Patents by Inventor Michael Bossio

Michael Bossio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070045838
    Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
    Type: Application
    Filed: November 2, 2006
    Publication date: March 1, 2007
    Inventors: Martin Weiser, Nancy Dean, Brett Clark, Michael Bossio, Ronald Fleming, James Flint
  • Publication number: 20070045842
    Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
    Type: Application
    Filed: November 2, 2006
    Publication date: March 1, 2007
    Inventors: Martin Weiser, Nancy Dean, Brett Clark, Michael Bossio, Ronald Fleming, James Flint
  • Publication number: 20070045839
    Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
    Type: Application
    Filed: November 2, 2006
    Publication date: March 1, 2007
    Inventors: Martin Weiser, Nancy Dean, Brett Clark, Michael Bossio, Ronald Fleming, James Flint
  • Publication number: 20060201279
    Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
    Type: Application
    Filed: May 5, 2006
    Publication date: September 14, 2006
    Inventors: Martin Weiser, Nancy Dean, Brett Clark, Michael Bossio, Ronald Fleming, James Flint
  • Publication number: 20050018389
    Abstract: A system for connecting a first electrical connector on a printed circuit card with a second electrical connector. The system includes a support member having the printed circuit board connected thereto; a movement device allowing the support member to move in a first direction relative to the second connector; and a float connection between the movement device and the support member allowing the support member to move in a second direction relative to the second connector. The second direction is angled relative to the first direction. The float connection allows the first connector to align with the second connector as the support member is moved in the first direction and the first and second connectors are being connected to each other.
    Type: Application
    Filed: July 24, 2003
    Publication date: January 27, 2005
    Inventor: Michael Bossio