Abstract: The present invention provides systems and methods for facilitating communications between various components of distributed system. Specifically, the systems and methods of the present invention provide a wireless network for linking the various components of manufacturing equipment or manufacturing systems to one or more central control devices. Each component of the manufacturing equipment and the central control devices include a wireless module for handling communications between the components and the control devices. In some embodiments, one or more of the components may act as a server for other components in the network. In some embodiments, multiple data channels are used for communication between the components and the central control devices.

Abstract: The present invention provides systems and methods for facilitating communications between various components of distributed system. Specifically, the systems and methods of the present invention provide a wireless network for linking the various components of manufacturing equipment or manufacturing systems to one or more central control devices. Each component of the manufacturing equipment and the central control devices include a wireless module for handling communications between the components and the control devices. In some embodiments, one or more of the components may act as a server for other components in the network. In some embodiments, multiple data channels are used for communication between the components and the central control devices.

Abstract: The present invention relates to the integration of a TMP with the associated bypass line and valves so that a single sub-assembly is created. The housing of the TMP is significantly modified to accommodate the associated equipment necessary for constructing a high-vacuum system.

Abstract: The present invention is an apparatus and method for controlling pressure, pumping a vacuum and providing abatement for a plurality of vacuum processing chambers. The system may be used in semiconductor manufacture. Multiple vacuum processing chambers are exhausted by turbo pumps into a common abatement chamber, which is maintained at sub-atmospheric pressure by a backing pump. Pressure in the processing chambers is independently controlled. The internal volume of the abatement device provides a buffer that reduces the effect of pressure changes in one processing chamber affecting pressure in the other chambers.

Abstract: The present invention is an apparatus and method for evacuating a number of vacuum processing chambers containing incompatible gases. The gases are directed to a subatmospheric abatement chamber containing preconditioning devices. The gases are treated in the abatement chamber to render them compatible. The compatible gases are then drawn from the abatement chamber as a single stream through a backing pump.

Abstract: The thickness of a silicon wafer (3) within a processing vacuum enclosure (1) is measured or monitored by an optical apparatus (50) via a window (4). The optical apparatus (5) comprises a laser which is tuneable across a range of wavelengths while maintaining a narrow bandwidth. The optical apparatus (5) also includes a detector receiving reflected light. The wavelength variation produces interference effects which are used, by examination of the detector output, to give a measure of thickness or other parameters.

Abstract: This invention relates to the control of etch and deposition processes in the manufacture of semiconductor devices, microelectronic machines (MEMs), and waveguides.

Abstract: A method for quantitatively measuring the characteristic physical parameters of a porous medium, such as an aquifer that is initially recharged at a recharge rate and subsequently discharged at a discharge rate by a pumped fluid utilizing a single well into which a tracer is injected during recharge, and at which the tracer is subsequently detected during discharge. A measurement of the elapsed time, together with a formula based on a convective physical model relating the characteristic parameters to the time measurements is provided.