horizontal-polarization receive antennas form a first receive beam based on receive phase and receive amplitude information provided by a first master chip, the vertical-polarization transmit antennas form a first transmit beam based on transmit phase and transmit amplitude information provided by the first master chip.

Abstract: A phased array antenna panel includes a first plurality of antennas, a first radio frequency (RF) front end chip, a second plurality of antennas, a second RF front end chip, and a combiner RF chip. The first and second RF front end chips receive respective first and second input signals from the first and second pluralities of antennas, and produce respective first and second output signals based on the respective first and second input signals. The combiner RF chip can receive the first and second output signals and produce a power combined output signal that is a combination of powers of the first and second output signals. Alternatively, a power combiner can receive the first and second output signals and produce a power combined output signal, and the combiner RF chip can receive the power combined output signal.

Abstract: A wireless communication device includes reconfigurable receive transmit antennas having horizontal-polarization antennas and vertical-polarization antennas, where the horizontal-polarization antennas receive or transmit horizontally-polarized signal for a first period of time, where the vertical-polarization antennas transmit or receive vertically-polarized signal for a second period of time, where the horizontal-polarization receive antennas form a receive beam based on receive phase and receive amplitude information provided by a master chip, and where the vertical-polarization transmit antennas form a transmit beam based on transmit phase and transmit amplitude information provided by the master chip.

Abstract: A phased array antenna panel includes a first plurality of antennas, a first radio frequency (RF) front end chip, a second plurality of antennas, a second RF front end chip, and a combiner RF chip. The first and second RF front end chips receive respective first and second input signals from the first and second pluralities of antennas, and produce respective first and second output signals based on the respective first and second input signals. The combiner RF chip can receive the first and second output signals and produce a power combined output signal that is a combination of powers of the first and second output signals. Alternatively, a power combiner can receive the first and second output signals and produce a power combined output signal, and the combiner RF chip can receive the power combined output signal.

Abstract: An apparatus includes a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each of the plurality of antenna modules is mounted on a plurality of portions of the heat sink such that a corresponding packaged circuitry of the plurality of packaged circuitry is in a direct contact with the plurality of portions of the heat sink embedded within the plurality of holes.

Abstract: An antenna module that includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate, a plurality of packaged circuitry on a second surface of the antenna substrate, and a plurality of supporting balls mounted on the second surface of the antenna substrate. The plurality of packaged circuitry includes a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate. Each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs, where at least a relief cut is provided between one of the plurality of projections and one of the plurality of supporting legs.

Abstract: An antenna module that includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate, a plurality of packaged circuitry on a second surface of the antenna substrate, and a plurality of supporting balls mounted on the second surface of the antenna substrate. The plurality of packaged circuitry includes a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate. Each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs, where at least a relief cut is provided between one of the plurality of projections and one of the plurality of supporting legs.

Abstract: An antenna module that includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate, a plurality of packaged circuitry on a second surface of the antenna substrate, and a plurality of supporting balls mounted on the second surface of the antenna substrate. The plurality of packaged circuitry includes a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate. Each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs, where at least a relief cut is provided between one of the plurality of projections and one of the plurality of supporting legs.

Abstract: An active repeater device includes a primary sector and at least a secondary sector communicatively coupled to the primary sector receives or transmits a first beam of input RF signals having a first beam pattern from or to a base station, respectively. The primary sector includes an baseband signal processor and a first radio head (RH) unit. The secondary sector comprises a second RH unit. Beamforming coefficients are generated to convert the first beam pattern of the first beam of input RF signals to a second beam pattern based on a location of each of a plurality of user equipment (UEs). A second beam of output RF signals in the second beam pattern is transmitted from or received by, respectively, the secondary sector to or from, respectively, the plurality of UEs based on the generated beamforming coefficients and the received first beam of input RF signals.

Abstract: An active repeater device includes a primary sector and at least a secondary sector communicatively coupled to the primary sector receives or transmits a first beam of input RF signals having a first beam pattern from or to a base station, respectively. The primary sector includes an baseband signal processor and a first radio head (RH) unit. The secondary sector comprises a second RH unit. Beamforming coefficients are generated to convert the first beam pattern of the first beam of input RF signals to a second beam pattern based on a location of each of a plurality of user equipment (UEs). A second beam of output RF signals in the second beam pattern is transmitted from or received by, respectively, the secondary sector to or from, respectively, the plurality of UEs based on the generated beamforming coefficients and the received first beam of input RF signals.

Abstract: An active repeater device includes a primary sector and at least a secondary sector communicatively coupled to the primary sector receives or transmits a first beam of input RF signals having a first beam pattern from or to a base station, respectively. The primary sector includes an baseband signal processor and a first radio head (RH) unit. The secondary sector comprises a second RH unit. Beamforming coefficients are generated to convert the first beam pattern of the first beam of input RF signals to a second beam pattern based on a location of each of a plurality of user equipment (UEs). A second beam of output RF signals in the second beam pattern is transmitted from or received by, respectively, the secondary sector to or from, respectively, the plurality of UEs based on the generated beamforming coefficients and the received first beam of input RF signals.

Abstract: An apparatus includes a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each of the plurality of antenna modules is mounted on a plurality of portions of the heat sink such that a corresponding packaged circuitry of the plurality of packaged circuitry is in a direct contact with the plurality of portions of the heat sink embedded within the plurality of holes.

Abstract: An apparatus includes a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each of the plurality of antenna modules is mounted on a plurality of portions of the heat sink such that a corresponding packaged circuitry of the plurality of packaged circuitry is in a direct contact with the plurality of portions of the heat sink embedded within the plurality of holes.

Abstract: A communication device includes a system board that includes a plurality of chips. Each chip in plurality of chips includes a plurality of antennas. A system cover coupled to system board includes a plurality of lenses. Each lens is configured to cover an antenna of plurality of antennas as a radome enclosure. Each lens includes a base, and a first tubular membrane coupled to base. A second membrane coupled to first tubular membrane. First tubular membrane and Second membrane cause the lens to have a bell shape. A support structure coupled to first tubular membrane. Support structure facilitates coupling of plurality of lenses to system cover. Each chip comprises a feeder array that further comprises a plurality of antenna elements that are positioned at a proximal distance from base of a lens, A distribution of a gain of input RF signals is substantially equalized across plurality of antenna elements.

Abstract: A wireless communications system includes a first transceiver with a first phased array antenna panel having horizontal-polarization receive antennas and vertical-polarization transmit antennas, where the horizontal-polarization receive antennas form a first receive beam based on receive phase and receive amplitude information provided by a first master chip, the vertical-polarization transmit antennas form a first transmit beam based on transmit phase and transmit amplitude information provided by the first master chip.

Abstract: A communication device includes a system board that includes a plurality of chips. Each chip in plurality of chips includes a plurality of antennas. A system board cover coupled to system board includes a plurality of lenses. Each lens is configured to cover an antenna of plurality of antennas as a radome enclosure. Each lens includes a base and a first tubular membrane coupled to base. A second membrane is coupled to the first tubular membrane. A support structure is coupled to the first tubular membrane. The support structure facilitates coupling of plurality of lenses to system board cover. The system board cover includes a feeder array that includes a plurality of antenna elements that are positioned at a proximal distance from base of a lens and the proximal distance of the system board from the base of the lens is less than a focal length of the lens.

Abstract: A phased array antenna panel includes a first plurality of antennas, a first radio frequency (RF) front end chip, a second plurality of antennas, a second RF front end chip, and a combiner RF chip. The first and second RF front end chips receive respective first and second input signals from the first and second pluralities of antennas, and produce respective first and second output signals based on the respective first and second input signals. The combiner RF chip can receive the first and second output signals and produce a power combined output signal that is a combination of powers of the first and second output signals. Alternatively, a power combiner can receive the first and second output signals and produce a power combined output signal, and the combiner RF chip can receive the power combined output signal.

Abstract: A method in a communication device that includes a system board having a plurality of chips is described. The method includes receiving a lens-guided beam of input radio frequency (RF) signals through a lens, where each chip of the plurality of chip comprises a plurality of antennas, the lens covers a chip of the plurality of chips, adjusting a proximal distance between the lens and the chip such that the proximal distance is less than a focal length of the lens, and substantially equalizing a distribution of a gain from the received lens-guided beam of the input RF signals from a radiation surplus region to a radiation deficient region based on a defined shape of the lens and the proximal distance.

Abstract: A communication device includes a first lens, a feeder array, and control circuitry communicatively coupled to the feeder array. The first lens is associated with a defined shape, which further exhibits a defined distribution of dielectric constant. The feeder array includes a plurality of antenna elements that are positioned in proximity to the first lens. The control circuitry equalizes a distribution of a gain from the received first lens-guided beam of input RF signals across the feeder array and different scan directions of the plurality of antenna elements. The equalized distribution of gain is based on the defined distribution of dielectric constant within the first lens and the proximity of the feeder array to the first lens.